• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.3-6
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• 2004

반도체 디자인, 공정 기술 및 패기지 기술의 발달에 따라 전력용 반도체는 소형화, 고성능화, 지능화하고 있다. 고속 구동이 용이한 때문에 MOSFET이나 IGBT등의 MOS-gate형 전력 반도체의 발전이 두드려지며, trench, charge balance, NPT 기술등이 패키지 기술과 더불어 이를 위한 주요 기술이 될것으로 보인다. SiC나 GaN등의 Wide Band Gap 물질들을 사용한 차세대 전력 반도체 연구도 활발히 진행되고 있다.

• 정보관리학회지
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• 제9권1호
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• pp.105-105
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• 1992

본 연구는 차세대 정보시스템으로 정착되어 가는 지능형 정보시스템의 등장배경과 개념, 그리고 지능형 정보시스템 구축에 필요한 기술인 객체지향 시스템, 전문가 시스템, 하이퍼미디아 등을 고찰하였다. 나아가 이들 기술이 문헌정보학의 영역에 적용되어 개발된 시스템을 중심으로 지능형 정보시스템을 소개하였고 앞으로의 전망에 대해 기술하였다.

• 대한안전경영과학회지
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• 제14권4호
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• pp.211-218
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• 2012

In this paper, we propose a system architecture of the AMI to be applied in the modern agricultural sector. Agricultural electricity costs in South Korea is very inexpensive compared with other industries. It is expected to increase oil prices to rise over the medium to long term so the facilities must to be installed for farmers in terms of energy savings and energy costs. The research and development of plant factory which can replace the ills of modern agriculture is very active. The technologies of smart grid and plat factory are good paradigm of next generation agricultural sector. Good use of smart grid technologies, the traditional energy consumption industries, agriculture sector can be self-sufficiency industry. In this article the AMI architecture is developed and it will be applicable for modern farmers plant factory.

• 전기학회논문지
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• 제67권12호
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• pp.1577-1586
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• 2018

The emergence of the Smart Grid is an integrated solution for the next generation power system that combines IT technology in the power system to create optimal energy utilization and various services. However, these convergence technologies (power systems and information communications) are not only improving the related technologies but also producing various problems especially exposure to cyber risk. In particular, the intelligent power grid has security vulnerabilities through real-time information sharing among various organically linked systems, and it is more complicated than the cyber risk problem in the existing IT field and is directly connected to national disaster accidents. Therefore, in order to construct and operate a more stable smart grid, this paper analyzes the system of power system control system in Korea, and proposes a cyber security element definition and a countermeasure establishment method of power monitoring & control systems based on security standards of smart grid (No. SPS-SGSF-121-1-1).

• 전자통신동향분석
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• 제37권2호
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• pp.53-61
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• 2022

MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.

• 전자통신동향분석
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• 제37권3호
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• pp.41-51
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• 2022

This article presents an overview of the key technologies in the communications payload of broadband LEO satellite communications systems. In recent years, new developments have been realized for LEO satellite communications. SpaceX's Starlink, a technology leader in this field, offers premium services with satellites carrying in-house developed communications payloads. OneWeb, Amazon, Telesat, and Boeing are also developing LEO satellite communications payloads. The communications payload consists of user link antennas, inter-satellite link communications equipment, feeder link antennas, and a digital processor. Highly sophisticated technologies of compact active phased array antennas for generating multiple hopping beams and light laser communication equipment for ultra-high-speed inter-satellite communication will be applied to next- generation payloads.

• 방송공학회논문지
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• 제27권7호
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• pp.1021-1033
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• 2022

After the Versatile Video Coding (VVC)/H.266 standard was completed, the Joint Video Exploration Team (JVET) began to investigate new technologies that could significantly increase coding gain for the next generation video coding standard. One direction is to investigate signal processing based tools, while the other is to investigate Neural Network based technology. Neural Network based Video Coding (NNVC) has not been studied previously, and this is the first trial of such an approach in the standard group. After two years of research, JVET produced the first common software called Neural Compression Software (NCS) with two NN-based in-loop filtering tools at the 27th meeting and began to maintain NN-based technologies for the common experiment. The coding performances of the two filters in NCS-1.0 are shown to be 8.71% and 9.44% on average in a random access scenario, respectively. All the material related to NCS can be found in the repository of the JVET. In this paper, we provide a brief overview and review of the NNVC activity studied in JVET in order to provide trend and insight for the new direction of video coding standard.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• BMB Reports
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• 제57권5호
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• pp.216-231
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• 2024

Mammalian genomes are intricately compacted to form sophisticated 3-dimensional structures within the tiny nucleus, so called 3D genome folding. Despite their shapes reminiscent of an entangled yarn, the rapid development of molecular and next-generation sequencing technologies (NGS) has revealed that mammalian genomes are highly organized in a hierarchical order that delicately affects transcription activities. An increasing amount of evidence suggests that 3D genome folding is implicated in diseases, giving us a clue on how to identify novel therapeutic approaches. In this review, we will study what 3D genome folding means in epigenetics, what types of 3D genome structures there are, how they are formed, and how the technologies have developed to explore them. We will also discuss the pathological implications of 3D genome folding. Finally, we will discuss how to leverage 3D genome folding and engineering for future studies.

• 전자통신동향분석
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• 제39권2호
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• pp.43-53
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• 2024

The media environment is rapidly evolving to be tailored to viewers using personal mobile devices in accordance with technological evolution and changes in social structures. Broadcast media technology is also advancing to enable new services, including data casting, in various reception environments beyond the existing fixed environment and one-way audio/video content services. In addition, technologies to increase the transmission capacity to accommodate next-generation large-capacity media content as well as communication network utilization and convergence technologies are being developed to facilitate interactive services and expand the broadcasting coverage. We discuss the current status and future prospects in broadcasting technology for terrestrial and mobile communication systems and analyze broadcasting technology elements for upcoming media environments relying on generative artificial intelligence.