• 한국세라믹학회지
• /
• 제37권4호
• /
• pp.381-387
• /
• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• 한국분말재료학회지
• /
• 제6권4호
• /
• pp.270-276
• /
• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• 대한금속재료학회지
• /
• 제49권4호
• /
• pp.298-303
• /
• 2011

Mg-23.5 wt%Ni-xwt%Cu (x = 2.5, 5 and 7.5) samples for hydrogen storage were prepared by melt spinning and crystallization heat treatment from a Mg-23.5 wt%Ni-5 wt%Cu alloy synthesized by the gravity casting method. They were then ground under $H_2$ to obtain a fine powder. Among these samples the Mg-23.5Ni-2.5Cu sample had the highest hydriding and dehydriding rates after activation. The Mg-23.5Ni-2.5Cu sample absorbed 3.59 and 4.01 wt%H for 10 and 60 min, respectively, at 573K under 12 bar $H_{2}$. The activated 88(87.5Mg-10Ni-2.5Cu)-$5Nb_{2}O_{5}-7NbF_{5}$ sample absorbed 2.93 wt%H for 10 min, and 3.14 wt%H for 60 min at 573K under 12 bar $H_{2}$.

• 한국표면공학회지
• /
• 제28권4호
• /
• pp.243-254
• /
• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2004년도 동계학술연구발표회 논문개요집
• /
• pp.91-92
• /
• 2004

• 열처리공학회지
• /
• 제37권2호
• /
• pp.79-85
• /
• 2024

The effects of annealing heat treatment and the addition of Cu element on the shape memory effect of the NiTi-based alloy were investigated by analyzing differential scanning calorimeter results and characterizing recovery rate through 3D scanning after Vickers hardness test. Through 3D scanning of impressions after Vickers hardness test, the strain recovery rates for specimens without annealing treatment and annealed specimens at 400, 450, and 500℃ were measured as 45.96%, 46.76%, 52.37%, and 43.57%, respectively. This is because as the annealing temperature increases, both B19' and NiTi₂ phases, which can impede martensitic transformation, are incorporated within the NiTi matrix. Particularly, additional phase transformation from R-phase to B19' observed in specimens annealed at 400 and 450℃ significantly contributes to the improvement in strain recovery rates. Additionally, the results regarding the Cu element content indicate that when the total content of Ni and Cu is below 49.6 at.%, the precipitation of fine B19' and NiTi₂ phases within the matrix can greatly influence the transformation enthalpy and temperature range, resulting in relatively lower strain recovery rates in NiTi alloys with a small amount of Cu element produced in this study.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1988년도 추계학술대회 논문집
• /
• pp.64-66
• /
• 1988

The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000$^{\circ}C$), simultaneously causing a considerable change of skeleton Morphology and its related best infiltration behaviour of Cu-melts.

• 한국주조공학회지
• /
• 제31권1호
• /
• pp.26-30
• /
• 2011

For the fabrication of bulk near-net-shape Ti-Ni-Cu shape memory alloys, consolidation of Ti-Ni-Cu alloy powders are useful because of their brittle property. In the present study, $Ti_{50}Ni_{30}Cu_{20}$ shape memory alloy powders were prepared by gas atomization and martensitic transformation temperatures and microstructures of those powders were investigated as a function of powder size. The size distribution of the powders was measured by conventional sieving, and sieved powders with the specific size range of 25 to $150\;{\mu}m$ were chosen for this examination. XRD analysis showed that the B2-B19 martensitic transformation occurred in the powders. In DSC curves of the as-atomized $Ti_{50}Ni_{30}Cu_{20}$ powders as a function of powder size, only one clear peak was found on each cooling and heating curve. The martensitic transformation start temperature($M_s$) of the $25-50\;{\mu}m$ powders was $31.5^{\circ}C$. The $M_s$ increased with increasing powder size and the difference of $M_s$ between $25-50\;{\mu}m$ powders and $100-150\;{\mu}m$ powders is only $1^{\circ}C$. The typical microstructure of the rapidly solidified powders showed cellular morphology and very small pores were observed in intercellular regions.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2017년도 춘계학술대회 논문집
• /
• pp.123.2-123.2
• /
• 2017

Fe-Ni-Cu 합금 전주를 위하여 황화물 용액에의 상의 열역학적 안정도를 작성하고 전주 조건을 선정하였다. $Fe-Ni-Cu-S-H_2O$ 용액의 열역학적 상의 안정도를 전산모사하기 위한 프로그램은 C#으로 작성하였다. JANAF 자료를 근거한 적정 전주 조건은 $130mA/cm^2$, $50{\sim}55^{\circ}C$, pH 2.4 이었다. XRF을 이용한 Fe-Ni-Cu의 합금 도막의 평균 조성은 Fe-42Ni-1Cu [wt.%] 이었다, 전류밀도가 낮아질수록 Ni과 Cu량은 증가하였다. 구리 농도가 증가하면 표면조도는 60 nm로 변화하였다.

• 한국재료학회지
• /
• 제4권8호
• /
• pp.877-887
• /
• 1994

강도, 소전율, 스프링성, 내열성 및 굽힘 가공성등의 적절한 조화를 갖는 콘넥팅재료를 개발하기 위하여 Cu-Ni-Si-P합금에 대하여 연구하였다. Ni와 Si의 조성을 달리한 3종류의 합금을 용해, 주조하여 약 $900^{\circ}C$에 열간압연 후 수냉하고, 그 후 냉간압연하여 $450^{\circ}C$. $500^{\circ}C$ 및 $550^{\circ}C$에서 시효처리한 후 기계적 성질 변화와 도전율 등을 조사하였다. 고강도와 고존도율의 적절한 조화를 나타내는 Cu-2.7%Ni-0.53% Si-0.029%P 합금을 만들었다. 합금 1을 0.5mm두께의 콘넥팅재료로 가공한 후 여러가지 특성은 인청동(C 5210R-H)과 황동(C2600R-EH)에 비해 우수한 것으로 평가되었다.