• Korean Journal of Materials Research
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• v.21 no.6
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• pp.309-313
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• 2011

The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.65-69
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• 2012

Composite coating can be manufactured during the electroplating with the bath containing a suspension of particles: ceramic, polymer, nanopowders. Improvement of hardness, wear resistance, corrosion resistance and lubrication properties are well-known advantage of composite coating. In this study, nano $TiO_2$ powder dispersed Ni composite plating was investigated. The improvement of surface hardness and photo decomposition effects can be expected in this coating. Zeta potential was measured with pH. The effect of ultrasonication time and types of ultrasonicator were studied to minimize the agglomeration of $TiO_2$ nanopowders in the electrolyte. Optimum conditions for nano $TiO_2$ dispersed Ni composite coating were $40mA/cm^2$ of current density, pH 3.5, and $50^{\circ}C$. At these conditions, $TiO_2$ nanoparticles contents in the Ni deposit was 15-20 at.%.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Composites Research
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• v.25 no.4
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• pp.93-97
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• 2012

Carbon nano fibers (CNFs) reinforced magnesium alloy (AZ91) matrix composites have been fabricated by liquid pressing process. In order to improve the dispersibility of CNFs and the wettability with magnesium alloy melt, CNFs were mixed with submicron sized SiC particles ($SiC_p$). Also, the mixture of CNFs and $SiC_p$ were coated with Ni by electroless plating. In liquid pressing process, AZ91 melts have been pressed hydrostatically and infiltrated into three reinforcement preforms of only CNFs, the mixture of CNFs and $SiC_p$ (CNF+$SiC_p$), and Ni coated CNFs and $SiC_p$ ((CNF+$SiC_p$)/Ni). Some CNFs agglomerates were observed in only CNFs reinforced composite. In cases of the composites reinforce with CNF+$SiC_p$ and (CNF+$SiC_p$)/Ni, CNFs were dispersed homogeneously in the matrix, which resulted in the improvement of mechanical properties. The compressive strengths of CNF+$SiC_p$ and (CNF+$SiC_p$)/Ni reinforced composites were 38% and 28% higher than that of only CNFs composite.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.672-678
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• 2011

In this work, carbon fibers were electrolessly Ni-plated in order to investigate the effect of metal plating on the electromagnetic shielding effectiveness (EMI-SE) of Ni-coated carbon fibers-reinforced epoxy matrix composites. The surfaces of carbon fibers were characterized by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Electric resistance of the composites was tested using a 4-point-probe electric resistivity tester. The EMI-SE of the composites was evaluated by means of the reflection and adsorption methods. From the results, it was found that the EMI-SE of the composites enhanced with increasing Ni plating time and content. In high frequency region, the EMI-SE didn't show further increasing with high Ni content (Ni-CF 10 min) compared to the Ni-CF 5 min sample. In conclusion, Ni content on the carbon fibers can be a key factor to determine the EMI-SE of the composites, but there can be an optimized metal content at a specific electromagnetic frequency region in this system.

• Composites Research
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• v.31 no.3
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• pp.111-116
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• 2018

In this paper, magnetic FeCoNi particles have been grown through electroless plating on the surface of graphene, and then this hybrid material has been dispersed by various surfactants to prepare films. The pyridine surfactant shows the highest dispersability and low surface resistance value (351 Ohm/sq) and the electromagnetic shielding ability at the frequency of 10 GHz. Specially, the evaporation of the pyridine during the drying process could be able to form the internal conductive network and high dispersion of FeCoNi on the surface of graphene.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.4
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• pp.134-139
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• 2008

A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.