• Korean Journal of Crystallography
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• v.14 no.2
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• pp.51-55
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• 2003

SrTiO₃ (STO) thin fims were deposited on the biaxially textured Ni-3 wt%W alloy substrates to be used as a single buffer layer for YBa₂CU₃O/sub 7-8/(YBCO) coated conductor. Thin films of YBCO and STO were deposited using pulsed laser. The deposition condition for epitaxial growth of STO on the textured metal was identified, and YBCO coated conductor with a single STO buffer layer with critical current density of 1.2 MA㎠ at 77 K under zero magnetic field and critical temperature of 86 K, was fabricated.

• Journal of Powder Materials
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• v.11 no.5
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• pp.412-420
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• 2004

The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.

• Journal of Korea Foundry Society
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• v.10 no.6
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• pp.528-537
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• 1990

7XXX aluminum alloy powders produced by the self-manufactured rotating disc atomizer were investigated to determine the influence of the atomization parameters on the particle size distributions in air atmosphere. The particle size distributions are almost always bimodal with the dominant mode on the large particle size. Average powder size of 7XXX aluminum alloy is $74/{\mu}m~125/{\mu}m$ when melt is poured with the rate of 9g /sec at 730$^{\circ}C$ on a rotating disc of 30㎜ diameter at 6300rad/sec. The mass of finer particle increased when disc diameter, angular velocity, pouring temperature increased and pouring rate decreased. The powder shapes of bimodal change from acicular to tear-drop and from tear-drop to ligament with increasing powder size. Powder shape was determined by the atomization mechanism and oxidation in liquid state. Microstructure of powders appeared to be cell and cellular dendrite. The SDAS of Al-7.9wt%Zn-2.4wt%Mg-1.5wt%Cu-0.9wt%Ni Powders is $0.8{\mu}m~1.0{\mu}m$ for the powders of $size＋44{\mu}m~53{\mu}m$ and $1.6{\mu}m∼1.8{\mu}m$ for the powders of $size＋105{\mu}m~125{\mu}m$, repectively.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• Journal of Technologic Dentistry
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• v.14 no.1
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• pp.55-65
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• 1992

The purpose of this study was to investigate the comparison of physical properties of nonprecious metal alloys colored goldish yellow. The experimental groups were copper based dental alloy and control group was Ni-Cr based dental alloy used crown and bridges frameworks. Hardness was tested by vickers hardness tester, tensile strength was tested by universal tension tester. After testing the tensile strength of castings, the microstrucure and the pattern of fracture were investigated by scanning electron microscope and metallurgical microscope. The results were as follows : Hardness of Ni based alloy was higher than Cu based alloys. Hardness number of A group was 200.41$\pm$16.10 Hv, B group was 194.33$\pm$1.69 Hv, C group was 139.29$\pm$2.19 Hv and D group was 293.81$\pm$27.17 Hv, respectively. Tensile strength of D group was 56.42$\pm$6.17 $kg/m^2$, A group was 50.39$\pm$5.68 $kg/m^2$, C group was 45.13$\pm$4.53 $kg/m^2$, B group was 45.25$\pm$9.25 $kg/m^2$, in order, and D group was maximum tensile strength. The fractured surfaces of tensile specimens in the all groups showed the tendency to form large voids in the center of specimens. Thus the ductile fracture was changed into the brittle fracture with the fine grain size.

• Transactions of the Korean hydrogen and new energy society
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• v.6 no.2
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• pp.65-73
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• 1995

Negative electrode was prepared by mixing $Ti_{0.7}Zr_{0.3}Cr_{0.3}Mn_{0.3}V_{0.6}Ni_{0.8}$ alloy powder with copper or nickel powder and pressing in the air. The cycled electrodes were analyzed with SEM, potentiostat and electrochemical impedance spectroscopy. It was found that the Cu-compacted electrode showed better low temperature dischargeability and higher rate capability than Ni-compacted electrode. From SEM analysis of the cycled electrode compacted with copper powder, it was observed that the surface of MH particles was covered with copper grains and whisker precipitated from electrolyte after dissolution during cell test. It is found that the improved electrode characteristics are attributed to the copper layer on MH particles deposited by dissolution and precipitation(DP) process.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.3
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of Powder Materials
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• v.15 no.4
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• pp.292-296
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• 2008

The electromagnetic (EM) wave absorption properties of the $Fe_{73}Si_{16}B_7Nb_3Cu_1$ nanocrystalline powder mixed with 5 to 20 vol% of Ni-Zn ferrites has been investigated in a frequency range from 100MHz to 10GHz. Amorphous ribbons prepared by a planar flow casting process were pulverized and milled after annealing at 425 for 1 hour. The powder was mixed with a ferrite powder at various volume ratios to tape-cast into a 1.0mm thick sheet. Results showed that the EM wave absorption sheet with Ni-Zn ferrite powder reduced complex permittivity due to low dielectric constant of ferrite compared with nanocrystalline powder, while that with 5 vol% of ferrite showed relatively higher imaginary part of permeability. The sheet mixed with 5 vol% ferrite powder showed the best electromagnetic wave absorption properties at high frequency ranges, which resulted from the increased imaginary part of permeability due to reduced eddy current.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.