• 제목/요약/키워드: Ni-S

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수경재배에 의한 Salix alba와 S. caprea의 Ni축적에 관한 연구 (A Study on Accumulation of Ni in Salix alba and S. caprea by Hydroponic Culture in Ni Solution)

  • 이창헌
    • 한국환경복원기술학회지
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    • 제11권5호
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    • pp.1-11
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    • 2008
  • This study was carried out to provide primary data set for cleaning of contamination site. By having hydroponic culture on Salix alba and S. caprea seedling treated with Ni solution, the result of Ni accumulation came out as followings : In a treatment of Ni to the Salix alba and S. caprea, Ni accumulation increased in its root, leaves, and stem, as Ni concentration became higher until $10.0{\mu}mol$. But in a $100.0{\mu}mol$ treatment, the seedlings died after 4 weeks. Ni accumulation in the Salix alba and S. caprea was the highest in its roots, second-highest in leaves, and the lowest in stems. In the case of $10.0{\mu}mol$ treatment of Ni solution, Ni accumulation in roots were above 500.0mg/L, and leaves were above 20.0mg/L. But it was lower than 13.0mg/L in stems. Ni accumulation in the plant increased more when nutrient solution containing Ni was weekly changed than just refilling the same amount of nutrient solution that evaporated Ni accumulation in Salix alba was higher than S. caprea when the nutrient solution had been refilled only.

Effect of Interface Roughness on Magnetoresistance of[Ni/Mn] Superlattice-Based Spin Valves

  • J.R. Rhee;Kim, M.Y.;J.Y. Hwang;Lee, S.S.
    • Journal of Magnetics
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    • 제6권4호
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    • pp.145-147
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    • 2001
  • The effect of interface roughness between [Ni/Mn] superlattice and pinned NiFe layer on magnetoresistance (MR) of [Ni/Mn] superlattice-based spin valve films was investigated. Antiferromagnetic phase structure and interface roughness of [Ni/Mn] superlattice spin valve films were compared in the as-deposited and the annealed samples at 240$\^{C}$, respectively. Surface morphology of spin valves was substantially flattened due to the formation of the antiferromatic NiMn phase. In case of Co insertion between Cu and NiFe, the interlace roughness and MR ratio in the annealed [NiMn] superlattice and pinned NiFe/Co layer increased more than those in the annealed [Ni/Mn] superlattice and pinned NiFe layers respectively.

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Electronic Structure of [NiS4]- Investigated by Single-Crystal EPR and Density Functional Theory

  • Min, Su-Young;Noh, Dong-Youn;Choi, Cheol-Ho;Lee, Hong-In
    • 한국자기공명학회논문지
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    • 제16권1호
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    • pp.78-90
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    • 2012
  • To understand the electronic structure of $[NiS_4]^-$ complex ions, two complexes with such $[NiS_4]^-$ core, $FcCH=CHPymCH_3[Ni(dmit)_2]$ (Pym = pyridinium, $dmit^{2-}$ = 2-thioxo-1,3-dithiole-4,5-dithiolate) and $FcCH=CHPymCH_3[Ni(dddt)_2]{\cdot}{\frac{1}{2}}H_2O$ ($dddt^{2-}=5,6-dihydro-1,4-dithiin-2,3-dithiolato$), were synthesized to be characterized by X-ray crystallography, single crystal electron paramagnetic resonance (EPR) and density functional theory (DFT) calculation. Powder EPR spectra show narrow g-anisotropy but the anisotropy is bigger in $[Ni(dmit)_2]^-$ than in $[Ni(dddt)_2]^-$, indicating bigger spin density in Ni(III) d-orbital of $[Ni(dmit)_2]^-$ than in $[Ni(dddt)_2]^-$, which is consistent to DFT results. EPR studies of the crystals of the complexes surprisingly suggest that the $g_y$-axis of $[Ni(dddt)_2]^-$ is approximately on or perpendicular to the $[NiS_4]^-$ plane while the $g_y$-axis of $[Ni(dmit)_2]^-$ is on the plane, though DFT study of the complexes of this study and previously reported $[NiS_4]^-$ complexes indicate that the $g_y$-axis is on the $[NiS_4]^-$ plane.

Evolution of Cube Texture in the Nickel-Silver-Stainless steel Multi-layer Sheet

  • Lee, Hee-Gyoun;Jung, Yang-Hong;Hong, Gye-Won
    • Progress in Superconductivity
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    • 제1권1호
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    • pp.51-55
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    • 1999
  • A Ni/Ag/Stainless steel 310S(SS310S) multi-layer sheet has been fabricated by a combination of vacuum brazing, cold rolling and texture annealing processes. After heat-treating the thin Ni/Ag/SS310S multi-layer sheet at $900^{\circ}C$ for 2h, development of (100)<001>cube texture on Ni surface was revealed by (111) pole figure. Quantitative chemical analysis was made by EPMA for the cross-section of the Ni/Ag/SS310S multi-layer sheet. EPMA results showed that Ag diffusion into the Ni layer, which may suppress the cube texture development, was negligible. A small amount of Cr atoms were detected in the Ni layer. It showed that Ag can be used as a chemical barrier of alloying element atoms in Ni layer for the Ni/Ag/SS310S multi-layer sheet and a strong cube texture was developed for the Ni layer in the Ni/Ag/SS310S multi-layer sheet.

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LIGA-like 공정을 이용한 마이크로 부품 복제용 Ni과 Ni-W 금형 제조 및 특성 (Fabrication and Properties of Ni and Ni-W Electroplated Molds Using LIGA-like Process for Replication of Micro Components)

  • 황완식;박준식;강영철;조진우;박순섭;이인규;강성군
    • 한국재료학회지
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    • 제13권1호
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    • pp.6-10
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    • 2003
  • Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

MBF-30을 사용한 Inconel-625/Ni-201 브레이징 접합부의 인장성질에 미치는 접합조건의 영향 (Effect of Brazing Condition on Tensile Properties in Brazing Joints of Inconel-625/Ni-201 Using MBF-30)

  • 유정우;박상현;김창수;강정윤
    • Journal of Welding and Joining
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    • 제30권6호
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    • pp.106-112
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    • 2012
  • This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.

Ni/Cu 인공초격자에서 NiFeCo 및 NiFe 계면 삽입층이 거대자기저항 거동에 미치는 영향 (Effects of NiFeCo of NiFe Insertion Layers on the Giant Magnetoresistance Behavior of Ni/Cu Artificial Superlattice)

  • 송용진;주승기
    • 한국자기학회지
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    • 제5권6호
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    • pp.963-967
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    • 1995
  • Ni/Cu 인공초격자의 계면에 얇은 NiFeCo와 NiFe층을 삽입시 Ni/Cu 인공초격자의 자기 저항 거동에 미치는 영향에 관해 연구하였다. NiFe층이 Ni/Cu 인공초격자의 계면에 삽입된 경우 6%의 자기저항과 50 Oe의 포화자장을 보였으며 이때의 자기저항곡선은 hysteresis를 거의 보이지 않았다. NiFeCo층이 삽입된 경우는 자기저항값은 7%를 보였으나 포화자장과 hysteresis가 많이 증가하였다. 교류자장원을 이용한 동적자기저항을 측정한 결과 bias 자장하에서 자기저항의 증가폭이 NiFe층을 삽입한 경우가 NiFeCo를 삽입한 경우보다 컸으며 이는 hysteresis가 작았기 때문으로 해석된다.

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Ni-Mn-B 삼원합금도금 가속수명 및 신뢰성 평가에 대한 연구 (The study on Accelerated Life-Time Reliability Test Methods of Ni-Mn-B ternary alloy Plating(electrodeposit))

  • 마승환;노영태;장건익
    • 한국산학기술학회논문지
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    • 제16권5호
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    • pp.2993-2999
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    • 2015
  • 강 제조 회사들은 연속주조금형의 표면을 보호하기 위해 Ni-B 또는 Ni-Co 합금 도금을 적용하고 있으며, 도금 층에 균열이 생기게 하는 황을 함유한 사카린 윤활제를 사용하고 있다. 균열 및 인장 응력을 유발하는 것은 Ni-S 화합물로 여겨진다. Ni-Mn-B 삼원합금은 Ni-S 화합물이 형성되기 이전에 Mn-S 화합물을 형성하여 균열을 억제하기 위해서 개발되었으나, Ni-Mn-B 합금 도금에 관한 국내나 해외 기준이 없다. 그리하여 새로이 개발된 Ni-Mn-B 도금을 평가하기 위한 신뢰성 평가기준을 개정하려한다. 가속수명시험을 개발하기 위해 FMEA(고장형태 영향분석)가 사용되어 도금의 주요 파괴 원인을 분석하였다. Ni-Mn-B 신뢰성 기준은 가속수명시험 방법을 포함하였고, 기본 성능 시험과 환경시험, 가속수명시험으로 분류되었으며, 80% 신뢰수준으로 B10수명 1 000시간을 보장하도록 고안되었다.

Ni/B/Ni 액상확산접합계의 액상폭에 관한 연구 (A Study on the Width of Liquid Layer of Ni/B/Ni Diffusion Bonding System)

  • 정재필;강춘식
    • Journal of Welding and Joining
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    • 제13권4호
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    • pp.147-154
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    • 1995
  • In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

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