• 한국재료학회지
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• 제9권12호
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• pp.1170-1175
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• 1999

반도체 폐 Si슬러지를 이용하여 질화반응 및 post-sintering을 통해 제조된 질화규소세라믹의 미세조직 및 기계적 특성을 광학현미경, SEM 및 XRD를 이용하여 연구하였다. 상당량의 $SiO_2$ 비정질상을 포함하는 폐 Si분말에서 많은 microcracks이 관찰되었다. 폐 슬러지를 사용한 Si 성형체의 질화율은 상용되고 있는 Si분말을 이용한 성형체의 값에 비해 낮은 값을 보였다. 그러나 질화온도가 증가함에 따라 질화율은 증가하였으며 1470$^{\circ}C$에서 질화율은 98%를 보였다. 반응소결체내에 존재하는 $Si_3N_4$의 결정은 ${\alpha}$와 ${\beta}$상으로 혼재되어 있으며 상당량의 산질화규소상이 검출되었다. 1950$^{\circ}C$에서 후처리된 시료의 최대파괴인성 및 파괴강도 값은 각각 5.6 $^MPa{\cdot}m^{1/2}$과 497 MPa로 H. C. Starck사의 Si을 이용한 것에 비해 낮은 값을 보였으며 이는 산질화규소 형성에 기인한 것으로 사료된다.

• 한국결정학회지
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• 제8권2호
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• pp.81-88
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• 1997

GaN와 $NH_3$를 source gas로 사용하여 (0001) sapphire 기판에 CVPE(Chloride Vapor Epitaxy)방법으로 GaN 박막을 성장시킨후 그 특성을 조사하였다. 성장온도 $970^{\circ}C$ 부터 $1040^{\circ}C$ 영역에서 source gas의 유량비를 변화하면서 최적증착조건을 구현하였고, GaN증착이전에 $NH_3$ 가스로써 질화전처리를 하였다. 수행된 실험조건범위내에서 최적증착조건은 증착온도 $1040^{\circ}C$에서 질화전 처리 3분으로 III/V source gas의 유량비율이 2일 때 였으며, 이때의 XRD분석에서의 FWHM값은(0001) peak에서 약 0.32deg를 나타내었다. GaN박막성장속도는 이때 약 $1040^{\circ}C$였다.

• 한국세라믹학회지
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• 제22권1호
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• pp.53-59
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• 1985

Experiments related to nitriding silicon with addition of $Si_3N_4$ have provided information on the effects of such inclusion on the phase relationships of Reaction Bonded Silicon Nitride. In the current work specimens containing 0-25wt% Si3N4 which have 55.5wt% $\alpha$ 4.5wt% $eta$, 40wt% amorphous phase were nitrided for 7-20 hours at 1300-135$0^{\circ}C$ The evaluation of nitridation was per-formed by means of $\alpha$-and $\beta$-phase contents determination in nitrided specimens, In order to observe nitrided region between silicon and silicon nitride scanning electron microscopy was used to study reacted region between silicon and silicon nitride particle. For this purpose semiconductor-grade silicon wafer single crystal was used as a silicon source. The incorporation of small amount of $Si_3N_4$ powder is contributed to enhancing the rate of formation of $\alpha$-phase.

• 한국세라믹학회지
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• 제28권6호
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• pp.465-470
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• 1991

AlN powder was synthesized by carbothermal reduction and nitridation of aluminum hydroxides precipitated in 5∼11 pH range from Al2(SO4)3$.$18H2O aqueous solution. Nitridation reactivity of hydroxide, which depends on precipitation pH, reaction temperature and time, was examined by XRD analysis at 1200∼1350$^{\circ}C$ and compared with that of commercial ${\alpha}$-Al2O3. Hydroxides obtained at higher pH could be more easily nitridated and, considering DTA/TG and BET results, the reason seems to be specific surface area difference of reactants depending on the content of decomposed structural water and the transition rate from transition-Al2O3 to ${\alpha}$-Al2O3.

• 한국재료학회지
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• 제15권5호
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• pp.348-352
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• 2005

Gallium oxyhydroxide (GaOOH) powders were heat-treated in a flowing ammonia gas to form GaN, and the reaction kinetics of the oxide to nitride was quantitatively determined by X-ray diffraction analysis. GaOOH turned into intermediate mixed phases of $\alpha-\;and\;\beta-Ga_2O_3$, and then single phase of GaN. The reaction time for full conversion $(t_c)$ decreased as the temperature increased. There were two-types of rapid reaction processes with the reaction temperature in the initial stage of nitridation at below $t_c$, and a relatively slow processes followed over $t_c$ does not depends on temperatures. The nitridation process was found to be limited by the rate of an interfacial reaction with the reaction order n value of 1 at $800^{\circ}C$ and by the diffusion-limited reaction with the n of 2 at above $1000^{\circ}C$, respectively, at below $t_c$. The activation energy for the reaction was calculated to be 1.84 eV in the temperature of below $830^{\circ}C$, and decreased to 0.38 eV above $830^{\circ}C$. From the comparative analysis of data, it strongly suggest the rate-controlling step changed from chemical reaction to mass transport above $830^{\circ}C$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1996년도 제11회 학술발표회 논문개요집
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• pp.40-41
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• 1996

Nitridation technique has been receiving much attention for the formation of a thin nitrided buffer layer on which high quality nitride films can be formedl. Particularly, gallium nitride (GaN) has been considered as a promising material for blue-and ultraviolet-emitting devices. It can also be used for in situ formed and stable passivation layers for selective growth of $GaAs_2$. In this work, formation of a thin nitrided layer is investigated. Nitrogen electron cyclotron resonance(ECR)-plasma is employed for the formation of thin nitrided layer. The plasma source used in this work is a compact ECR plasma gun3 which is specifically designed to enhance control, and to provide in-situ monitoring of plasma parameters during plasma-assisted processing. Microwave power of 100-200 W was used to excite the plasma which was emitted from an orifice of 25 rnm in diameter. The substrate were positioned 15 em away from the orifice of plasma source. Prior to nitridation is performed, the surface of n-type (001)GaAs was exposed to hydrogen plasma for 20 min at $300{\;}^{\circ}C$ in order to eliminate a native oxide formed on GaAs surface. Change from ring to streak in RHEED pattern can be obtained through the irradiation of hydrogen plasma, indicating a clean surface. Nitridation was carried out for 5-40 min at $RT-600{\;}^{\circ}C$ in a ECR plasma-assisted molecular beam epitaxy system. Typical chamber pressure was $7.5{\times}lO^{-4}$ Torr during the nitridations at $N_2$ flow rate of 10 seem.(omitted)mitted)

• 한국재료학회지
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• 제22권10호
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• pp.539-544
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• 2012

We have grown AlN nanorods and AlN films using plasma-assisted molecular beam epitaxy by changing the Al source flux. Plasma-assisted molecular beam epitaxy of AlN was performed on c-plane $Al_2O_3$ substrates with different levels of aluminum (Al) flux but with the same nitrogen flux. Growth behavior of AlN was strongly affected by Al flux, as determined by in-situ reflection high energy electron diffraction. Prior to the growth, nitridation of the $Al_2O_3$ substrate was performed and a two-dimensionally grown AlN layer was formed by the nitridation process, in which the epitaxial relationship was determined to be [11-20]AlN//[10-10]$Al_2O_3$, and [10-10]AlN//[11-20]$Al_2O_3$. In the growth of AlN films after nitridation, vertically aligned nanorod-structured AlN was grown with a growth rate of $1.6{\mu}m/h$, in which the growth direction was <0001>, for low Al flux. However, with high Al flux, Al droplets with diameters of about $8{\mu}m$ were found, which implies an Al-rich growth environment. With moderate Al flux conditions, epitaxial AlN films were grown. Growth was maintained in two-dimensional or three-dimensional growth mode depending on the Al flux during the growth; however, final growth occurred in three-dimensional growth mode. A lowest root mean square roughness of 0.6 nm (for $2{\mu}m{\times}2{\mu}m$ area) was obtained, which indicates a very flat surface.

• 한국분말재료학회지
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• 제28권3호
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• pp.259-266
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• 2021

The (Ga_1-xZn_x)(N_1-xO_x) solid solution is attracting extensive attention for photocatalytic water splitting and wastewater treatment owing to its narrow and controllable band gap. To optimize the photocatalytic performance of the solid solution, the key points are to decrease its band gap and recombination rate. In this study, (Ga_1-xZn_x)(N_1-xO_x) nanofibers with various Zn fractions are prepared by electrospinning followed by calcination and nitridation. The effect of the composition and crystallinity of electrospun oxide nanofibers on the morphology and optical properties of the obtained solid-solution nanofibers are systematically investigated. The results show that the final shape of the (Ga_1-xZn_x) (N_1-xO_x) material is greatly affected by the crystallinity of the oxide nanofibers before nitridation. The photocatalytic properties of (Ga_1-xZn_x)(N_1-xO_x) with different Ga:Zn atomic ratios are investigated by studying the degradation of rhodamine B under visible light irradiation.

• 대한화학회지
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• 제32권3호
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• pp.267-275
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• 1988

$Al(OC_3H_7)_3$ 및 $Si(OC_2H_5)_4$, 알콕사이드를 합성하고 그 물질을 각각 또는 혼합가수분해하여 $Al_2O_3,\;SiO_2,\;Al_2O_3-SiO_2$계의 물질을 얻고 $Al_2O_3-SiO_2$계에 환원제로서 carbon black을 혼합하여 $N_2$분위기에서 환원질화반응시켜 고순도의 ${\beta}-sialon$ 초미분말을 합성하였다. 가수분해 과정에서는 반응조건이 가수분해반응에 미치는 영향을 알아보았고, 환원질화반응 과정에서는 중간생성물을 분석하여 반응경로를 추정하고 ${\beta}-sialon$의 생성반응에 대한 동력학적 고찰을 하였다.

• 자원리싸이클링
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• 제25권5호
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• pp.75-83
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• 2016

탄소환원질화법을 이용하여 질화알루미늄(Aluminum Nitride: AlN)을 제조하는 연구를 배치당 0.7 ~ 1.5 kg 규모로 규모 확대하여 수행하였다. 고품위 알루미나 분말과 탄소(carbon black)를 배합하여 흑연 도가니에 장입하고, 노내 진공도 $2.0{\times}10^{-1}Torr$에서 온도($1,550{\sim}1,750^{\circ}C$), 시간(0.5 ~ 4 hr), $N_2$유량($10{\sim}40{\ell}/min$)을 변화시키면서 AlN을 합성하였다. 실험결과 합성온도 $1,700{\sim}1,750^{\circ}C$, 합성시간 3시간, 질소유량 $40{\ell}/min$가 적정 조건이었다. 또한, 합성한 AlN에 잔존하는 탄소를 제거하기 위하여 관상로에서 온도 $650-750^{\circ}C$, 1 - 2시간 범위에서 탈탄을 시킨 결과, 알루미나와 탄소 몰배합비 1 : 3.2 로 합성한 시료를 대기 분위기에서 탈탄온도 $750^{\circ}C$, 관상로의 회전속도 1.5 rpm에서 2시간 탈탄하는 것이 적정조건이었다. 시험 제조한 AlN의 성분 분석 결과 C 함량 835 ppm, O 함량 0.77%으로서 순도 99% 이상의 고품위 제품을 제조할 수 있었다.