• Proceedings of the Petrological Society of Korea Conference
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• 2009.05a
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• pp.26-28
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• 2009

• 한국전기화학회:학술대회논문집
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• 1999.04a
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• pp.76-76
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.112-112
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• 1998

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2017.10a
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• pp.349-350
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• 2017

• Journal of Electrochemical Science and Technology
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• v.13 no.4
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• pp.504-504
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• 2022

• Journal of the Korean institute of surface engineering
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• v.46 no.6
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• pp.235-241
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• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• Korean Journal of Materials Research
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• v.15 no.5
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• pp.301-305
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• 2005

We fabricated nickel silicide layers on whole non-patterned wafers from $p-Si(100)SiO_2(200nm)$/poly-Si(70 nm)mn(40 nm) structure by 40 sec rapid thermal annealing of $500\~900^{\circ}C$. The sheet resistance, cross-sectional microstructure, surface roughness, and phase analysis were investigated by a four point probe, a field emission scanning electron microscope, a scanning probe microscope, and an X-ray diffractometer, respectively. Sheet resistance was as small as $7\Omega/sq$. even at the elevated temperature of $900^{\circ}C$. The silicide thickness and surface roughness increased as silicidation temperature increased. We confirmed the nickel silicides iron thin nickel/poly-silicon structures would be a mixture of NiSi and $NiSi_2$ even at the $NiSi_2$ stable temperature region.

• Advances in materials Research
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• v.1 no.3
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• pp.169-182
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• 2012

In this paper the intrinsic influence of micron-sized nickel particle reinforcements on microstructure, micro-hardness tensile properties and tensile fracture behavior of nano-alumina particle reinforced magnesium alloy AZ31 composite is presented and discussed. The unreinforced magnesium alloy (AZ31) and the reinforced nanocomposite counterpart (AZ31/1.5 vol.% $Al_2O_3$/1.5 vol.% Ni] were manufactured by solidification processing followed by hot extrusion. The elastic modulus and yield strength of the nickel particle-reinforced magnesium alloy nano-composite was higher than both the unreinforced magnesium alloy and the unreinforced magnesium alloy nanocomposite (AZ31/1.5 vol.% $Al_2O_3$). The ultimate tensile strength of the nickel particle reinforced composite was noticeably lower than both the unreinforced nano-composite and the monolithic alloy (AZ31). The ductility, quantified by elongation-to-failure, of the reinforced nanocomposite was noticeably higher than both the unreinforced nano-composite and the monolithic alloy. Tensile fracture behavior of this novel material was essentially normal to the far-field stress axis and revealed microscopic features reminiscent of the occurrence of locally ductile failure mechanisms at the fine microscopic level.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.83-86
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• 2005

In this study, SAM (self-assembled monolayer) was applied as an anti-adhesion layer in the nano molding process, to reduce the surface energy between the nano-stamper and the moldeded polymeric nano patterns. Before depositing SAM on the stamper, the nickel stamper was pretreated to remove oxide on the nickel stamper surface. Then, using the solution deposition method, alkanethiol SAM as an anti-adhesion layer was deposited on nickel surface. To examine the effectiveness of the SAM deposition on the metallic nano stamper, the contact angle and the lateral friction force were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. The surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the high hydrophobic quality of SAM on the nickel stamper maintained under the actual molding environments.

• Journal of Electrochemical Science and Technology
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• v.3 no.4
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• pp.178-184
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• 2012

A porous nickel (P-Ni) substrate was prepared by selective leaching of zinc from pressed pellets containing powders of Ni & Zn in 4 M NaOH solution. Anodic deposition of manganese oxide onto the porous Ni substrate ($MnO_x$/P-Ni) formed nano-flakes of manganese oxide layers as revealed in SEM studies. Pseudocapacitance of this oxide electrode was evaluated by cyclic voltammetry (CV) and chronopotentiometry (CHP) in 2 M NaOH solution. The specific capacitance of the Mn oxide electrode was as high as 1515 F $g^{-1}$, which was ten times higher than Mn oxide deposited on a flat Ni-ribbon. 80% of capacity was retained after 200 charge/discharge cycles. The system showed no loss of activity in dry form over period of days. The impedance studies indicated highly conducting $MnO_x$/P-Ni substance and the obtained specific capacitance from impedance data showed good agreement with the charge/discharge measurements.