• 한국자기학회지
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• 제18권1호
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• pp.43-47
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• 2008

[ $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ ] nano-glass를 sol-gel 법으로 제조 하였다. 평균 입자 크기는 60.3 nm였으며 매우 균일한 입도 분포를 가졌다. Nano-glass를 NiZnCu ferrite의 저온소성용 소결조제로 사용하였으며 NiZnCu ferrite에 nano-glass를 첨가한 후 $840{\sim}900^{\circ}C$에서 2시간 소결을 진행하였다. 소결성 및 자기적 특성에 대해 연구하였으며 밀도, 수축율, 초투자율, 품질계수, 및 포 화자화값을 측정하였다. nano-glass를 0.5 wt% 첨가하여 $900^{\circ}C$에서 소결한 토로이달 core 시편의 초투자율은 1 MHz에서 측정 시 193.3의 값을 가졌다. 초투자율과 포화자화값은 소결온도가 증가함에 따라 증가하는 경향을 나타내었다. sol-gel 법에 의해 제조된 $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ nano-glass를 칩인덕터용 NiZnCu ferrite의 저온 소결조제로 사용 가능함을 알 수 있었다.

• 한국분말재료학회지
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• 제11권3호
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Journal of Welding and Joining
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• 제20권6호
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.272-276
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• 2001

Multicomponent $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk matallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state.1) In this study, DSC and X-ray diffractometry have been performed to confirm the amorphous structure of the master $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy. To investigate the mechanical properties and deformation behaviors of the bulk metallic $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$ and at the various initial strain rates from $2{\times}10^{-4}s^{-1}\;to\;2{\times}10^{-2}s^{-1}$. There are two types of nominal stress-strain curves. The one shows linear stress-strain relationship meaning fracture at maximum stress, the other shows plastic deformation including steady-state flow. Also DSC analysis for the compressed specimens has been performed to investigate the change of thermal stability and crystallization behavior for the various test conditions.

• 대한금속재료학회지
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• 제48권8호
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• pp.749-756
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• 2010

Low carbon steels were oxidized isothermally at 1050 and $1180^{\circ}C$ for 4 hr in air in order to determine the effect of alloying elements Si, S, Cu, Sn, and Ni on oxidation. For oxidation resistance of low carbon steels, the beneficial elements were Si, Cu, and Ni, whereas the harmful elements were S and Sn. The most active alloying element, Si, was scattered inside the oxide scale, at the scale-alloy interface, and as an internal oxide precipitate. The relatively noble elements such as Cu and Ni tended to weakly segregate at the scale-alloy interface. Sulfur and Sn were weakly, uniformly distributed inside the oxide scale. Excessively thick, non-adherent scales containing interconnected pores formed at $1180^{\circ}C$.

• 한국자기학회지
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• 제12권5호
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• pp.184-188
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• 2002

수직자기이방성을 가지는 Cu/Ni/Cu(002)/Si(100) 자성박막을 전자빔 증발법을 이용하여 초고진공에서 증착 하였다. 증착 시 RHEED로 측정 한 결과 실리콘 기판 위에 자성박막이 적층성장되었음을 확인하였다. 이러한 Cu/Ni/Cu(001)/Si(100) 자성박막에 1 MeV C 이온을 이온선량 2$\times$$10^{16}$ ions/$\textrm{cm}^2$로 조사한 후 MOKE로 자기이력곡선을 측정한 결과 이온 조사에 의해 자화용이축이 수직에서 수평방향으로 변화되었음을 확인하였다 포항 방사광가속기를 이용하여 X-선 반사도와 Grazing Incident X-ray diffraction(GE) 분석을 수행한 결과 첫 번째 Cu층과 Ni층 사이의 계면은 이온 조사 후 거칠기는 증가하였으나, Cu와 Ni의 전자밀도의 대비는 더욱 명확해졌다. 그리고, 증착 후 Cu와 Ni원자의 격자 상수 차이에 의해 Ni층이 가지고 있었던 strain은 이온 조사 후 완화되었음을 알 수 있었다. 끝으로, 이온조사 시 자성특성 변화와 직접적인 관계가 있는 strain 완화, 계면 혼합층(혹은 새로운 상)등이 생성되는 기구를 탄성충돌 및 비탄성충돌에 의한 열화학적 구동력으로 규명하였다.

• 열처리공학회지
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• 제7권4호
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• pp.253-261
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• 1994

Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.182-182
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• 1999

The chemisorption effect of CO on the Ni/Cu(001) surface was investigated using LEED(Low Energy Electron Diffraction) and EELS(Electron Energy Loss Spectrscopy0 under the UHV conditions. after mounting the Cu(001) single crystal in the UHV chamber (base pressure 1$\times$10-10Torr), a clean surface was obtained after a few cycles of repeated Ar+ ion sputtering and annealing at about 40$0^{\circ}C$. The epitaxial thin Ni films were formed on the Cu(001) by evaporation from 99.999% Ni block. The pseudomorphic growth and the orderness of the thin Ni films were monitored by c(2$^{\circ}C$2) LEED pattern. CO adlayers on Ni epitaxial thin films were prepared by dosing pure CO has through a leak valve. After CO adsorpton at room temperature, two pairs of peaks were observed by EELS, whose relative intensities are changed as the film thickness is varied and time is elapsed. These two pair of peaks are likely related to different bonding sites (-top and bridge sites) of C-Ni as well as C-O vibration. Experimental results and qualitative interpretation of the spectra wille be discussed. The possibility of using EELS in combination with probe species (CO) to investigate the nature of thin film growth is mentioned. We will report the experimental result of O2 dosage on Ni film and interaction of CO and O2.

• Journal of Magnetics
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• 제5권4호
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• pp.139-142
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• 2000

The interlayer coupling between adjacent ferromagnetic layers was examined for CoFe/Cu/NiFe trilayer systems. A series of films of CoFe (20 nm)/Cu($t_{cu}$)/NiFe (20 nm) trilayers with Cu spacer thickness, $t_{cu}$, in the range of 1~10 m was deposited on Si(100) wafers at room temperature by DC magnetron sputtering. In order to understand the dependence of the magnetic interaction between ferromagnetic $Co_{90}Fe_{10}$ (wt.%) and $Ni_{81}Fe_{19}$ (wt.%) layers separated by a nonmagnetic Cu spacer on the Cu layer thickness, we investigated the derivative ferromagnetic resonance (FMR) spectra. The FMR results were analyzed using the model of Layadi and Art-man for interlayer interaction. The interlayer coupling constant decreases in an oscillatory manner as the Cu spacer thickness increases up to 10 nm and approaches zero above 10 nm. The interlayer coupling constant is positive for all samples. Hence, it seems that the exchange coupling between adjacent CoFe and NiFe layers separated by a Cu layer is ferromagnetic.

• 한국표면공학회지
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• 제27권4호
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• pp.223-233
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• 1994

It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.