• Journal of the Korean institute of surface engineering
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• v.41 no.5
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• pp.240-244
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• 2008

Composite plating is a method of co-deposition of plating layer with metallic and/or non-metallic particles to improve the plating layer properties such as high corrosion resistance and photolysis of organic compounds. The properties of nickel-ceramic composite plating are significantly depend on the surface characteristics of co-deposited particles as well as the quantity in electrolyte. In this study, Ni-$TiO_2$ composite coating layer was produced by electrodeposition technique from non-aqueous eletrolyte and its surface characteristics as well as photolytic properties were investigated. The amounts of immobilized $TiO_2$ particles increased with increasing the initial $TiO_2$ particles contents in the bath. Samples electroplated with the current density of $0.5\;A/dm^2$ showed the significantly improved homogeneous $TiO_2$ particles distribution. The corrosion resistance of Ni-$TiO_2$ composite coating layer also improved with increaing the amounts of $TiO_2$ particles. Etched sample showed about 10% increased photolytic rate of organic matter compare to that of the non-etched.

• Journal of the Korean institute of surface engineering
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• v.24 no.3
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• pp.169-176
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• 1991

The pros and cons of deposition metals, alloys and compounds from organic, inorganic and molten salt non-aqueous plating baths are discussed. Although some metals, alloys and compounds not obtainable otherwise can be deposited, few commercial processes exist. Widespread use is limited by the cost, complexity, and hazards associated with non-aqueous electrolytes, coupled with the relatively small markets for many of these coatings.

• Journal of the Korean Institute of Gas
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• v.26 no.3
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• pp.21-26
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• 2022

Zinc is emerging as a environment-friendly plating material to replace cadmium, which is harmful to the human body, to prevent hydrogen gas penetration or release from metal materials. Electroplating of Zn and Zn alloys, which is usually performed in an aqueous acidic atmosphere, has disadvantages such as low coulombic efficiency, corrosion, and hydrogen release, resulting in industrial use difficult. In this study, a deep-eutectic solvent was synthesized using choline chloride and ethylene glycol. Using this as a solvent, an electrolyte for Zn plating was prepared, and then zinc was plated on the STS 304 substrate. The surface microstructure and roughness were observed using SEM and AFM. The crystal structure of the electro-plated film was analyzed using XRD. Finally, the preventing effects of hydrogen release through Zn-based deep-eutectic plating on the STS 304 substrate were compared with the uncoated substrate.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.269-274
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• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.17-32
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• 2002

Electroplating methods by molten salts and non-aqueous melts were employed for aluminium coating on STS 316L stainless steel. After coated with Ni or non-coated surface on stainless steel, Al pulse plating was carried out in two different types of electrolytes at room temperature. The Al layer from $AlCl_3$-TMPAC melts could not obtain appreciable thickness for engineering application due to chemical reactions between deposits and moisture of air. However, The Al coating by pulse plating in the Ethylbenzene-Toluene-$AlBr_3$ systems was found to be solid coating layer with a few $\mu\textrm{m}$ scale. The conductivity of Ethylbenzene-Toluene-$AlBr_3$ electrolyte was as functions of time and agitation. By seven days exposure after mixing of the electrolyte, Al-deposited layer shows uniform and near by pore-free with high current density (higher than 30mA/$\textrm{cm}^2$). The roughness and imperfection of coating layer were decreased with a increasing agitation speed. It was found that the optimum condition for the Al pulse plating on the 316L stainless steel was a 400mA peak current, duty cycle, $t_{on}$ $t_{ off}$=3ms/1ms, and a current density of 30mA/$\textrm{cm}^2$.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1225-1226
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• 2006

Particles of high strength material when coated with silver offer a means of obtaining desirable electrical properties and high strength. The coating process employed aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives were also applied. The reduction and subsequent deposition of silver occurred selectively on the surface of the tungsten particles. The morphologies of the coated particles were assessed by SEM imaging. The silver was uniformed coated on tungsten powder and its thickness was estimated to be approximately 100nm on the basis of a mass account.

• Resources Recycling
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• v.11 no.2
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• pp.3-13
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• 2002

The characteristics of cyanide decomposition in aqueous phase by hydrogen peroxide have been explored in an effort to develop a process to recycle waste water. The self-decomposition of $H_2O$$_2$at pH 10 or below was minimal even in 90 min., with keeping about 90% of $H_2O$$_2$undissociated. On the contrary, at pH 12 only 9% of it remained during the same time. In the presence of copper catalyst at 5 g Cu/L, complete decomposition of $H_2$O$_2$was accomplished at pH 12 even in a shorter time of 40 min. The volatility of free cyanide was decisively dependent on the solution pH: the majority of free cyanide was volatilized at pH 8 or below, however, only 10% of it was volatilized at pH 10 or above. In non-catalytic cyanide decomposition, the free cyanide removal was incomplete in 300 min. even in an excessive addition of $H_2$$O_2$at a $H_2$$O_2$/CN molar ratio of 4, with leaving behind about 8% of free cyanide. On the other hand, in the presence of copper catalyst at a Cu/CN molar ratio of 0.2, the free cyanide was mostly decomposed in only 16 min. at a reducedH202/CN molar ratio of 2. Ihe efnciency of HBO2 in cyanide decomposition decreased with increasing addition of H2O2 since the seu-decomposition rate of $H_2$$O_2$increased. At the optimum $H_2$$O_2$/mo1ar ratio 0.2 of and Cu/CN molar ratio of 0.05, the free cyanide could be completely decomposed in 70 min., having a self-decomposition rate of 22 mM/min and a H$_2$$O_2$ efficiency of 57%.