• Title/Summary/Keyword: Nanoimprint lithography

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A study on the stamp-resist interaction mechanism and atomic distribution in thermal NIL process by molecular dynamics simulation (분자동역학 전산모사를 이용한 나노임프린트 리소그래피 공정에서의 스탬프-레지스트 간의 상호작용 및 원자분포에 관한 연구)

  • Yang, Seung-Hwa;Cho, Maeg-Hyo
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.343-348
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    • 2007
  • Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

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Replication of Patterned Media Using Nano-injection Molding Process (패턴드 미디어를 위한 나노 사출 성형 공정에 관한 연구)

  • Lee, Nam-Seok;Choi, Yong;Kang, Shin-Ill
    • Transactions of Materials Processing
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    • v.14 no.7 s.79
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    • pp.624-627
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    • 2005
  • In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by I-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50nm in diameter, 150nm in pitch, and 50nm in depth.

Replication of High Density Patterned Media (고밀도 패턴드 미디어 성형에 관한 연구)

  • Lee, Nam-Seok;Choi, Yong;Kang, Shin-Ill
    • Transactions of the Society of Information Storage Systems
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    • v.1 no.2
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    • pp.192-196
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    • 2005
  • In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

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Replication of Patterned Media Using Nano-injection Molding Process (패턴드 미디어를 위한 나노 사출 성형 공정에 관한 연구)

  • Lee, Nam-Seok;Choi, Yong;Kang, Shin-Ill
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.60-63
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    • 2005
  • In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth.

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직접 Printing 기술을 이용한 hydrogen silsesquioxane (HSQ) 아날로그 나노 패턴 제작 기술에 대한 연구

  • Yang, Gi-Yeon;O, Sang-Cheol;Lee, Heon
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.30.1-30.1
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    • 2010
  • Hydrogen silsesquioxane (HSQ)는 spin-on glass (SOG)의 일종으로 spin-coating이 가능하며 $400^{\circ}C$ 이상의 고온에서의 어닐링을 통해 silica로 변환되는 물질이다. 이 물질은 가시광선 영역에서 95% 이상의 높은 투과도를 나타내며 산화물로의 변환 공정이 간단하며 표면 개질이 용이하기 때문에 나노 바이오, 반도체, 광전자 소자 등의 다양한 분야로의 적용이 기대되는 물질이다. 최근 나노 기술의 발전에 따라 다양한 나노 구조물을 이용하여 소자들의 효율을 향상시키는 연구가 활발하게 진행되고 있다. 따라서 HSQ를 이용하는 소자의 효율을 높이기 위해서는 쉽고 간단하면서 생산성이 높은 HSQ 나노 구조물 제작 기술에 대한 연구가 필요하다. 현재 개발된 대면적 HSQ 나노 구조물 제작 기술로는 e-beam lithography, x-ray lithography, room temperature nanoimprint lithography 등이 있다. 하지만 이와 같은 나노 패터닝 기술들은 생산성이 낮거나 공정이 복잡한 단점이 있다. 본 연구에서는 poly(dimethylsiloxane) (PDMS) mold를 이용한 직접 printing 기술을 통해 HSQ 나노 구조물을 제작하는 기술을 개발하였다. 이 기술은 대면적에 간단한 기술로 HSQ 나노 패턴을 제작할 수 있으며 master mold의 패턴이 그대로 HSQ layer로 전사되기 때문에 제작이 까다로운 아날로그 패턴도 손쉽게 제작할 수 있는 장점을 가지고 있다. 따라서 이와 같은 HSQ 직접 printing 기술을 이용하여 HSQ 아날로그 나노 패턴을 제작하고 이의 응용기술에 대한 연구를 진행하였다.

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Viscoelastic Finite Element Analysis of Filling Process on the Moth-Eye Pattern (모스아이 패턴의 충전공정에 대한 점탄성 유한요소해석)

  • Kim, Kug Weon;Lee, Ki Yeon;Kim, Nam Woong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.4
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    • pp.1838-1843
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    • 2014
  • Nanoimprint lithography (NIL) fabrication process is regarded as the main alternative to existing expensive photo-lithography in areas such as micro- and nano-electronics including optical components and sensors, as well as the solar cell and display device industries. Functional patterns, including anti-reflective moth-eye pattern, photonic crystal pattern, fabricated by NIL can improve the overall efficiency of such devices. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. In this paper, a cavity-filling process of the moth-eye pattern during the thermal-NIL within the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer, were investigated with three-dimensional finite element analysis. The effects of initial thickness of polymer resist and imprinting pressure on cavity-filling process has been discussed. From the analysis results it was found that the cavity filling can be completed within 100 s, under the pressure of more than 4 MPa.

UV Nanoimprint Lithography using an Elementwise Patterned Stamp and Pressurized Air (Elementwise Patterned Stamp와 부가압력을 이용한 UV 나노임프린트 리소그래피)

  • Sohn H.;Jeong J.H.;Sim Y.S.;Kim K.D.;Lee E.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.672-675
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    • 2005
  • To imprint 70-nm wide line-patterns, we used a newly developed ultraviolet nanoimprint lithography (UV-NIL) process in which an elementwise patterned stamp (EPS), a large-area stamp, and pressurized air are used to imprint a wafer in a single step. For a single-step UV-NIL of a 4' wafer, we fabricated two identical $5'\times5'\times0.09'(W{\times}L{\times}H)$ quartz EPSs, except that one is with nanopatterns and the other without nanopatterns. Both of them consist of 16 small-area stamps, called elements, each of which is $10\;mm\;\times\;10\;mm$. UV-curable low-viscosity resin droplets were dispensed directly on each element of the EPSs. The volume and viscosity of each droplet are 3.7 nl and 7 cps. Droplets were dispensed in such a way that no air entrapment between elements and wafer occurs. When the droplets were fully pressed between ESP and wafer, some incompletely filled elements were observed because of the topology mismatch between EPS and wafer. To complete those incomplete fillings, pressurized air of 2 bar was applied to the bottom of the wafer for 2 min. Experimental results have shown that nanopatterns of the EPS were successfully transferred to the resin layer on the wafer.

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