• 품질경영학회지
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• 제42권2호
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• pp.179-187
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• 2014

Purpose: Since several problems were found when present non-conducting metal coating process was applied to mass production, we study and develop to improve those problems. Methods: In this paper, a couple of analysis methods such as surface hardness, XPS spectrum analysis, morphology, and reflection ratio were used. Results: This paper suggest a new possibility of Non-conducting thin metal coating method that has quality of mass production phase without UV coating process. Conclusion: By the result of analysis, we can set optimized process conditions of the electro deposition coating using electron beam.

• 한국학교보건학회지
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• 제16권1호
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• pp.67-80
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• 2003

The purpose of this study was to find out differences between nursing teachers and non-nursing teachers in sex education, to offer the degree of conducting sex education and teachers' perceptions of teaching ability The subjects were 291 middle and high school teachers in Busan from June 25 to July 22, 2002. The results of this study are as follows. 1. According to the survey of 22 items relating to the degree of conducting sex education, the average of nursing teachers(2.87) was higher than that of non-nursing teachers(2.69). This finding showed that there was a significant difference between both groups(p<.05). 2. According to the survey of 22 items relating to teaching abilities, the average of nursing teachers(2.88) was higher than that of non-nursing teachers(2.63). There was also a significant difference between both groups(p<.01). According to the results of the study, I make the following suggestions. 1. Sex education should be adopted as a regular course and conducted as a school health program in regular curriculum. 2. Compared with non-nursing teachers, nursing teachers conducted sex education frequently and efficiently and their perception of sex education was higher. Therefore, the school policy which requires that sex education should be conducted by nursing teachers only is to be established.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국재료학회지
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• 제10권3호
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• pp.184-190
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• 2000

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

• Journal of electromagnetic engineering and science
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• 제12권1호
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• pp.128-134
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• 2012

In this manuscript, we consider electromagnetic imaging of perfectly conducting cracks completely hidden in a homogeneous material via boundary measurements. For this purpose, we carefully derive a topological derivative formula based on the asymptotic expansion formula for the existence of a perfectly conducting inclusion with a small radius. With this, we introduce a topological derivative based imaging algorithm and discuss its properties. Various numerical examples with noisy data show the effectiveness and limitations of the imaging algorithm.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.193-197
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• 2001

This study was carried out to recover gold, silver and other valuable metals from the printed circuit boards (PCB) of waste computers. PCB samples were crushed to under 1mm by a shredder and initially separated into 30% conducting and 70% non-conducting materials by an electrostatic separator. The conducting materials, which contained the valuable metals, were then used as the feed material for magnetic separation where it was found that 42% was magnetic and 58% non- magnetic. The non-magnetic materials contained 0.227mg/g Au and 0.697mg/g Ag. Further leaching of the non-magnetic component using 2.0M sulfuric acid and 0.2M hydrogen peroxide at 85$^{\circ}C$ extracted more than 95% copper, iron, zinc, nickel and aluminium. Au and Ag were not extracted in this solution, however, more than 95% of Au and 100% of Ag were selectively leached with a mixed solvent (0.2M ammonium thiosulfate, 0.02M copper sulfate, 0.4M ammonium hydroxide). Finally, the residues were reacted with a NaCl solution to leach out Pb while sulfuric acid was used to leach out Sn. Recoveries reached 95% and 98% in solution, respectively.

• 한국산학기술학회논문지
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• 제4권3호
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• pp.209-213
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• 2003

Polyaniline (PANi) composite particles were synthesized by chemical oxidation polymerization of aniline in presence of poly-n-isopropyl acryl amide (PNIPAM). The PANi particles formed in the reaction medium deposited onto non-conducting PNIPAM template to produce PANi-coated composite particles. The formation of composite was confirmed by FT-IR spectroscopy, and UV-VIS spectroscopy, and their morphological structures were examined by scanning electron microscopy (SEM). From the experimental results, it was determined that PANi was successfully coated onto non-conducting PNIPAM.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2003년도 춘계학술발표논문집
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• pp.334-336
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• 2003

Polyaniline(PANi) composite panicles were synthesized by chemical oxidation polymerization of aniline in presence of Poly-N-Isopropyl acryl amide(PNIPAM). The PANi panicles are formed in the reaction medium deposited onto non-conducting PNIPAM template to produce PANi-coated composite panicles. The formation of composite was confirmed by FT-IR spectroscopy, and UV-VIS spectroscopy, and their morphological structures were examined by scanning electron microscopy(SEM). From the experimental results, it was determined that PANi was successfully coated onto non-conducting PANIPAM.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제6권2호
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• pp.63-73
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• 2002

The influence of unsteady boundary layer magnetohydrodynamic flow with thermal relaxation of perfectly conducting fluid, past a semi-infinite plate, is considered. The governing non linear partial differential equations are solved using the method of successive approximations. This method is used to obtain the solution for the unsteady boundary layer magnetohydrodynamic flow in the special form when the free stream velocity exponentially depends on time. The effects of Alfven velocity $\alpha$ on the velocity is discussed, and illustrated graphically for the problem.