• Composites Research
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• v.33 no.4
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• pp.191-197
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• 2020

In this study, a hybrid metals such as copper (Cu) and nickel (Ni) coated carbon fibers (Ni-Cu/CFs) was prepared by wet laid method to develop a randomly oriented sheet material for high-efficiency electromagnetic interference shielding with the enhanced durability. The prepared sheet materials show a high electromagnetic interference shielding efficiency of 69.4 to 93.0 dB. In addition, the hybrid metals coated Ni-Cu/CFs sheets showed very high durability with harsh chemical/thermal environments due to the effective corrosive and mechanical resistances of Ni surface. In this context, the Ni-Cu/CF sheet possesses longer service life than the Cu/CF sheet, that is, 1.7 times longer.

• Journal of the Korean institute of surface engineering
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• v.22 no.2
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• pp.47-54
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• 1989

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the number of phase interface increased, the sheet resistance increased. Spread tests showed that the solderability was dereased with the intermetallic compounds growth and increased with the thickness of electroplated Sn. The surface morphology or agin size of the compound layer singificantly affect the solderability. The solderability of Sn/Ni system was superiot to Sn/Ni system was sperior to that of Sn/Cu system and the intermetallic compounds growth was solwer in the former system.

• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.243-254
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• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1070-1077
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• 2011

This paper is studied on the influence of machining conditions on weldability obtained by ultrasonic machining. The weldability estimation of dissimilar Ni-Cu sheets with the optimization of one-wavelength horn is confirmed by the use of ultrasonic machining. The optimal welding condition with tensile test by setting the ultrasonic machining parameters is suggested and the weldability is estimated by SEM observation and EDX-ray analysis. Experimental studies are worked with the measure of tensile strength and the analysis of SEM photograph after the ultrasonic machining of workpiece. Machining parameters of machining time, pressure, and amplitude are also applied to this paper.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.121-121
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• 2015

Fe-44%Ni-2.7%Cu와 Fe-55Ni-0.8%Cu 합금의 $60{\sim}300^{\circ}C$에서의 열팽창계수는 Fe-55%Ni과 유사한 낮은 열팽창계수를 보였으나 Fe-38%Ni-1.5%Cu함금은 약 1,400%로 증가되었고 $600^{\circ}C$ 진공 열처리로써 약 230%로 증가되었다. $0.2N-H_2SO_4$ 용액에서의 부식전위와 부식속도는 각각 $-0.907V_{SHE}$와 $1{\times}10^{-5}A/cm^2$로써 내식성이 향상되는 경향을 보였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.370-375
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• 2016

In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

• Current Photovoltaic Research
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• v.2 no.4
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• pp.147-151
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• 2014

A boron doping process using a boron tri-bromide ($BBr_3$) as a boron source was applied to form a $p^+$ emitter layer on an n-type mono-crystalline CZ substrate. Nitrogen ($N_2$) gas as an additive of the diffusion process was varied in order to study the variations in sheet resistance and the uniformity of doped layer. The flow rate of $N_2$ gas flow was changed in the range 3 slm~10 slm. The sheet resistance uniformity however was found to be variable with the variation of the $N_2$ flow rate. The optimal flow rate for $N_2$ gas was found to be 4 slm, resulting in a sheet resistance value of $50{\Omega}/sq$ and having a uniformity of less than 10%. The process temperature was also varied in order to study its influence on the sheet resistance and minority carrier lifetimes. A higher lifetime value of $1727.72{\mu}s$ was achieved for the emitter having $51.74{\Omega}/sq$ sheet resistances. The thickness of the boron rich layer (BRL) was found to increase with the increase in the process temperature and a decrease in the sheet resistance was observed with the increase in the process temperature. Furthermore, a passivated emitter solar cell (PESC) type solar cell structure comprised of a boron doped emitter and phosphorus doped back surface field (BSF) having Ni/Cu contacts yielding 15.32% efficiency is fabricated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.781-786
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• 2015

It is necessary for ferrite sheets to be fabricated with high packing density for excellent electrical properties and high strength. In this study, the relationship between the warpage and the packing density of ferrite green sheet, was investigated with amount variation of organic additives. With 0.4 wt% of dispersant, the packing density was about 48% and warpage appeared 0.5~1.3 mm high. With 1.4 wt% of dispersant, the packing density increased up to 57% and warpage appeared 0.8~2.1 mm high. With high packing density, warpage appeared along the edges of specimen, while with low packing density, deformation appeared over whole specimen inhomogeneously. It is thought that inhomogeneous deformation after sintering came from the inhomogeneity in green sheet prepared with badly dispersed slurry. With good homogeneity in green sheet from well-dispersed slurry, isotropic shrinkage is thought to have occurred along the distance from center to edges of specimen during sintering.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.344-345
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• 2015

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.