• Analytical Science and Technology
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• v.5 no.1
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• pp.97-101
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• 1992

Potentiodynamic corrosion tests were conducted to know the corrosion characteristics of the NiTi intermetallic compound composed of pure Ni and Ti in artificial saline. Tafel extrapolation and linear polarization technique show similar results. Corrosion current Icorr and corrosion rate was increased in the order of NiTi

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.267-273
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• 2009

Three types of structural intermetallic compounds, $Ni_3Al$, NiAl and TiAl, having each single phase structure without pores were produced by arc-melting process. Their sliding wear properties were investigated against a hardened tool steel. It was shown that the wear of the intermetallic compounds was hardly occurred against the hardened tool steel. TiAl compound showed the best wear resistance among them. In this case, wear was preferentially occurred on the surface of the hardened tool steel of the mating material which has higher hardness. It could be found that the wear mode on intermetallics without pores by arc-melting process was different from that on its porous layer coated on steel by combustion synthesis.

• Journal of Powder Materials
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• v.3 no.3
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• pp.174-180
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• 1996

Microstructure and phase transformation of mechanically alloyed TiNi powders added to aluminium matrix for enhancing the damping properties were studied. Four compositions between 48.5 and 51.5 at% Ti intermetallic compounds were selected to control the fraction of martensite phase. Mechanically alloyed TiNi powders were heat-treated at vacuum of $10^{-6}$ torr for crystallization. Ball milled AI/TiNi composite powders were swaged at room temperature and rolled at 450 $^{\circ}C$. After mechanical alloying for 10 hours, Ti and Ni elements were alloyed completely and amorphous phase was formed. Amorphous phase was crystallized to martensite (Bl9') and austenite(B2) after heat treating for 1 hour at the temperature of 850 $^{\circ}C$, and TiNi$_3$, intermetallic compound was partially formed. Considerable amount of martensite phase was remained after swaging and rolling.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.3
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• pp.181-187
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• 1997

TiAl intermetallic compound was candidated for the application to the high temperature materials such as a gas turbine exhaust valve in the automobile. However, this material dose not have ductility allowing to machinability to product. To improve the ductility, many researches conduct alloy design and heat treatment methods. We observed that the microstructure of TiAl varied with Ni, Mn elements as well as a heat treatment condition. In the case of Ni element addition, the TiAlNi intermetallic compound was precipitated at the grain boundary. When the heat treatment temperature increased from $1000^{\circ}C$ to $1300^{\circ}C$, the TiAlNi intermetallic compound was uniformly dispersed on the matrix. In the case of Mn element addition, the mixed duplex structure of ${\gamma}$-TiAl and lamellar(TiAl/$Ti_3Al$) was obtained with $1250^{\circ}C$ and $1300^{\circ}C$ heat treatment for 1 hour. When the heat treatment temperature increased from $1250^{\circ}C$ to $1300^{\circ}C$, the lamellar domain of the duplex structure was transformed near-lamellar structure.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.04c
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• pp.34-34
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• 1994

• Corrosion Science and Technology
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• v.6 no.6
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.420-424
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• 2007

Precipitation behavior has been studied in NiTi-based ordered alloy using transmission electron microscopy. The hardness after solution treatment is high in NiTi alloy suggesting the large contribution of solid solution strengthening in this alloy system. However, the amount of age hardening is not large as compared to the large microstructural variations during aging. At the beginning of aging, the $L2_1-type$ $Ni_2AlTi$ precipitates keep a lattice coherency with the NiTi matrix. By longer periods of aging $Ni_2AlTi$ precipitates lose their coherency and change their morphology to the globular ones surrounded by misfit dislocations. Misfit dislocations, which are observed on {100} planes of H-precipitates have the Burgers vector of a <100> with a pure edge type. The lattice misfits of $NiTi-Ni_2AlTi$ system is estimated from the spacings of misfit dislocations to be 1.3% at 1273 K. The lattice misfits decrease with increasing aging temperature in this system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.61-67
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• 2003

The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about $46{\mu}m$ in diameter, was fabricated by using the lift-off method and reflowed using the rapid thermal annealing (RTA) system. The intermetallic compounds were characterized using a secondary electron microscopy (SEM), an energy dispersive spectroscopy (EDS), and an x-ray diffractometer (XRD). The faceted and polygonal intermetallic compounds were found in the Bi-Sn solder bumps on $Au(0.1{\mu}m)/Ni/Ti$ UBM and they were indentified as $(Au_xBi_yNi_{1-x-y})Sn_2$ Phase. The intermetallic compounds grown from the $Au(0.1{\mu}m)/Ni/Ti$ UBMinterface were dispersed in the solder bump.

• Bulletin of the Korean Chemical Society
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• v.27 no.12
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• pp.2045-2050
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• 2006

The interstitial hydrogen bonding in NiTi solid and its effect on the metal-to-metal bond is investigated by means of the EH tight-binding method. Electronic structures of octahedral clusters $Ti_4Ni_2$ with and without hydrogen in their centers are also calculated using the cluster model. The metal d states that interact with H 1s are mainly metal-metal bonding. The metal-metal bond strength is diminished as the new metal-hydrogen bond is formed. The causes of this bond weakening are analyzed in detail.