• E2M - 전기 전자와 첨단 소재
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• 제3권4호
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 한국재료학회지
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• 제28권5호
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• pp.295-300
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• 2018

Effects of annealing temperature on the microstructure and mechanical properties through thickness of a Cu-3.0Ni-0.7Si alloy processed by differential speed rolling are investigated in detail. The copper alloy with a thickness of 3 mm is rolled to a 50 % reduction at ambient temperature without lubricant and subsequently annealed for 0.5 h at $200-900^{\circ}C$. The microstructure of the copper alloy after annealing is different in the thickness direction depending on the amount of the shear and compressive strain introduced by the rolling; the recrystallization occurs first in the upper roll side and center regions which are largely shear-deformed. The complete recrystallization occurs at an annealing temperature of $800^{\circ}C$. The grain size after the complete recrystallization is finer than that of the conventional rolling. The hardness distribution of the specimens annealed at $500-700^{\circ}C$ is not uniform in the thickness direction due to partial recrystallization. This ununiformity of hardness corresponds well to the amount of shear strain in the thickness direction. The average hardness and ultimate tensile strength has the maximum values of 250 Hv and 450 Mpa, respectively, in the specimen annealed at $400^{\circ}C$. It is considered that the complex mode of strain introduced by rolling directly affects the microstructure and the mechanical properties of the annealed specimens.

• Journal of Advanced Marine Engineering and Technology
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• 제39권5호
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• pp.536-541
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• 2015

Copper has been used extensively as an electric wire or as a base material in various types of machineries owing to its good electrical and thermal conductivity and good fabricating property, as well as its good corrosion resistance compared to iron. Furthermore, the copper-nickel alloy has significant corrosion resistance in severely corrosive environments. Although, cupro-nickel alloy shows better corrosion resistance than the brass and bronze series, this alloy also corroded in severely corrosive environments, including aggressive chloride ions, dissolved oxygen, and condition of fast flowing seawater. In this study, and annealing treatment at various annealing temperatures was carried out on the cupro-nickel (Cu-10%Ni) alloy, and the effects of annealing were investigated using electrochemical methods, such as measuring the polarization and impedance behaviors under flowing seawater conditions. The corrosion resistance increased by annealing compared to non heat treatment in the absence of flowing seawater. In particular, the sample annealed at $200^{\circ}C$ exhibited the best corrosion resistance. The impedance in the presence of flowing seawater showed higher values than in the absence of flowing seawater. Furthermore, the highest impedances was observed in the sample annealed at $800^{\circ}C$, irrespective of the present of flowing seawater. Consequently, the corrosion resistance of cupro-nickel (Cu-10%Ni) alloy in a severely corrosive environment can be improved somewhat by annealing.

• 센서학회지
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• 제13권6호
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• pp.405-410
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• 2004

Compensation wires for Pt/Pd thermocouple was manufactured using Cu/Ni alloys. Their thermoelectric voltage has been tested from room temperature to about $150^{\circ}C$. Alloys of $Cu_{95.5}Ni_{4.5}$ and $Cu_{89.5}Ni_{10.5}$ introduced only small emf differences to Pt/Pd thermocouples, indicating a real possibility of industrial use. Above $1000^{\circ}C$, the temperature difference was expected to he small as ${\pm}0.5^{\circ}C$, and the difference would be minimized by adjusting the Ni content with a small amount.

• 한국분말재료학회지
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• 제6권1호
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• pp.36-41
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• 1999

The present work has attempted to investigate the dependence of Cu infiltration kinetics on in-situ structure modification of W powder skeleton in W-Cu system. In-situ structure modification of W skeleton by addition of 0.3wt%Ni-P eutectic alloy was designed to proceed during heat-up of the W compact for Cu infiltration process. It was found that the Ni-P added W skeleton underwent remarkable stucture change only during heating-up. its structure was composed of large necks of W particles above 0.5 in the ratio of neck to particle size and smooth pore channels. The infiltration experiment showed that the infiltration kinetics for the W-Ni-P followed well the linear relationship of h vs. $t^{1/2}$ the rate constant K of which was in good agreement with the theoretical value. On the other hand, in case of the pure W skeleton a lower K value by 20% than the theoretical one was obatined. Such discrepancy is discussed in terms of skeleton structure induced infiltration mechanics.

• 한국재료학회지
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• 제9권9호
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• pp.905-912
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• 1999

분말야금법으로 제조된 Cu-7.5Ni-5Sn 합금의 용체화 및 시효 열처리 조건에 따른 기계적 특성의 변화를 관찰하였다. As-received 상태의 Cu-7.5Ni-5Sn 합금을 시효한 경우에는 시효 20분 후에 ${\gamma}$\\` 상의 석출에 의한 강도 증가를 나타내는데 반해, 재용체화 처리된 시편에서는 시효 수십초부터 스피노달 분해에 의한 급격한 강도의 증가를 나타내고 있다. 그러나 전체적인 인장강도는 재용체화 처리를 행한 경우에 비해 as-received 상태에서 등온 시효한 경우가 더욱 우수한 것으로 나타났다. 이러한 현상은 재용체화 처리에 의한 결정립 성장에 기인한 것으로 사료된다. As-received 상태의 Cu-7.5Ni-5Sn 합금을 장시간 시효하게 되면 결정립계에 불연속 석출물이 생성되었으며, 이러한 불연속 석출물의 생성과 성장은 열처리 조건에 영향을 받는 것으로 관찰되었으며, 합금의 최종 기계적 성질에 크게 영향을 미치는 것으로 판단된다.

• 전기화학회지
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• 제5권3호
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• pp.125-130
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• 2002

다공성 그물구조 금속을 반도체 칩 방열재료로써 활용하기 위한 실험을 실시하였다. 이를 위해 다공성 그물구조 구리와 반도체 칩 사이의 열팽창 차이를 최소화하기 위한 시도로써 다공성 구리에 대한 Fe/Ni 합금전착을 수행하였다. Fe/Ni 합금전착 실험으로 표준 Hull Cell을 구성하고 전류밀도 분포에 따른 Fe/Ni 합금층 내의 조성변화를 관찰하였으며, 실험결과 합금전착시 이상공석현상으로 인하여 전해액의 교반정도에 따라 합금층 조성이 크게 영향을 받는 것으로 나타났다. 본 실험에서는 paddle type 교반기를 사용하여 전해질의 확산을 제어하는 방법으로 원하는 조성의 Fe/Ni 합금층을 얻을 수 있었으며, 얻어진 Fe/Ni 후막을 대상으로 TMA 열분석을 실시한 결과 구리에 비해 훨씬 낮은 열팽창율을 보이는 것으로 나타났다. 또한, 본 실험에서 Fe/Ni 합금전착을 통하여 제작한 다공성 그물구조 금속을 대상으로 방열성능을 측정한 결과 구리 평판 대비 최대 2배 이상의 방열성능을 보여 반도체 칩 방열재료로의 활용 가능성을 높여 주었다.

• Journal of Welding and Joining
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• 제12권4호
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• pp.102-109
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• 1994

The thick and hard alloyed layer was formed on the surface of Aluminum Cast Alloy(AC2B) by PTA overlaying process with Cr, Cu and Ni metal powders under the condition of overlaying current 150A, overlaying speed 150mm/min and different powder feeding rate 5-20g/min. The characteristics of hardening and were resistance of alloyed layer have been investigated in relation to microstructure of alloyed layer. As a result, it was made clear that Cu powder was the most superier one in three metal powders used due to an uniform hardness distribution of Hv 250-350, good wear resistance and freedom from cracking in alloyed layer of which microstructure consisted of hypereutectic. On the contrary, irregular hardness distribution was usually obtained in Cr or Ni alloyed layers of which hardness was increased as Cr or Ni contents and reached to maximum hardness of about Hv 400-850 at about 60wt% Cr or 40wt% Ni in alloyed layer. However the cracking occurred in these alloyed layers with higher hardness than Hv 250-300 at more than 20-25wt% of Cr or Ni contents in alloyed layer. Wear rate of alloyed layer was decreased to 1/10 in Cu alloyed layer and 1/5 or 1/3 in Cr or Ni alloyed layer with same hardness of about Hv 300 in comparison with that of base metal at higher sliding speed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.246-249
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• 2000

The effects of Zr on the mechanical workability and tensile strength of Cu-Ni-Mn-Sn-Al alloys have been investigated and the following results were obtained. The mechanical workability of Cu-Ni-Mn-Sn-Al alloys are increased with addition of Zr. And the surface cracks of specimen were not produced in Zr added Alloys. Especially in condition of hot-worked beyond the 90% working ratio, Zr contained specimen showed intra-granule crack propagation but Zr-free specimen showed inter-granule mode. The tensile strength have maximum value in 0.05% Zr contained alloy. The aging mechanism of Cu-Ni-Mn-Sn-Al alloys were varied by Zr addition.