• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• Journal of Korea Foundry Society
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• v.26 no.5
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• pp.227-231
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• 2006

Liquid formability of bulk amorphous alloys is known to be very poor due to their high viscosity comparing with conventional metallic materials. It is important to have the fabricating technology of bulk amorphous alloys in order to make the components with complicated shape. Liquid formability includes the mold cavity filling ability and the hot tear(crack) resistance during solidification. A mold made of a commercial tool steel for the formability test was designed. Melting was performed by the arc melting furnace with melting capacity of 200 g in an argon atmosphere. Liquid formability and glass forming ability of Cu base and Ni base bulk amorphous alloys were measured and evaluated. Mold filling ability of Ni-Zr-Ti-Si-Sn alloy was better than that of Cu-Ni-Zr-Ti alloy, however the reverse is the hot tear resistance. Bulk amorphous alloy is very susceptible to crack if partial crystallization occurs during solidification. Crack resistance was thought to be closely related with the glass forming ability.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.70-71
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.539-544
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• 2002

Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature (about 1000 C) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at 900 C or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point 825 C) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: 825 C) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of 820 C or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

• International Journal of Korean Welding Society
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• v.2 no.2
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• pp.14-18
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• 2002

Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature ( about $1000^{\circ}C$ ) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at $900^{\circ}C$ or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point: $825^{\circ}C$) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: $825^{\circ}C$) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of $820^{\circ}C$ or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

• Journal of Korea Foundry Society
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• v.22 no.5
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• pp.252-256
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• 2002

Ni-Nb-Ti-Zr amorphous alloys were manufactured using melt-spinning methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties were examined. The value of the reduced glass transition temperature and the supercooled liquid region of $Ni_{62}Nb_{10}Ti_{13}Zr_{15}$ alloy were relatively high and were 0.612 and 76 K respectively. However, amorphous bulk alloy rod was not formed using the Cu-mold die casting. The mechanical properties were in the range of $800{\sim}900DPN$ of hardness and $2.5{\sim}2.8$ GPa of tensile strength in the whole composition range.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.1
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• pp.49-54
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• 1989

The purpose of this study was to investigate the interfacial elemental change when solding the Ni-Co-Cr dental removable partial denture alloy and Fe-Cr-Ni wrought wire alloy with Ag-Cu-Zu Silver solder, by EDXA, EPMA, to investigate the appropriateness of clinical usefullness for repair the fractured clasps of removable partial dentive. The result of this study was as follows: 1. The Ni element of major component of Ticonium penetrate into the silver solder 2. The movement Age element of silver solder into Fe-Cr-Ni wire was not significant, by EDXA and EPMA.

• Journal of Electrochemical Science and Technology
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• v.10 no.1
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• pp.82-88
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• 2019

Here, we report on nanocrystalline Si-Al-M (M = Fe, Cu, Ni, Zr) alloys for use as an anode for lithium-ion batteries, which were fabricated via a melt-spinning method. Based on the XRD and TEM analyses, it was found that the Si-Al-M alloys consist of nanocrystalline Si grains surrounded by an amorphous matrix phase. Among the Si-Al-M alloys with different metal composition, Ni-incorporated Si-Al-M alloy electrode retained the high discharge capacity of 2492 mAh/g and exhibited improved cyclability. The superior $Li^+$ storage performance of Si-Al-M alloy with Ni component is mainly responsible for the incorporated Ni, which induces the formation of ductile and conductive inactive matrix with crystalline Al phase, in addition to the grain size reduction of active Si phase.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.409-415
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• 2017

For enhanced cavitation erosion resistance of vessel propellers, an electroless Ni-P plating method was introduced to form a coating layer with high hardness on the surface of Cu alloy (CAC703C) used as vessel propeller material. An electroless Ni-P plating reaction generated by Fe atoms in the Cu alloy occurred, forming a uniform amorphous layer with P content of ~10 wt%. The amorphous layer transformed to (Ni3P+Ni) two phase structure after heat treatment. Cavitation erosion tests following the ASTM G-32 standard were carried out to relate the microstructural changes by heat treatment and the cavitation erosion resistance in distilled water and 3.5 wt% NaCl solutions. It was possible to obtain excellent cavitation erosion resistance through careful microstructural control of the coating layer, demonstrating that this electroless Ni-P plating process is a viable coating process for the enhancement of the cavitation erosion resistance of vessel propellers.