• 분석과학
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• 제5권1호
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• pp.97-101
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• 1992

순수한 니켈과 티타늄이 같은 양 함유되어 있는 NiTi 금속간 화합물의 인공 생리식염수에서의 부식 특성을 순수한 니켈 및 티타늄과 함께 연구하였다. Tafel 외삽법과 선형 분극법 공히 유사한 결과를 보였으며, 부식 전류 Icorr와 부식 속도는 다음과 같은 순서로 증가하였다. NiTi

• 대한금속재료학회지
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• 제47권5호
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• pp.267-273
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• 2009

Three types of structural intermetallic compounds, $Ni_3Al$, NiAl and TiAl, having each single phase structure without pores were produced by arc-melting process. Their sliding wear properties were investigated against a hardened tool steel. It was shown that the wear of the intermetallic compounds was hardly occurred against the hardened tool steel. TiAl compound showed the best wear resistance among them. In this case, wear was preferentially occurred on the surface of the hardened tool steel of the mating material which has higher hardness. It could be found that the wear mode on intermetallics without pores by arc-melting process was different from that on its porous layer coated on steel by combustion synthesis.

• 한국분말재료학회지
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• 제3권3호
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• pp.174-180
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• 1996

Microstructure and phase transformation of mechanically alloyed TiNi powders added to aluminium matrix for enhancing the damping properties were studied. Four compositions between 48.5 and 51.5 at% Ti intermetallic compounds were selected to control the fraction of martensite phase. Mechanically alloyed TiNi powders were heat-treated at vacuum of $10^{-6}$ torr for crystallization. Ball milled AI/TiNi composite powders were swaged at room temperature and rolled at 450 $^{\circ}C$. After mechanical alloying for 10 hours, Ti and Ni elements were alloyed completely and amorphous phase was formed. Amorphous phase was crystallized to martensite (Bl9') and austenite(B2) after heat treating for 1 hour at the temperature of 850 $^{\circ}C$, and TiNi$_3$, intermetallic compound was partially formed. Considerable amount of martensite phase was remained after swaging and rolling.

• 열처리공학회지
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• 제10권3호
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• pp.181-187
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• 1997

TiAl intermetallic compound was candidated for the application to the high temperature materials such as a gas turbine exhaust valve in the automobile. However, this material dose not have ductility allowing to machinability to product. To improve the ductility, many researches conduct alloy design and heat treatment methods. We observed that the microstructure of TiAl varied with Ni, Mn elements as well as a heat treatment condition. In the case of Ni element addition, the TiAlNi intermetallic compound was precipitated at the grain boundary. When the heat treatment temperature increased from $1000^{\circ}C$ to $1300^{\circ}C$, the TiAlNi intermetallic compound was uniformly dispersed on the matrix. In the case of Mn element addition, the mixed duplex structure of ${\gamma}$-TiAl and lamellar(TiAl/$Ti_3Al$) was obtained with $1250^{\circ}C$ and $1300^{\circ}C$ heat treatment for 1 hour. When the heat treatment temperature increased from $1250^{\circ}C$ to $1300^{\circ}C$, the lamellar domain of the duplex structure was transformed near-lamellar structure.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1994년도 춘계학술대회강연 및 발표대회 강연및 발표논문 초록집
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• pp.34-34
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• 1994

• Corrosion Science and Technology
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• 제6권6호
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• 한국재료학회지
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• 제17권8호
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• pp.420-424
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• 2007

Precipitation behavior has been studied in NiTi-based ordered alloy using transmission electron microscopy. The hardness after solution treatment is high in NiTi alloy suggesting the large contribution of solid solution strengthening in this alloy system. However, the amount of age hardening is not large as compared to the large microstructural variations during aging. At the beginning of aging, the $L2_1-type$ $Ni_2AlTi$ precipitates keep a lattice coherency with the NiTi matrix. By longer periods of aging $Ni_2AlTi$ precipitates lose their coherency and change their morphology to the globular ones surrounded by misfit dislocations. Misfit dislocations, which are observed on {100} planes of H-precipitates have the Burgers vector of a <100> with a pure edge type. The lattice misfits of $NiTi-Ni_2AlTi$ system is estimated from the spacings of misfit dislocations to be 1.3% at 1273 K. The lattice misfits decrease with increasing aging temperature in this system.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• 마이크로전자및패키징학회지
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• 제10권2호
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• pp.61-67
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• 2003

고집적 플립 칩 기술을 위한 $50{\mu}m$ 직경의 극미세 58Bi-42Sn 솔더 범프와 Au/Ni/Ti UBM의 계면 반응에 따른 금속간 화합물을 분석하였다. 증발증착법과 lift-off 방법으로 극미세 Bi-Sn 솔더 범프를 형성하고 급속열처리 장비를 이용하여 리플로 공정을 실시하였다. 리플로 공정에서의 냉각속도를 변화시키면서 제작한 솔더 범프의 표면과 단면을 주사전자현미경으로 관찰하였다 $Au(0.1{\mu}m)$/Ni/Ti UBM 위의 극미세 58Bi-42Sn 솔더 범프의 표면과 내부에서 facet 특성을 갖는 다각형의 금속간 화합물들이 다수 관찰되었다. 주사전자현미경의 EDS 분석과 X-선 회절분석으로 확인한 결과 이 금속간 화합물은 $(Au_xBi_yNi_{1-x-y})Sn_2$상임을 확인하였다.

• Bulletin of the Korean Chemical Society
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• 제27권12호
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• pp.2045-2050
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• 2006

The interstitial hydrogen bonding in NiTi solid and its effect on the metal-to-metal bond is investigated by means of the EH tight-binding method. Electronic structures of octahedral clusters $Ti_4Ni_2$ with and without hydrogen in their centers are also calculated using the cluster model. The metal d states that interact with H 1s are mainly metal-metal bonding. The metal-metal bond strength is diminished as the new metal-hydrogen bond is formed. The causes of this bond weakening are analyzed in detail.