• Korean Journal of Materials Research
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• v.9 no.9
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• pp.905-912
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• 1999

Tensile properties of powder metallurgy (PM) processed Cu-7.5Ni-5Sn alloys, either as-received or additionally solution heat treated, were examined as a function of aging time. It was found that the as-received Cu-7.5Ni-5Sn alloys showed an abrupt increase in tensile strength after aging at $350^{\circ}C$ for 20 minutes, due to the metastable ${\gamma}$\\` precipitation and a marginal Spinodal decomposition. The resolutionized PM Cu-7.5Ni-5Sn alloys, on the other hand, showed a gradual increase in tensile strength from the very early stage of aging. The overall tensile strength of resolutionized PM Cu-7.5Ni-5Sn alloys, however, was lower than that of the as-received and aged counterparts, due to the grain growth during resolutionization. Afterprolonged aging for the as-received PM Cu-7.5Ni-5Sn alloys, a considerable amount of discontinuous precipitates formed along the grain boundaries. The formation and growth kinetics of such discontinuous precipitates appeared to be dependent on the heat treatment conditions, and affect the mechanical properties greatly.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.5
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• pp.994-1000
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• 2001

With the development of electromagnetic communication technology and increased use of electromagnetic wave, the countermeasure of EMI(Electromagnetic Interference) becomes more important socially, and interest for the electromagnetic wave absorber has also increased. In this paper, we have studied characteristics of frequency dependency on complex permittivity and complex permeability according to the changes of composition rate and sintering temperature of NiCuZn ferrite also known as electromagnetic wave absorber and further looked into effect of electromagnetic wave absorption properties. From the measurement where the composition of $Fe_2O_3$ and ZnO of NiCuZn ferrite was fixed at 49 and 34 mol% respectively while composition of NiO and CuO has been varied at each test, we found out that Initial permeability and permittivity were high and the absorbing ability of electromagnetic wave recorded best with $loss tangent(=\mur"/\mur')$ displays more than 1 within the frequency band of 2MHz~9.5MHz when the composition ratio of NiO was ranged around 8.5~9.5 mol% and the sintering temperature was $1080^{\circ}C$.TEX>.

• Journal of the Korean Magnetics Society
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• v.9 no.1
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• pp.41-47
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• 1999

$Buffer/[NiFe/Cu/CoFe(Co)/Cu]_N$ spin valve multilayers prepared by dc magnetron sputtering on a corning glass substrate using NiFe and CoFe(Co) posses different coercivities. Dependence of magnetoresistance on the type and thickness of buffer layer, thickness of Cu, NiFe, stacking number of multilayer, substrate temperature and annealing temperature in the form $[NiFe/Cu/CoFe(Co)/Cu]_N$ spin-valve multilayers were investigated. To evaluate effect of magnetoresistance for this samples, X-ray diffraction analysis, vibrating sample magnetometer analysis, and magnetoresistance measurement (4-probe method) were performed the maximum magnetoresistance ratio and coercivity were 7.5 % and 140 Oe, respectively for $Cr-50{\AA}/[NiFe-20{\AA}/Cu-{\AA}/Co-20{\AA}/Cu-50{\AA}]_10$ at substrate temperature of 9$0^{\circ}C$. Magnetoresistance slope maintained 0.25%/Oe until 15$0^{\circ}C$ of annealing temperature, and then decreased to 0.03%/Oe at 20$0^{\circ}C$. It was confirmed that the main factor of thermal stability was deteriorating of soft magnetic properties in the NiFe layer.

• Journal of the Korean Magnetics Society
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• v.20 no.2
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• pp.41-44
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• 2010

The Cu thickness dependence of magnetic sensitivity for the NiFe/Cu/NiFe/IrMn spin valve multilayer was investigated. The magnetic properties measured by minor MR curves for the Ta(5 nm)/NiFe(8 nm)/Cu(3.5 nm)/NiFe(4 nm)/IrMn(8 nm)/Ta(2.5 nm) multilayer is MR = 1.46 %, MS = 2.0 %/Oe, $H_c\;=\;2.6\;Oe$, and $H_{int}\;=\;0.1\;Oe$. The magnetic sensitivities of GMR-SV devices with ten different widths and a same length of $4.45\;{\mu}m$ by fabricated by photo lithography decreased from 0.3 %/Oe to 0.06%/Oe as from a width of $10\;{\mu}m$ to $1\;{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.83-88
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• 2018

The electromigration (EM) tests were performed at $150^{\circ}C$ with $1.5{\times}10^5A/cm^2$ conditions in order to investigate the effect of non-conductive film (NCF) trap on the electrical reliability of Cu/Ni/Sn-Ag microbumps. The EM failure time of Cu/Ni/Sn-Ag microbump with NCF trap was around 8 times shorter than Cu/Ni/Sn-Ag microbump without NCF trap. From systematic analysis on the electrical resistance and failed interfaces, the trapped NCF-induced voids at the Sn-Ag/Ni-Sn intermetallic compound interface lead to faster EM void growth and earlier open failure.

• Proceedings of the Korean Magnestics Society Conference
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• 1997.11a
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• pp.30-31
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• 1997

• Proceedings of the Korean Magnestics Society Conference
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• 1997.11a
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• pp.28-29
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• 1997

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.548-551
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• 1995

The effect of Cu substitution on the properties of NiZn ferrites sintered at low temperature with composition is investigated. The densification of NiCuZn ferrite in dependent upon Cu content in the composition of (N/sub 0.5-x/Cu/sub x/ Zn/sub 0.5/O)(Fe/sub 2/O/sub 3/)/sub 0.98/. Electrical resistivity is maximum at x=0.2. Dispersion characteristics of complex permeability of (Ni/sub 0.5-x/ Cu/sub x/Zn/sub 0.5/O)(Fe/sub 2/O/sub 3)/sub 0.98/ is observed above x=0.3 and relaxation frequency increases with higher temperature. The magnetic loss of NiCuZn ferrite is occurred above the Cu content x=0.3 at a low frequency.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.