• 한국자기학회지
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• 제3권4호
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• pp.289-292
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• 1993

3-Gun 고주파 마그네트론 스퍼터링법에 의해 [Ni/Fe/Cu] 다층박막과 [Fe/Ni/Fe/Cu] 다층 박막을 제조하고 Ni/Fe 두께비에 따른 자기저항특성을 조사하였다. 열처리에 의한 효과를 고나찰하기 위하여 진공열처리를 행하였다. 두 종류의 다층박막에서 사잇층 Cu 두께에 따른 자기저항의 진동 현 상을 관찰할 수 있었다. Ni과 Cu의 계면에 삼입된 Fe 두께가 약 $3\;\AA$일때 자기저항이 극대값을 보 였으며, Fe 두께가 $1~2\;\AA$일때 자기저항은 이에 비해 크게 감소하지 않았으나, 포화자장은 현저 히 감소하는 것으로 나타났다. ${[Fe(1\;\AA)/Ni(18\;\AA)/Fe(1\;\AA)/Cu(23\;\AA)]}_{20}Fe(80\;\AA)/Si$ 시편의 경우, 100 Oe의 포화자장에서 6%의 자기저항을 얻을 수 있었다. 열처리에 의해서는 자기저항이나 큰 변화를 관찰할 수 없었으며, 합금상 형성 여부는 확인할 수 없었다.

• Bulletin of the Korean Chemical Society
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• 제35권8호
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• pp.2431-2437
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• 2014

In this study, Ni, Ni-Cu and Ni/Cu catalysts were deposited onto C-fiber textiles via the electrophoretic deposition method, and the growth characteristics of carbon nanofibers on the deposited catalyst/C-fiber textiles were investigated. The catalyst deposition onto C-fiber textiles was accomplished by immersing the C-fiber textiles into Ni or Ni-Cu mixed solutions, producing the substrate by post-deposition of Ni onto C-fiber textiles with pre-deposited Cu, and passing it through a gas mixture of $N_2$, $H_2$ and $C_2H_4$ at $700^{\circ}C$ to synthesize carbon nanofibers. For analysis of the characteristics of the synthesized carbon nanofibers and the deposition pattern of catalysts, SEM, EDS, BET, XRD, Raman and XPS analysis were conducted. It was found that the amount of catalyst deposited and the ratio of Ni deposition in the Ni-Cu mixed solution increased with an increasing voltage for electrophoretic deposition. In the case of post-deposition of Ni catalyst onto substrates with pre-deposited Cu, both bimetallic catalyst and carbon nanofibers with a high level of crystallizability were produced. Carbon nanofibers yielded with the catalyst prepared in Ni and Ni-Cu mixed solutions showed a Y-shaped morphology.

• 대한금속재료학회지
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• 제48권11호
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Corrosion Science and Technology
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• 제17권4호
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• pp.176-182
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• 2018

Corrosion of the Cu alloy with 10wt% Ni in stagnant seawater with residual free chlorine was investigated. Despite that fact that Cu alloys are widely used for seawater applications due to their stubborn resistance to chloride attack, not much is known as to how the residual free chlorine in seawater affects corrosion of Cu and its alloys. In this work, immersion tests were conducted in the presence of different levels of chlorine for 90-10 Cu-Ni samples, one of the most frequently used Cu alloys for seawater application, mostly in shipbuilding. The results revealed no evidence for accelerated corrosion of the Cu-Ni alloy even in the presence of 5 ppm residual chlorine in seawater, signifying that the Cu-Ni alloy can be more tolerant to residual chlorine that has been commonly cited by the shipbuilding industry. However, comparison of polarization behavior of the alloy samples in the presence of different electrolytes with different concentrations of residual chlorine suggests that higher concentration of chlorine could increase the corrosion rate of the Cu-Ni alloy. Furthermore, it is suggested that microorganisms in the seawater could increase the corrosion rate of the Cu-Ni alloy by encouraging exfoliation of the corrosion product off the metal surface.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1996년도 추계연구발표회 논문개요집
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• pp.28-29
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• 1996

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1999년도 춘계학술대회 및 발표대회 강연 및 발표논문 초록집
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• pp.28-28
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• 1999

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1995년도 춘계연구발표회 논문개요집
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• pp.86-87
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• 1995

• Membrane and Water Treatment
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• 제10권3호
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• pp.201-206
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• 2019

In this study, we performed an electrowinning process for effective removal of metals (Cu and Ni) in solution and their recovery as solid forms. A complete removal of Cu and Ni (1,000 mg/L) was observed during four times recycling test, indicating that our electrowinning system can ensure the efficient metal removal with high stability and durability. In addition, we investigated effect of operation parameters (i.e., concentration of boric acid only for Ni, variation of pH, concentration of electrolyte ($H_2SO_4$), and cell voltage) on the efficiency of metal removal (Cu and Ni) during the electrowinning. The addition of boric acid significantly enhanced removal efficiency of Ni as the concentration of boric acid increased up to 10 g/L. Compared to negligible pH effect (pH 1, 2, and 4) on the Cu removal, we observed the increase in removal efficiency of Ni as the pH increased from 1 to 4. The electrolyte concentration did not significantly influence the removal of Cu and Ni in this study. We also obtained great removal rates of Cu and Ni at 2.5 V and 4.0 V, which were much faster than those at lower voltages. Finally, almost 99% of each Cu and Ni (1,000 mg/L) was selectively removed from the mixture of metals by adjusting pH and addition of boric acid after the completion of Cu removal. The findings in this study can provide a fundamental knowledge about effect of important parameters on the efficiency of metal recovery during the electrowinning.

• 전기화학회지
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• 제3권2호
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• pp.121-126
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• 2000

[ $AB_5$ ] 수소저장합금인 $LaNi_5$, 합금분말에 Ni 및 Cu 무전해 도금의 영향을 전기 화학적 실험을 통하여 고찰하였다. 전기 화학적 실험은 정전류 충$\cdot$방전 실험, 순환전류전위 실험, 교류 임피던스 실험 등을 실시하여 도금하지 않은 $LaNi_5$ 전극과 Ni 및 Cu 무전해 도금한 전극간의 특성을 비교 연구하였다. 현상학적인 분석으로는 SEM을 이용하여 분말상의 미세조직을 관찰하였으며 X-선 회절시험을 실시하였다 무전해 도금을 실시하여 Ni 및 Cu박막이 피복된 수소저장 합금은 활성화 특성파 싸이클 수명 등의 특성이 개선되었으며 도금하지 않은 전극에 비하여 반응속도가 증가하였다. 또한 충$\cdot$방전이 반복됨에 따라 전극과 전해질 계면에서의 전하이동저항이 현저하게 감소하였다. 따라서 본 연구에서 실시한 $LaNi_5$, 활물질에 Ni및 Cu 무전해 도금을 실시하면 초기 활성화반응을 촉진시키며 $LaNi_5$활물질이 전해질과의 직접 접촉을 피하게 되어 전극의 수명을 증가시키는 것을 알 수 있었다.

• 한국환경농학회지
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• 제9권2호
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• pp.113-119
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• 1990

토양중(土壤中) Cr, Ni, Cd, Cu, Zn을 각각(各各) 0, 20, 50, 100, 200ppm첨가(添加)하고 무와 배추의 발아(發芽) 및 생육(生育)에 미치는 각(各) 중금속(重金屬)의 영향(影響)을 조사(調査)하였다. 무우와 배추의 발아(發芽)는 Ni와 Cr 200ppm첨가(添加) 토양(土壤)에서 심한 억제(抑制)를 받았으나 Cu, Cd, Zn 200 ppm첨가(添加) 토양(土壤)에서는 크게 영향(影響)을 받지 않았다. 5종(種)의 중금속(重金屬)이 무우와 배추의 생육(生育) 억제(抑制)에 미치는 영향(影響)은 Cr>Ni>Cd>Cu>Zn순(順)였으며 무우보다 배추가 더 크게 억제(抑制)를 받았다. 무우에 대하여 50%이상(以上) 심한 생육억제(生育抑制)를 보였던 각 중금속(重金屬)의 첨가농도(添加濃度) Cr가 20ppm, Ni, Cd과 Cu은 50ppm, Zn은 200ppm였으며, 배추에 대하여 Cr, Ni, Cd, Cu가 20ppm, Zn은 200ppm였다. 중금속(重金屬)에 의한 2가지 작물(作物)의 생육억제(生育抑制)는 토양중(土壤中) 퇴비(堆肥)와 석회(石灰)의 첨가(添加)에 의하여 현저(顯著)히 경감(輕減)되었다.