• 제목/요약/키워드: Non-contact Inspection System

검색결과 59건 처리시간 0.026초

선재 공정에서 C-Hook 트래킹을 위한 RFID 시스템 적용에 대한 연구 (A study on application of RFID systems for tracking of C-Hook in the wire rods process)

  • 권영신;이창우;반성준;조현우;김상우
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년 학술대회 논문집 정보 및 제어부문
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    • pp.413-415
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    • 2006
  • Wire rods are carried by C-Hooks and are tracked by bringing the inspection sensors into contact with steel bars on the C-Hooks. However, the conventional system using mechanical equipment is not reliable due to aging, wearing and bending of steel bars. To overcome these problems, a non-contact type identification system is required. This paper introduces the radio frequency identification(RFID) technology which is one of the most popular non-contact identification methods, and evaluates its performance in the real environment of POSCO. Specifically, we use tags which are designed for operating on high temperature and allowing easy attaching and detaching on the C-Hook. A new monitoring program is developed for reacting upon the conventional system and showing the results of reading of reading tags.

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펄스 레이저와 CFPI를 이용한 이종금속 접촉부의 이물질 측정에 관한 연구 (A Study on the Measurement of Foreign Material in Dissimilar Metal Contact Using Pulse Laser and Confocal Fabry-Perot Interferometer)

  • 홍경민;강영준;박락규
    • 비파괴검사학회지
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    • 제33권2호
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    • pp.160-164
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    • 2013
  • 레이저 초음파검사 장치는 레이저 빔을 이용하여 초음파 신호를 발생시키고 측정하는 비접촉식 결함 검사 장치이다. 이 장치는 펄스 레이저 빔을 이용하여 광대역 주파수 범위를 갖는 초음파 신호를 발생시키고 작은 점으로 집속된 레이저 빔을 이용하여 초음파 신호를 측정하므로 우수한 측정 분해능을 제공한다. 본 연구에서는 이종금속 접촉부식(갈바닉 부식) 현상을 레이저를 이용한 비파괴, 비접촉 방법으로 측정하였다. 부식된 부분에 이물질이 혼합되는 경우를 가정하고, 레이저 초음파 실험을 진행하였다. 시편의 뒷면에서 펄스 레이저로 초음파를 발생시키고, 같은 위치의 앞면에서 CW 레이저와 CFPI를 이용하여 초음파 신호를 획득하였다. 이물질이 존재하는 부분의 초음파 신호 특성을 분석하여 이물질의 위치 및 크기를 측정하였다.

ESPI를 이용한 반도체 패키지 내부결함 검사에 관한 연구 (A Study on the Inner Defect Inspection for Semiconductor Package by ESPI)

  • 정승택;김경석;양승필;정현철;이유황
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1442-1447
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    • 2003
  • Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

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Preliminary Study of the Measurement of Foreign Material in Galvanic Corrosion Using Laser Ultrasonic

  • Hong, Kyung Min;Kang, Young June;Park, Nak Kyu;Choi, In Young
    • Journal of the Optical Society of Korea
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    • 제17권4호
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    • pp.323-327
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    • 2013
  • A laser ultrasonic inspection system has the advantage of nondestructive testing. It is a non-contact mode using a laser interferometer to measure the vertical displacement of the surface of a material caused by the propagation of ultrasonic signals with the remote ultrasonic generated by laser. After raising the ultrasonic signal with a broadband frequency range using a pulsed laser beam, the laser beam is focused to a small point to measure the ultrasonic signal because it provides an excellent measurement resolution. In this paper, foreign materials are measured by a non-destructive and non-contact method using the laser ultrasonic inspection system. Mixed foreign material on the corroded part is assumed and the laser ultrasonic experiment is conducted. An ultrasonic wave is generated by pulse laser from the back of the specimen and an ultrasonic signal is acquired from the same location of the front side using continuous wave laser and Confocal Fabry-Perot Interferometer (CFPI). The characteristic of the ultrasonic signal of existing foreign material is analyzed and the location and size of foreign material is measured.

광삼각법에 의한 비접촉식 변위측정계의 설계 (Design of a non-contact type displacement measurement system based on optical triangulation method)

  • 이재윤;김승우
    • 대한기계학회논문집
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    • 제16권6호
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    • pp.1030-1035
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    • 1992
  • 본 연구에서는 측정의 자동화 용도로 사용될 수 있는 광삼각법(optical tria- ngulation method)에 의한 비접촉방식의 광학센서에 대한 기본연구 결과를 서술하였 다. 세부적으로 광삼각 비접촉 측정의 기본원리를 제시하고 측정 범위 및 분해능 관 점에서의 센서설계의 기본방법을 제시하였다. 최종적으로 실제적인 센서의 설계제작 과정과 세제품의 성능실험의 결과를 기술하였다.

검사공정 자동화를 위한 실시간 비전알고리즘 개발 및 응용에 관한 연구 (A Study on Development and Application of Real Time Vision Algorithm for Inspection Process Automation)

  • 백승학;황원준;신행봉;최영식;박대영
    • 한국산업융합학회 논문집
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    • 제19권1호
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    • pp.42-49
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    • 2016
  • This study proposes a non-contact inspective technology based robot vision system for Faulty Inspection of welding States and Parts Shape. The maine focus is real time implementation of the machining parts' automatic inspection by the robotic moving. For this purpose, the automatic test instrument inspects the precision components designator the vision system. pattern Recognition Technologies and Precision Components for vision inspection technology and precision machining of precision parts including the status and appearance distinguish between good and bad. To perform a realization of a real-time automation integration system for the precision parts of manufacturing process, it is designed a robot vision system for the integrated system controller and verified the reliability through experiments. The main contents of this paper, the robot vision technology for noncontact inspection of precision components and machinery parts is useful technology for FA.

효과적인 크랙 검사 자동화 장치를 위한 기반 기술 연구 (Research on Foundation Technology for Crack Inspection Automation Device with Effective Performance)

  • 최군호
    • 반도체디스플레이기술학회지
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    • 제18권4호
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    • pp.143-148
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    • 2019
  • Numerous pipe lines can be found on various plant-based industrial sites. These pipelines should be periodically checked for defects. Most of these pipelines are internally inaccessible and difficult to visually inspect. Therefore, the inspection is being carried out with the help of non-contact inspection equipment such as ultrasonic flaw detection equipment. The use of ultrasonic flaw detection equipment can raise time and efficiency issues. In order to solve this problem, we will study the basic technology necessary for the development of automated inspection system equipped with ultrasonic measuring equipment and verify the validity through the fabrication of the demonstration device.

터널의 비접촉 이동식 상태점검 장비: 리뷰 (Non-contact mobile inspection system for tunnels: a review)

  • 이철희;김동규
    • 한국터널지하공간학회 논문집
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    • 제25권3호
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    • pp.245-259
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    • 2023
  • 본 논문의 목적은 국내외 터널 스캐닝 시스템들을 분석하여 비접촉 이동식 상태점검 장비 개발에 대한 시사점을 도출하기 위한 것이다. 국내외 터널 스캐닝 시스템은 레이저 스캔과 이미지 스캔의 두 가지 기술로 개발되고 있다. 레이저 스캐닝 장비는 포인트 클라우드로부터 터널 라이닝의 기하하적 특성을 재현하는데 장점이 있다. 이미지 스캐닝 장비는 컴퓨터 비전을 활용하여 터널 라이닝 표면의 미세한 균열, 누수 등 손상 검출이 용이하다. 터널 라이닝의 손상 검출을 위해서는 이미지 스캐닝 장비가 더 적합할 것으로 분석되었다. 향후 개발 예정인 카메라 기반의 터널 스캐닝 시스템은 조명, 저장장치, 전원 공급 장치 및 차량 주행 속도 동기화 제어 장치로 구성되어야 할 것이다.

Micro-Factory 공정간 마이크로 부품 검사 프로브 개발 (Development of Optical Probe to Inspect Micron Scale Part in Micro-Factory)

  • 김기홍;이득우
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2005년도 춘계학술대회 논문집
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    • pp.424-428
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    • 2005
  • This paper shows a non-contact optical method to inspect micron scale parts which will be manufactured in micro-factory system. This inspection system should have some characteristics like a small size, flexibility, and high measuring speed. In the viewpoint of measuring capabilities, it also has resolution under micron scale with measuring range over millimeter scale. Two methods will be presented in this paper, one is Moire and the other is white-light scanning interferometry. Also some experimental results will be presented to show the possibilities of the proposed inspection system.

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CAD 모델 기반 비접촉 기상 측정에 관한 연구 (Non-contacting OMM (On Machine Measurement) based on CAD Model)

  • 권세진;이정근;박정환;고태조;김선호
    • 한국정밀공학회지
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    • 제20권11호
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    • pp.134-141
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    • 2003
  • An industrial product is designed and fabricated, followed by the inspection process in order to check whether it is dimensionally tolerable or not. The machining process produces a part such as a mold or die, in which the three-dimensional coordinate might be measured by a CMM (Coordinate Measuring Machine) for assessment of its dimension. It is not ignorable, however, that a CMM measurement requires a lot of operating time and cost, which has led to many studies on the OMM system. The OMM system can be categorized into contact and non-contact types, and each of which has its own strengths and weaknesses. Non-contacting types generally utilize structured lights, sounds or magnetic fields. Though they show rather poor performance in positional accuracy, the measuring speed is faster than the contacting probes. This paper presents the development of an OMM system based on a non-contacting laser displacement sensing apparatus and CAD model. The system is composed of software modules of center-aligning and measuring, which has been operated and verified on a NC machining center on a shop floor.