• Carbon letters
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• v.5 no.4
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• pp.186-190
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• 2004

In this work, a nickel metal (Ni) electroplating on the activated carbon fiber (Ni/ACFs) surfaces was carried out to remove the toxic hydrogen chloride (HCl) gas. The surface properties of the treated ACFs were determined by using nitrogen adsorption isotherms at 77 K, SEM, and X-ray diffraction (XRD) measurements. HCl removal efficiency was confirmed by a gas-detecting tube technique. As a result, the nickel metal contents on the ACF surfaces were increased with increasing the plating time. And, it was found that the specific surface area or the micropore volume of the ACFs studied was slightly decreased as increasing the plating time. Whereas, it was revealed that the HCl removal efficiency containing nickel metal showed higher efficiency values than that of untreated ACFs. These results indicated that the presence of nickel metal on the ACF surfaces played an important role in improving the HCl removal over the Ni/ACFs, due to the catalytic reactions between nickel and chlorine.

• Journal of the Korean institute of surface engineering
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• v.32 no.2
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• pp.172-181
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• 1999

The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and electrochemical method. The deposition rate was dependent with DMAB concentration. The polarization resistance of the precipitation reaction was reduced with DMAB concentration. The precipitation reaction rate of Ni-B deposits was controlled by the oxidation rate of DMAB as the source of electron. The boron content of the deposit was constant at about 5.5wt%, even when DMAB concentration in the solution was increased. The effect of temperature and stabilizer ($Pb(NO_3)_2$) concentration on deposition rate was shown to have co-dependent behaviors.

• The Korean Journal of Ceramics
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• v.6 no.4
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• pp.405-407
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• 2000

Polycrystalline films of Ni- and Co-ferrites films are prepared from aqueous solution at $90^{\circ}C$ by ferrite plating, which are subjected to Fe$^57$ conversion electron Mossbauer spectroscopy in backscatter mode. The average angle of Fe spins relative to the film plane is evaluated as 18 degree and 82 degree for the Ni- and Co-ferrite films, respectively, indicating a prominent magnetic anisotropy parallel and perpendicular to the film plane. It was also verified by the magnetization measurements.

• Journal of the Korean institute of surface engineering
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• v.21 no.1
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• pp.3-9
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• 1988

An electroless plating both for normal orientation of HCP-structure of Co-P to the film plane was developed. An ammonical succinate-citrate bath containg MnSo4, NiSO4 was studied Ni was codeposited into the films in order to decrease the saturation magentization (MS) since low Ms is necessary to decrease the magentizing fild. Mn was also codeposited to increase perpendicular orentaon of Co-P film. Effects on film composition and magnetic properties were studid in connection with follwing four factors such as concentration of NiSo4 and MnSo4, bath temp and pH.

• Transactions of the Korean hydrogen and new energy society
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• v.31 no.1
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• pp.23-32
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• 2020

The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

• Polymer(Korea)
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• v.24 no.5
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• pp.721-727
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• 2000

The electrolytic plating of a metallic nickel on carbon fiber surfaces was carried out to improve mechanical interfacial properties of carbon fiber/epoxy resin composites. The surface characteristics of carbon fibers and the mechanical interfacial properties of final composites were characterized by X-ray photoelectron spectroscopy (XPS) and interlaminar shear strength (ILSS), respectively. It was found that the electrolytic Ni-plating conditions significantly affected the degree of adhesion at interfaces between carbon fibers and epoxy resin matrix in a composite system. Especially, the increase of O,$_{1s}$/$C_{1s}$ ratio, production of NiO groups, and formation of metallic nickel on the nickel-plated carbon fiber surfaces led to an increase of the ILSS of the composites. Also, the ILSS of the composites was greatly correlated with the $O_{1s}$/$C_{1s}$ ratio of the carbon fibers treated in this work.is work.

• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.103-113
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• 1991

Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30$0^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50$0^{\circ}C$, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.56-56
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• 2001

Ni-W alloy deposit is one of the best alternatives to hard chromium plating because of its good mechanical properties (high hardness, high strength, and good wear resistance). Ni-W alloy is deposited from weakly acidic or alkaline electrolytic bath with nickel sulfate, sodium tungstate or APT, and some kinds of organic hydroxy-acid complex and ammonia salts. W content of the deposit can be changed from 0 to 5Owt% and the coating with high W content is more attracted. But, meanwhile, the deposited layers are always found high internal stress, which cause them to become brittle and to bond insufficiently with the substrate. On the second hand, as the W content is incresed, the current efficiency reduced, which results in large quantities of hydrogen evolution and then produces bubbles on surface and pitting appearance In this paper, the influence of some additives on Ni-W alloy electroplating was investigated by means of compositional analysis and SEM. The initial results showed that 2-butyne-1,4-diol was the best brightener for Ni-W plating process. It could brighten and level deposit, but decreased the cathodic current efficiency. Its optimum concentration range is from O.lgjL to 0.5gjL. Besides, three kinds of additives including 2-butyne-1,4-diol were examined with Dagguchi method.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.