• Title/Summary/Keyword: Nanoparticle ink

Search Result 41, Processing Time 0.027 seconds

Synthesis of Gold Nanoparticles by Chemical Reduction Method for Direct Ink Writing

  • Cho, Young-Sang;Son, Soo-Jung;Kim, Young-Kuk;Chung, Kook-Chae;Choi, Chul-Jin
    • Journal of Powder Materials
    • /
    • v.17 no.5
    • /
    • pp.390-398
    • /
    • 2010
  • Aqueous gold nanoparticle dispersion was synthesized by chemical reduction method using diethanolamine as reducing agent and polyethyleneimine as dispersion stabilizer. The synthesis conditions for the stable dispersion of the gold nanoparticle suspension were determined by changing the amount of the reducing agent and dispersant during the wet chemical synthesis procedures. The face centered cubic lattice structure of the gold nanoparticles was confirmed by using X-ray diffraction and the morphologies of the nanoparticles were observed by transmission electron microscope. The synthesized gold nanoparticle dispersion was concentrated by evaporating the dispersion medium at room temperature followed by the addition of ethyleneglycol as humectant for the increase of the elastic properties to obtain gold nanoparticle inks for direct ink writing process. The line patterns were obtained with the gold nanoparticle inks during the writing procedures and the morphologies of the fine patterns were observed by scanning electron microscope.

Study of Specific Resistance of Conductive Ink According to Temperature During Laser Sintering Process (전도성 잉크의 레이저 열경화 공정 시 온도에 따른 비저항 연구)

  • Lee, Dae-Geon;Park, Yong-Han;Park, Ji-Young;Kim, Dong-Keun;Moon, Yoon-Jae;Moon, Seung-Jae;Hwang, Jun-Young;Kang, Heui-Seok
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.37 no.2
    • /
    • pp.119-124
    • /
    • 2013
  • In this study, the two-dimensional transient temperature of printed Ag nanoparticle ink during continuous wave laser sintering was calculated. Ag nanoparticle ink was printed on a glass substrate by inkjet printing. Then, a 532-nm continuous wave laser with different laser intensities was irradiated on the printed Ag nanoparticle ink for 60 s. During laser irradiation, the in-situ specific resistance of the sintered ink was measured. To obtain the transient temperature of the sintered ink during the laser sintering process, a two-dimensional transient heat conduction equation was derived by applying the Wiedemann-Franz law. It was found that the specific resistance of the sintered ink decreased with an increase in the sintering temperature of the printed ink.

Ultrafine ITO Nanoparticle for Ink Jet Printing

  • Hong, Sung-Jei;Kim, Yong-Hoon;Han, Jeong-In
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08a
    • /
    • pp.467-470
    • /
    • 2007
  • Ultrafine Indium tin oxide (ITO) nanoparticle was successfully fabricated by low temperature synthetic method (LTSM). Mean size of ITO nanoparticle is 5 nm, and uniformly dispersed with (222) orientated cubic structure. Using the nanoparticle, ITO thin film with good optical and electrical properties was fabricated by inkjet printing.

  • PDF

Influence an Oxide Layer Thickness on Resistivity of Cu Conductive Film and Ink-jet Printing of Cu Nanoparticle Ink

  • Jeong, Sun-Ho;Woo, Kyoo-Hee;Kim, Dong-Jo;Lim, Soon-Kwon;Kim, Jang-Sub;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08a
    • /
    • pp.724-726
    • /
    • 2007
  • We have developed the synthesis method to reduce the surface oxide layer in Cu nanoparticle, which is based on controlling the molecular weight of capping polymer. In addition, we demonstrated how the variation of oxide layer thickness influences the resistivity of conductive Cu film.

  • PDF

Patterning and Sintering of Silver Nano Ink by the Ink-Jet Printing Technology (잉크젯에 의한 은나노 잉크의 패턴닝 및 소결)

  • Chun, Myoung-Pyo;Park, Myung-Sung;Myoung, Seong-Jae;Nam, Joong-Hee;Kim, Byung-Ik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.06a
    • /
    • pp.329-329
    • /
    • 2008
  • Silver nanoparticles were synthesized by polyol process and its particle size observed with TEM is about 20nm. Silver nanoparticle ink with metal content of 30wt% was prepared using solvent of ethanol and has low viscosity of 5cps (10rpm). This ink was printed by as ink-jet printer on Al2O3 and Silicone substrate. The resistivity and morphology of the printed film was investigated as a function of sintering termperature.

  • PDF

Effects of Poly(Styrene-Co-Maleic acid) as Adhesion Promoter on Rheology of Aqueous Cu Nanoparticle Ink and Adhesion of Printed Cu Pattern on Polyimid Film (수계 Cu 나노입자 잉크에서 Poly(styrene-co-maleic acid) 접착 증진제가 잉크 레올로지와 인쇄패턴의 접착력에 미치는 영향)

  • Jo, Yejin;Seo, Yeong-Hui;Jeong, Sunho;Choi, Youngmin;Kim, Eui Duk;Oh, Seok Heon;Ryu, Beyong-Hwan
    • Korean Journal of Materials Research
    • /
    • v.25 no.12
    • /
    • pp.719-726
    • /
    • 2015
  • For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the "Newtonian flow" and has a low viscosity under $10mPa{\cdots}S$, which is applicable to inkjet printing. The Cu patterns with a linewidth of $50{\sim}60{\mu}m$ are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-co-maleic acid)-free inks. The resistivities of Cu films are measured to be $10{\sim}15{\mu}{\Omega}{\cdot}cm$ at annealing temperature of $300^{\circ}C$.