• Journal of the Korean institute of surface engineering
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• v.42 no.6
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• pp.280-286
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• 2009

In this study, the corrosion property of copper alloy tubes in seawater has been investigated. Three copper alloys of nominal composition Cu-20Zn-2Al(Al-Brass), Cu-30Ni(CN70/30) and Cu-10Ni(CN90/10) were considered. The samples were immersed in 3%NaCl flowing solution at $90^{\circ}C$ for 30, 50 and 80 days. Corrosion rate of copper alloy tubes in 3%NaCl flowing solution was investigated by weight-loss measurements and electrochemical test. The CN70/30 showed lowest corrosion rate among three copper alloy tubes. Because of passive films formation, corrosion rates of three types of copper tubes were decrease with time. Surface characteristics of copper alloy tubes were analyzed by optical micrograph(OM), scanning electronic microscopy (SEM), energy dispersive X-ray analysis(EDAX) and X-ray diffraction patterns(XRD). CN70/30 showed partly pitting problem on the surface owing to high Fe content, even though having high resistant against corrosion. Cracks appeared on the surface of CN90/10 and CN70/30 after more than 50 days immersion, which could be derived from high nickel contents.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Applied Microscopy
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• v.45 no.2
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• pp.58-62
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• 2015

Formation of an icosahedral phase in the bulk glass forming $Ti_{40}Zr_{29}Be_{14}Cu_9Ni_8$ alloy during crystallization from amorphous phase and solidification from melt is investigated. The icosahedral phase with a size of 10 to 15 nm forms as a thermodynamically stable phase at intermediate temperature during the transformation from amorphous to crystalline phases such as Laves and ${\beta}$-(Ti-Zr) phases, indicating that the existence of the icosahedral cluster in the undercooled liquid. On the other hand, the icosahedral phase forms as a primary solidification phase even though the Laves phase is stable at high temperature, which is can be explained based on the high nucleation rate of icosahedral phase relative to that of competing crystalline Laves phase due to lower interfacial energy between icosahedral and liquid phases.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.273-276
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• 2005

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

• Transactions of the Korean hydrogen and new energy society
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• v.10 no.4
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• pp.225-232
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• 1999

The $Mg_2Ni$ hydrogen storage alloys which have much higher theoretical discharge capacity than $AB_5$ and $AB_2$ type alloys were synthesized by mechanical alloying with some additives and subjected to the electrochemical measurements. Two different processes were employed to the synthesis of $Mg_2Ni$ alloys with using the high energy ball mill SPEX 8000. One was only ball milling, 12 hrs, the Mg and Ni powders for 12 hrs with additives such as $AB_5$, Ni, Co and Cu powders. In the other process the Mg and Ni powders were ball milled for 1 hr first and then heat treated at $300{\sim}400^{\circ}C$ for 1 hr to get $Mg_2Ni$ alloy, and finally the $Mg_2Ni$ alloy powders were ball milled with the additives for 12 hrs. The alloy powders prepared were compacted at room temperature under $7.64tons/cm^2$ into disk type electrodes for the electrochemical measurements. The experimntal results showed that the electrodes prepared with the heat treated alloy powders had a higher discharge capacities than those without heat treatment. The addition of Ni caused an increase of the discharge capacity and the addition of Co improved the cycling characteristics. The electrode prepared by ball milling of $Mg_2Ni$ and 10wt% Ni powders has showed the highest discharge capacity, 546mAh/g.alloy, which was 55% of the theoretical capacity.

• Proceedings of the Korean Magnestics Society Conference
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• 1993.11a
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• pp.42-43
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• 1993

• 한국초전도학회:학술대회논문집
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• 2007.07a
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• pp.74-74
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2004.05a
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• pp.33-33
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• 2004

• Journal of the Korean Society for Heat Treatment
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• v.33 no.5
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• pp.226-231
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• 2020

The Cu-Co-Si alloy shows high strength by forming precipitates by aging precipitation heat treatment of supersaturated solid solution treated with solution treatment such as Cu-Ni-Si alloy, and the Co₂Si precipitated phase is dispersed in the copper matrix. The effect of aging treatment on the microstructure, mechanical and electrical properties of Cu-Co-Si alloys for electronic devices was investigated. As a results of SEM/EDS analysis, it was found that Co₂Si precipitates of 30~300 nm size were distributed in grains. By performing the double aging treatment, it was possible to improve the strength and electrical conductivity by dispersing the fine precipitate evenly.

• Journal of the Korean institute of surface engineering
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• v.45 no.6
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.