• 한국표면공학회지
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• 제42권6호
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• pp.280-286
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• 2009

In this study, the corrosion property of copper alloy tubes in seawater has been investigated. Three copper alloys of nominal composition Cu-20Zn-2Al(Al-Brass), Cu-30Ni(CN70/30) and Cu-10Ni(CN90/10) were considered. The samples were immersed in 3%NaCl flowing solution at $90^{\circ}C$ for 30, 50 and 80 days. Corrosion rate of copper alloy tubes in 3%NaCl flowing solution was investigated by weight-loss measurements and electrochemical test. The CN70/30 showed lowest corrosion rate among three copper alloy tubes. Because of passive films formation, corrosion rates of three types of copper tubes were decrease with time. Surface characteristics of copper alloy tubes were analyzed by optical micrograph(OM), scanning electronic microscopy (SEM), energy dispersive X-ray analysis(EDAX) and X-ray diffraction patterns(XRD). CN70/30 showed partly pitting problem on the surface owing to high Fe content, even though having high resistant against corrosion. Cracks appeared on the surface of CN90/10 and CN70/30 after more than 50 days immersion, which could be derived from high nickel contents.

• 대한금속재료학회지
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• 제48권11호
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Applied Microscopy
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• 제45권2호
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• pp.58-62
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• 2015

Formation of an icosahedral phase in the bulk glass forming $Ti_{40}Zr_{29}Be_{14}Cu_9Ni_8$ alloy during crystallization from amorphous phase and solidification from melt is investigated. The icosahedral phase with a size of 10 to 15 nm forms as a thermodynamically stable phase at intermediate temperature during the transformation from amorphous to crystalline phases such as Laves and ${\beta}$-(Ti-Zr) phases, indicating that the existence of the icosahedral cluster in the undercooled liquid. On the other hand, the icosahedral phase forms as a primary solidification phase even though the Laves phase is stable at high temperature, which is can be explained based on the high nucleation rate of icosahedral phase relative to that of competing crystalline Laves phase due to lower interfacial energy between icosahedral and liquid phases.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.273-276
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• 2005

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

• 한국수소및신에너지학회논문집
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• 제10권4호
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• pp.225-232
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• 1999

Ni-MH 2차 전지의 음극재료로 사용되는 수소저장합금중 이론 방전용량이 가장 높은 $Mg_2Ni$를 기계적 합금법으로 제조하여 각종 첨가물의 첨가에 따른 전기화학적 특성을 조사하였다. $Mg_2Ni$는 고에너지 볼밀인 SPEX 8000을 이용하여 두가지 방법으로 제조하였다. 하나는 Mg, Ni 분말에 첨가물인 $AB_5$, $AB_2$계 수소저장합금과 Ni, Co, Cu를 첨가하여 12시간 볼밀링한 경우이고, 다른 하나는 먼저 Mg, Ni 분말을 1시간동안 볼밀링한 후 $300{\sim}400^{\circ}C$에서 열처리하여 $Mg_2Ni$를 제조한 후 여기에 첨가물을 10wt% 첨가하여 12 시간동안 볼밀할 경우이다. 이 볼밀링한 복합분말을 상온에서 $754tons/cm^2$의 압력으로 냉간압착하여 디스크 모양의 전극을 제조하였다. 실험결과 볼밀링 후 열처리를 거친 합금분말의 경우가 그렇지 않은 경우에 비해 전극의 방전용량이 높았으며, Ni을 첨가한 경우는 방전용량을 증가시키고 Co를 첨가한 경우는 싸이클 특성이 향상되었다. 특히 $Mg_2Ni$에 Ni을 10wt%를 첨가하여 12시간 볼밀한 경우 $Mg_2Ni$의 최대 방전용량은 546mAh/g.alloy으로 이론용량의 약 55%에 달했다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1993년도 추계연구발표회 논문개요집
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• pp.42-43
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• 1993

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2007년도 High Temperature Superconductivity Vol.XVII
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• pp.74-74
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• 2007

• 한국재료학회:학술대회논문집
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• 한국재료학회 2004년도 춘계학술발표대회 및 제6회 신소재 심포지엄
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• pp.33-33
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• 2004

• 열처리공학회지
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• 제33권5호
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• pp.226-231
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• 2020

The Cu-Co-Si alloy shows high strength by forming precipitates by aging precipitation heat treatment of supersaturated solid solution treated with solution treatment such as Cu-Ni-Si alloy, and the Co₂Si precipitated phase is dispersed in the copper matrix. The effect of aging treatment on the microstructure, mechanical and electrical properties of Cu-Co-Si alloys for electronic devices was investigated. As a results of SEM/EDS analysis, it was found that Co₂Si precipitates of 30~300 nm size were distributed in grains. By performing the double aging treatment, it was possible to improve the strength and electrical conductivity by dispersing the fine precipitate evenly.

• 한국표면공학회지
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• 제45권6호
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.