• Korean Journal of Metals and Materials
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• v.46 no.12
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• pp.830-834
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• 2008

NiSi is currently being employed in 45 nm CMOS devices as a contact material. We employed a first principles calculation to understand the movements of atoms when Co, Pd, and Pt were added to tetragonal-NiSi on Si (001). The Ni atoms in the tetragonal-NiSi/Si (001) favored away from the original positions along positive c-direction in a systematic way during the energy minimization. Two different Ni sites were identified at the interface and the bulk, respectively. The Ni site at the interface farther away from the interface was more favorable for Pd and Pt substitution. Co, however, prafered the bulk site to the interface site, unlike Pd and Pt.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.138-138
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• 2008

Ti capping layer를 이용하여 NiGe의 열적 안정성을 향상시키는 연구를 수행하였다. N-type Ge(100) 기판에 30nm 두께의 Ni과 30nm 두께의 Ti capping layer를 E-beam evaporator를 이용하여 증착하고 $300^{\circ}C$에서 $700^{\circ}C$ 까지 30초간 $N_2$ 분위기에서 급속 열처리하여 Ni-Germanide를 형성하였다. XRD의 결과로부터 Ti capping layer 유무에 상관없이, 전 온도 범위에 걸쳐 NiGe 상이 형성된 것을 관찰할 수 있었다. 급속 열처리 온도에 따른 면저항 값을 측정한 경우, $300^{\circ}C$에서 $600^{\circ}C$까지의 열처리 온도 범위에서는 모든 시편들이 비슷한 면저항 값을 보인 반면, 열처리 온도가 $700^{\circ}C$ 이상에서는 Ti capping layer가 있는 시편이 Ti capping layer가 없는 시편보다 낮은 면저항 값을 갖는 것을 확인할 수 있었다. 이는 고온 열처리 시 Ti capping layer에 있는 Ti가 기판 방향으로 확산하여 NiGe grain boundary에 segregation 되고 그로 인하여 NiGe의 grain boundary 움직임을 억제하여 agglomeration 현상을 효과적으로 방지하였기 때문에 나타난 현상으로 사료된다.

• Proceedings of the Korean Magnestics Society Conference
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• 2012.11a
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• pp.172-172
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• 2012

A Pt-skin $Pt_3Ni$(111) surface was reported to show high catalytic activity. In this study, we investigated the magnetic properties and electronic structures of the various oriented surfaces of bulk-terminated and Pt-segregated $Pt_3Ni$ by using a first-principles calculation method. The magnetic moments of Pt and Ni are appreciably enhanced at the bulk-terminated surfaces compared to the corresponding bulk values, whereas the magnetic moment of Pt on the Pt-segregated $Pt_3Ni$(111) surface is just slightly enhanced because of the reduced number of Ni neighboring atoms. Spin-decomposed density of states shows that the dz2 orbital plays a dominant role in determining the magnetic moments of Pt atoms in the different orientations. The lowering of the d-band center energy (-2.22 eV to -2.46 eV to -2.51 eV to -2.65 eV) in the sequence of bulk-terminated (100), (110), (111), and Pt-segregated (111) may explain the observed dependence of catalytic activity on surface orientation. Our d-band center calculation suggests that an observed enhanced catalytic activity of a $Pt_3Ni$(111) surface originates from the Pt-segregation.

• Journal of Korea Foundry Society
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• v.8 no.4
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• pp.459-466
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• 1988

This study was carried out in the austempering temperature and time after Ni, Mo addition in purpose of modification of impact toughness of austempered ductile irons. Addition of alloy element and austempering treatment of $900^{\circ}C$ 60 minutes followed by $300^{\circ}C$, $350^{\circ}C$ and $400^{\circ}C$ for 60 minutes, in this case impact value was increased by ideal mixed structure. But impact value was decreased when holing time is 120minutes, this is attributed to segregation and carbide precipitation from high carbon austenite. Highest impact value was obtained by $350^{\circ}C$ (Mo-addition) and $400^{\circ}C$ (Ni-addition). This phenomena was caused by presence of remained austenite. At all austempering temperature,, Ni-added specimen showed higher impact values than that of Mo-added specimen. And hardness property was affected by austempering temperature and holding time rather than amounts of alloying element.

• Journal of Powder Materials
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• v.1 no.1
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• pp.79-84
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• 1994

The mechanism of activated sintering of tungsten powder was discussed in terms of diffusion and segregation of activator atoms at W grain boundaries. Shrinkage behaviours of W-0.2wt.% Ni, W-0.2wt.% Cu or pure W powder compacts during sintering at low temperatures of 900~ $1200^{\circ}C$ were investigated. It was found that the Cu additive inhibits sintering process causing lower densification than pure W compact while remarkable shrinkage occurred in the Ni added W powder. Such contrary effect was explained by comparing self diffusion processes along Ni or Cu segregated W boundaries in which Ni segregants enhance but Cu atoms retard the migration of W atoms at W boundaries.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.377-379
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• 2005

This study has been conducted to clarify the effect of sulfur content and welding thermal cycles on reheat cracking susceptibility in the multi-pass weld metal of Fe-36%Ni alloy. Reheat cracking occurred in the preceding weld pass reheated by subsequent passes. Microscopic observations showed that reheat cracking propagated along grain boundaries which resulted in intergranular brittle fractures. The region where reheat cracking occurred and the number of cracks increased with the increase in sulfur content of the alloys. These experimental results suggested that reheat cracking was associated with the embrittlement of grain boundaries, which was promoted by sulfur and subsequent welding thermal cycles. AES analysis indicated that the sulfur segregation occurred at grain boundaries in the reheated weld metal. On the basis of these results, the cause of reheat cracking in multi-pass welding can be attributed to hot ductility loss of weld metals due to sulfur segregation which was accelerated by the reheating with multi-pass welding thermal cycles.

• Journal of Welding and Joining
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• v.15 no.4
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• pp.78-89
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• 1997

This study has evaluated the weld metal solidification cracking behavior of several Ni base superalloys (Incoloy 825, Inconel 718 and Inconel 600). Austenitic stainless steels(304, 310S) were also included for comparison. In addition, a possible mechanism of solidification cracking in the fusion zone was suggested based on the extensive microstructural examinations with SEM, EDAX, TEM, SADP and AEM. The solidification cracking resistance of Ni base superalloys was found to be far inferior to that of austenitic stainless steels. The solidification cracking of Incoloy 825 and Inconel 718 was believel to be closely related with the Laves-austenite (Ti rich in 825 and Nb rich in 718) and MC-austenite eutectic phases formed along the grain boundaries during solidification. Cracking in Inconel 600 was always found along the grain boundaries which were enriched with Ti and P. Further, solidifidcation cracking resistance was dependent not only upon the type of love melting phases but also on the amount of the phases along the solidification grain boundaries.

• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.109-114
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• 2003

The purpose of this study Is to investigate the effect of $V_2$O$_{5}$ addition on the microstructures and magnetic properties of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt％ $V_2O_{5}$-doped NiCuZn ferrite pastes. With increasing the $V_2O_{5}$ content, the exaggerated grain growth of ferrite layers was developed due to the promotion of Ag diffusion and Cu segregation into the grain boundaries oi ferrites, which affected significantly the magnetic properties of the chip inductors. After sintering at $900^{\circ}C$, the inductance at 10 MHZ of the 0.5 wt％ $V_2O_{5}$-doped chip inductor was 3.7 ${\mu}$H less than 4.2 ${\mu}$H of the 0.3 wt% $V_2O_{5}$-doped one, which was thought to be caused by the residual stress at the ferrite layers increased with the promotion of Ag diffusion and Cu segregation. The quality factor of the 0.5 wt% $V_2O_{5}$-doped chip inductor decreased with increasing the sintering temperature, which was considered to be caused by the electrical resistivity of the ferrite layer decreased with the promotion of Ag/cu segregation at the grain boundaries and the growth of the mean grain size of ferrite due to exaggerated grain growth of ferrite layers.

• Journal of the Korean Magnetics Society
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• v.7 no.4
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• pp.205-211
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• 1997

The magnetic properties change which was induced by addition of small amount of Ni into Cr underlayer in CoCrTa/ CrNi thin film deposited by electron beam evaporator was investigated. The additional Ni element was found to be beneficial for incease in the coercivity of the thin film deposited at the room temperature. The origin of coercivity increase was elucidated by crystal orientation and microstructure investigation using XRD and AFM respectively. It was found that the grain size were increased by Ni addition. The coercivity of the film with CrNi underlayer is lower than that of film with Cr underlayer when prepared with higher substrate temperature. This result may be originated with the increase in grain size. When film was deposited at 280 $^{\circ}C$ substrate temperature, Cr segregation in grain boundary is found to be the other factor for determining coercivity value.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.306-310
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• 1992

Effects of hafnium, boron and zirconium on the ductility of Ni$_3$(Al, Fe) intermetallic compounds were studied using tensile test and SIMS analysis. Ni$_3$(Al, Fe) alloy with 0.1 at.% Hf, 0.05 at.% B and 0.1 at.% Zr additions showed maximum elongations of about 30% at 300K, 10% at 300K and 14% at 473K, respectively. The fracture mode of the alloy without the additive was the mixture of intergranular and transgranular fractures, but the addition of Hf, Zr or B changed the fracture mode to transgranular only. SIMS analysis showed that the beneficial effects of Hf, Zr or B segregation on the grain boundary strength are consistent with the grain boundary cohesion theory.