• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.293-296
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• 2014

Fe-Ni has been of great interest because it is known as one of low thermal expansion alloys as various application areas. This alloy was fabricated by electroforming process, and effect of heat treatment on thermal expansion and hardness was investigated. Nano-crystalline structure of 13.3 - 63.5 nm in size was observed in the as-deposited alloy. To investigate the effect of heat treatment on grain growth and mechanical/thermal properties, we conducted hardness and coefficient of thermal expansion (CTE). From this, we confirmed these properties were varied by heat treatment. In this nano-crystalline alloy, we could observe abnormal behavior in thermal expansion between $350-400^{\circ}C$. Additionally, an abrupt change in hardness has also been observed. However, once the grains grow up to micro-sized the mechanical and thermal properties mentioned above were stabilized similar to those of bulk alloys due to heat treatment.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.45-51
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• 2008

Successive micro-scale V-grooves and a grid of pyramids were machined by elliptical vibration tufting (EVC) to investigate feasibility of using EVC as an alternative method of creating micro-molds to photo-lithography and electroforming, which have been commonly employed. An elliptical vibration grooving machine was developed which consists of two orthogonally-arranged piezoelectric actuators, a diamond cutting tool, and a motorized xyz stage. The micro-scale features were machined on materials of copper, duralumin, nickel, and hastelloy and it was found that EVC significantly reduces cutting resistance and prohibits generation of side burrs and rollover burrs, thus resulting in improving machining qualify of micro-molds in ail experimented workpiece materials.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.236-241
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• 2004

UV-molded microlens arrays with high replication quality were fabricated using a parametric design method. It is important to maximize the replication quality, because one can obtain the replicated micro-optical components with desired properties by accurate control of the shape. In the present study, nickel mold inserts for microlens arrays with lenses having diameters between $3\mu\textrm{m}$ and $230\mu\textrm{m}$ were fabricated by electroforming process. An UV-molding system was designed and constructed, a simple technique to avoid micro-air bubbles was first suggested, and the effects of the compression pressure and UV-curing dose on the replication quality of UV-molded microlens arrays with a diameter of $14\mu\textrm{m}$ were examined experimentally. Finally, geometrical and optical properties of the replicated microlens arrays were measured and analyzed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.63-64
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• 2011

니켈 알러지를 일으키지 않는 전주 부품 개발을 위해 Ni을 대체할 수 있는 전주 소재로 Ni-Fe 합금과 Fe에 대한 전주 공정을 개발하였다. Ni-Fe 합금 전주의 경우 전주품의 표면 내식성 강화를 위해 Cr 나노입자를 이용한 복합전주를 실시하여, Ni 전주품과 내부식성, 니켈 용출 비교 분석 실험을 하였다. 또한 Ni을 완전히 배제하기 위해 새로운 시도로서 순 Fe 전주 공정 기술을 개발하였다. 제조된 Fe 전주품의 내식성 향상을 위한 실리카 코팅 등의 표면처리에 대한 효과도 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.94-97
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• 2008

현재 전주 국내에서는 전주에 대한 관심이 조금씩 증가하는 추세지만 그 활용 영역은 많지 않다. 최근들어 휴대폰 관련 부품과 LCD디스플레이의 핵심부품인 도광판 사출금형에 집중되어 있다. 본 연구에서는 반도체 웨이퍼 절단용 블레이드 제작을 목표로 Ni 전주도금층에 조밀하게 $Al_2O_3$를 분산시키는데 목표를 삼았다. 전주(electroforming)를 이용한 Ni-$Al_2O_3$를 첨가한 설파민산 니켈욕에 Surfactant의 양을 조절하며 Sodium Lauryl Sulfate의 첨가량이 많아질수록 Nickel 전주도금층 표면에 $Al_2O_3$는 접착되어지지 않고, 도금층의 두께는 두꺼워졌다. Surfactant의 첨가로인하여 Ni 전주도금층의 표면 장력이 감소하여 $Al_2O_3$를 감싸고 Ni 전주도금층이 성장하여야하는데 교반하는 과정에서 $Al_2O_3$ 입자들이 용액의 흐름에 따라 떨어져 나갔다.

• Archives of design research
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• v.17 no.4
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• pp.241-250
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• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1376-1381
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• 2012

Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.143-144
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• 2006

In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

• Transactions of the Society of Information Storage Systems
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• v.9 no.1
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• pp.28-31
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• 2013

We proposed a method to fabricate label-free protein sensor with sub-wavelength nanograting structures to be used for diagnosing acute myocardial infarction. A nickel stamp for the injection molding of nanograting integrated protein sensor was fabricated by electroforming process with high fidelity. By using metallic stamp, we replicated label-free protein sensor via injection molding, which is an outstanding method for low-cost and mass production of polymer products. Finally, we performed a feasibility test, examining cardiac troponin T (cTnT) and anti-cTnT interactions. From the results, we demonstrated that the fabricated protein sensor can provide information for the early and accurate detection of cardiac diseases such as acute myocardial infarction.