• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.20 no.4
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• pp.383-398
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• 2022

The electrochemical behavior was investigated during the electrolysis of nickel oxide in LiCl-Li₂O salt mixture at 650℃ by changing several components. The focus of this work is to improve anode design and shroud design to increase current densities. The tested components were ceramic anode shroud porosity, porosity size, anode geometry, anode material, and metallic porous anode shroud. The goal of these experiments was to optimize and improve the reduction process. The highest contributors to higher current densities were anode shroud porosity and anode geometry.

• Korean Journal of Materials Research
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• v.3 no.5
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• pp.521-528
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• 1993

Ni-graphi~e composite powders were prepared by reduct ion of $Ni^{++}$ from arnmoniacal nickel sulfate solution on graphite core by hydrogen gas at elevated temperature and pressure. Effect of coating catalyst. Anthraquinone $(C_6H_4COC_6H_4 CO)$, on the reduction rate and the properties of nickel layer were investigated by SEM, X-ray, size and chemical analysis. 1nduct.ion period, a time lag between the ~njection of hydrogen gas and the start of the reduction, was 22 to 70 mins and was affected by the size and amount of Anthraquinone. Kickel layer deposited on the surface of graphite core material was composed of nickel nodules whose sizes were different with vari~ ous reduction conditions. Minimum diameter of nickel nodules was about 2-3$\mu \textrm m$.

• Journal of the Mineralogical Society of Korea
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• v.23 no.3
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• pp.191-197
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• 2010

Fine nickel metal powder of uniform morphology, narrow size distribution, and high purity was prepared from high purity metal solution. Slurry reduction method for the synthesis of metal powder was applied with a special interest in their fine and spherical shape. The products were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD). Well dispersed ultrafine nickel powder with the particle size range of 100~200 nm was produced from Ni-hydrazine precursor using hydrazine as a reductant for 90 min reaction in 4.5 M NaOH solution.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.276.2-276.2
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• 2016

Dye-sensitized solar cells (DSCs) are promising candidates for light-to-energy conversion devices due to their low-cost, easy fabrication and relative high conversion efficiency. An important component of DSCs is counter electrode (CE) collect electrons from external circuit and reduct I3- to I-. The conventional CEs are thermally decomposed Pt on fluorine-doped tin oxide (FTO) glass substrates, which have shown excellent performance and stability. However, Pt is not suitable in terms of cost effect. In this report, we demonstrated that nickel sulfide thin films by atomic layer deposition (ALD)-using Nickel(1-dimethylamino-2-methyl-2-butanolate)2 and hydrogen sulfide at low temperatures of $90-200^{\circ}C$-could be good CEs in DSCs. Notably, ALD allows the thin films to grow with good reproducibility, precise thickness control and excellent conformality at the angstrom or monolayer level. The nickel sulfide films were characterized using X-ray photoelectron spectroscopy, scanning electron microscopy, X-ray diffraction, hall measurements and cyclic voltammetry. The ALD grown nickel sulfide thin films showed high catalytic activity for the reduction of I3- to I- in DSC. The DSCs with the ALD-grown nickel sulfide thin films as CEs showed the solar cell efficiency of 7.12% which is comparable to that of the DSC with conventional Pt coated counter electrode (7.63%).

• Journal of Korea Foundry Society
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• v.35 no.1
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• pp.8-14
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• 2015

Variations of nickel contents and microstructures in molten magnesium alloys on the addition of aluminum, zirconium, and manganese have been investigated. Specimens were prepared by melting under $SF_6$ and $CO_2$ atmosphere and casting into a disc of 29 mm diameter with 7~10 mm thickness from the melt acquired at the top of crucible. Before casting, the molten metal was stirred for 3 minutes after each addition of alloying elements and maintained for 30 minutes for settling down. Results showed that zirconium did not significantly affect the content of nickel while aluminum remarkably reduced it by forming $Al_3Ni_2$ phase. When manganese are added to Mg-1wt%Ni alloy along with aluminum, both elements remarkably reduced the content of nickel. The addition of 1.5 wt% manganese to Mg-1wt%Ni alloy containing aluminum further reduced the content of nickel by more than 30%, during which an additional intermetallic phase $Al_{10}Mn_3Ni$ was precipitated in the molten magnesium.

• Bulletin of the Korean Chemical Society
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• v.20 no.7
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• pp.773-774
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• 1999

• Bulletin of the Korean Chemical Society
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• v.14 no.5
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• pp.543-545
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• 1993

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.283-288
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• 2010

Nanosized NiO powder was prepared by mixing an acid nickel salt and a base nickel salt and their reduction behavior was studied. Ni formate was employed as an acid salt and nickel hydroxide and basic nickel carbonate as base salts. One equivalent acid salt was mixed with 9 equivalent base salt. The mixture of the formate and the carbonate produced ~100 run spherical NiO powder by heat treatment at $750^{\circ}C$/2 h, but the mixture of the formate and the hydroxide gave rise to ~100 nm pseudo spherical NiO powder by heat treatment at $600^{\circ}C$/2 h and grew fast to give pseudo cubic crystals of 100~600 run by heat treatment at $750^{\circ}C$/2 h. Reduction by hydrogen gas proceeded much faster for the one with the hydroxide than that with the carbonate to give porous body with well grown necks. Their behavior was studied by analysis of TG/DSC, XRD, and SEM.

• Bulletin of the Korean Chemical Society
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• v.35 no.1
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• pp.305-308
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• 2014

• Transactions on Electrical and Electronic Materials
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• v.9 no.4
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• pp.137-142
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• 2008

The parasitic resistance is studied to silicon/metal contact junction for improving device performance and to lower contact/serial resistance silicide in natural sequence. In this paper constructs the stepwise Ni silicide process for parasitic resistance reduction for silicon/metal contact junction. We have investigated multi-step Ni silicide on SiGe substrate with stepwise annealing method as an alternative to compose more thermally reliable Ni silicide layer. Stepwise annealing for silicide formation is exposed to heating environment with $5^{\circ}C/sec$ for 10 seconds and a dwelling for both 10 and 30 seconds, and ramping-up and the dwelling was repeated until the final annealing temperature of $700\;^{\circ}C$ is achieved. Finally a direct comparison for single step and stepwise annealing process is obtained for 20 nm nickel silicide through stepwise annealing is $5.64\;{\Omega}/square$ at $600\;^{\circ}C$, and it is 42 % lower than that of as nickel sputtered. The proposed stepwise annealing for Ni silicidation can provide the least amount of NiSi at the interface of nickel silicide and silicon, and it provides lower resistance, higher thermal-stability, and superior morphology than other thermal treatment.