• Journal of the Korean Society of Environmental Restoration Technology
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• v.11 no.5
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• pp.1-11
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• 2008

This study was carried out to provide primary data set for cleaning of contamination site. By having hydroponic culture on Salix alba and S. caprea seedling treated with Ni solution, the result of Ni accumulation came out as followings : In a treatment of Ni to the Salix alba and S. caprea, Ni accumulation increased in its root, leaves, and stem, as Ni concentration became higher until $10.0{\mu}mol$. But in a $100.0{\mu}mol$ treatment, the seedlings died after 4 weeks. Ni accumulation in the Salix alba and S. caprea was the highest in its roots, second-highest in leaves, and the lowest in stems. In the case of $10.0{\mu}mol$ treatment of Ni solution, Ni accumulation in roots were above 500.0mg/L, and leaves were above 20.0mg/L. But it was lower than 13.0mg/L in stems. Ni accumulation in the plant increased more when nutrient solution containing Ni was weekly changed than just refilling the same amount of nutrient solution that evaporated Ni accumulation in Salix alba was higher than S. caprea when the nutrient solution had been refilled only.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.243-248
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• 2000

Effect of NiO addition on microstructure, stability of tetragonal phase and mechanical properties was investigated. (Y, Ni)-TZP solid solution was obtained by pressureless sintering. The fracture toughness was increased by solid solution of NiO. Neither reaction phase nor glassy phase was observed at the grain boundaries. From these results, it was determined that solid solution of NiO was destabilized tetragonal phase of Y-TZP. Y-TZP/Ni nanocomposite that contained nano-sized Ni particles was also fabricated by internal reduction method. Some evaluations and discussions were carried out for both (Y, Ni)-TZP solid solution and Y-TZP/Ni nanocomposite.

• Journal of Korean Society of Forest Science
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• v.99 no.3
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• pp.292-297
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• 2010

This study was carried out to provide preliminary data to purify contaminated sites by nickel (Ni). After rooted cuttings of Salix reichardtii had been grown in Ni solution (hydroponic culture), pH changes in the solution and the accumulated Ni amount in plant parts were measured and analyzed. When the Ni concentration was low enough for S. reichardtii cuttings to grow well, the pH value of the solution decreased considerably. As the Ni concentration got higher, the plant growth got poorer and the pH value decreased slowly. Roots accumulated the highest Ni amount. Leaves and stems followed after. When stems were older, the accumulated Ni amount was lower. more Ni was accumulated in the plant parts which had more flexible tissue and live cells. As the Ni concentration in solution got higher up to 50.0 ${\mu}mol$/L, so did the Ni accumulation in the plant parts. However, the plant individuals nearly died and the Ni accumulation tended to drop when the Ni concentration in solution was 100.0 ${\mu}mol$/L. The rooted cuttings of S. reichardtii grew poorer as the Ni concentration in solution got higher. The plants in solution with 100.0 ${\mu}mol$/L of Ni were practically dead in four weeks.

• Journal of the Korean institute of surface engineering
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• v.44 no.3
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• pp.117-123
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• 2011

We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UV-Visible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of $Ni^{2+}$-citrate pair was completed at lower solution pH than $Cu^{2+}$-citrate pair and was affected by the coexistent $Cu^{2+}$ ions, while the complexation between $Cu^{2+}$ ions and citrate was not sensitive to the presence of $Ni^{2+}$ ions. Also, the electron transfer from cathode to $Cu^{2+}$-citrate and$Ni^{2+}$-citrate was hindered by strong complexation between $Cu^{2+}/Ni^{2+}$ ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of $Cu^{2+}$ ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.214-214
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• 2014

Computational analysis of aqueous solution stability of Fe-Cr-Ni system to find an electroplating condition of Fe-Cr-Ni layer. Aqueous sulfate solution with iron, chromium and nickel ions was selected by using a numerical S/W with which aqueous solution stability was analyzed. Several possible conditions to perform electro-forming of Fe-Cr-Ni were selected with thermo-dynamical data. The Fe-Cr-Ni system was electro-formed which composition and microstructure of the electroplated Fe-Cr-Ni significantly depended on the solution temperature and electro-potential. The final composition of Fe-3%Cr-48%Ni with less than $30{\mu}m$ thick was well electroplated.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1342-1344
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• 1994

Silver-Nickel alloy has been used as a electrical contact material for low voltage, low current. Since the solubility between Ag and Ni is very low, it is difficult to produce Ag-Ni alloy by using conventional melting method and disperse Ni powder homogeneously in Ag matrix. In this study we have been produced fine Ag-Ni alloy powder by using coprecipitation method. Firstly, we have produced silver-nickel nitrate solution by dissolving the Ag and Ni ingot in nitric acid solution and then, coprecipitate (Ag, Ni)carbonate dropping Ag-Ni nitrate solution to sodium carbonate solution. (Ag, Ni) carbonate is heat-treated in $H_2$ atmosphere, $400^{\circ}C$ and it has been analysed by TGA, SEM, XRD, ICP. It is represented Silver-Nickel alloy powder in the particle range of $0.1{\sim}0.5{\mu}m$.

• Journal of Information Display
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• v.2 no.2
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• pp.7-12
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• 2001

A viscous Ni solution was coated over amorphous Si thin film for evenly spread of Ni metal source. The Ni s. prepared by dissolving $NiCl_2$ into IN HCI and mixing with propylene glycol. $NiCl_2$ and Ni were deposited on the amorphous film after oven dry and they enabled to obtain a uniform crystallization. The crystallization using the viscous Ni solution was a Ni-silicide mediated process, the same process used with Ni metal layer. The crystallization temperature was lowered to $480^{\circ}C$ by the synergy effect of silicide-mediated crystallization and microwave-induced crystallization. Lateral crystallization was also enhanced such that the velocity of lateral crystallization by microwave annealing became faster than by furnace annealing.

• Journal of Electrochemical Science and Technology
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• v.9 no.2
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• pp.93-98
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• 2018

$MnO_2$, a metal oxide used as an electrode material in electrochemical capacitors (EDLCs), has been applied in binary oxide and conducting polymer hybrid electrodes to increase their stability and capacitance. We developed a method for electrodepositing Mn-Ni oxide/PANI, Mn-Ni oxide/PEDOT, and Mn-Ni-Ru oxide/PEDOT films on carbon paper in a single step using a mixed bath. Mn-Ni oxide/PEDOT and Mn-Ni-Ru oxide/PEDOT electrodes used in an electro-osmotic pump (EOP) have shown better efficiency compared to Mn-Ni oxide and Mn-Ni oxide/PANI electrodes through testing in water as a pumping solution. EOP using a Mn-Ni-Ru oxide/PEDOT electrode was also tested in a 0.5 mM $Li_2SO_4$ solution as a pumping solution to confirm the effect of the $Li^+$ insertion/de-insertion reaction of Ruthenium oxide on the EOP. Experimental results show that the flow rate increases with the increase in current in a 0.5 mM $Li_2SO_4$ solution compared to that obtained when water was used as a pumping solution.

• Journal of the Korean institute of surface engineering
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• v.52 no.2
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• pp.78-83
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• 2019

Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

• Resources Recycling
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• v.10 no.2
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• pp.27-33
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• 2001

Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate, solution composion and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 50f) waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 10 times over than that of batch type. Plating time of 50% waste solution additive at continuous type took longer 3.7 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by depolited inferiority and larger decreased plating rate.