• 제목/요약/키워드: Nano-machining

검색결과 189건 처리시간 0.032초

단결정 실리콘의 초정밀가공 (Nano-turning of single crystal silicon)

  • 김건희;도철진;홍권희;유병주;원종호;박상진;안병민
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.939-942
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    • 2000
  • Single point diamond turning technique for optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material.

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Micro/Meso부품 대응형 마이크로 기계가공시스템 기술 연구 (Design of Micro-Machining System for Micro/Meso Mechanical Component)

  • 박종권;경진호;노승국;김병섭;박중호
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2005년도 춘계학술대회 논문집
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    • pp.377-382
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    • 2005
  • This paper describes the design of micro machine tools system for mechanical machining of micro/meso scale mechanical parts. The micro machining systems such as $\mu-Late$, $\mu-milling/drilling$ machine and $\mu-grinding$ machine are the basic elements constructing $\mu-factory$ which gains more attention recently because of increasing needs of mico and nano-parts in various industrial and medical area. A miniaturized 3-axis milling machine with VCM stage and air spindle and palm-top size micro-late are designed, and air bearing stage and stepwise linear motion system with PZT are studied for motion system. The micro cutting characteristics are investigated experimentally, and reconfigurable machine structures are also considered.

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나노미터 표면가공시 절삭조건에 관한 연구 (A Study on the Cutting Conditions in Machining for Nanometer Surface)

  • 문재일;김부태;김영일;허성중
    • 한국정밀공학회지
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    • 제15권9호
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    • pp.152-157
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    • 1998
  • Since early 1960s, the high precision machining technology, so called ultra-precision technology or nano technology, has been developed in many Held based on single point diamond turning technology. The major application of this technology is the optical components with aspherical surfaces. Now a days, customer requires the smaller and lighter optical elements, such as camera video and etc., with higher performance for convenience. So, the manufacturer focuses on the ultra-precision technology. Thus, this technology becomes the major target to challenge the advanced barrier for the next machining technology.

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엔드밀 가공을 이용한 스페큘러 홀로그램 제작 (Machinining of Specular Hologram using End-mill Technology)

  • 전은채;차진호;이재령;최환진;김창의;제태진;김휘;최두선
    • 한국기계가공학회지
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    • 제13권4호
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    • pp.1-6
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    • 2014
  • The specular hologram is one type of hologram, and it consists of many arcs. They are very easy to fabricate and can even be machined by hand and a compass. In this study, we designed two squares having different depths and consisting of many arcs, after which we machined the arcs using end-mill technology. The width of the machined arcs showed high repeatability. Moving tracks were observed on the bottom surface, and top burrs were noted. In spite of them, the phenomenon of the specular hologram was observed when an observer and a light source stood on the same side. The two squares seemed to have different depths when they were observed from the left and right directions. In this study, it was verified that a specular hologram can be manufactured by end-mill technology.

반도체 웨이퍼 다이싱용 나노 복합재료 블레이드의 제작 (Fabrication of Organic-Inorganic Nanocomposite Blade for Dicing Semiconductor Wafer)

  • 장경순;김태우;민경열;이정익;이기성
    • Composites Research
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    • 제20권5호
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    • pp.49-55
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    • 2007
  • 반도체 쿼츠 웨이퍼 다이싱용 블레이드는 마이크로/나노 디바이스와 부품을 제조하기 위해 고정밀도의 가공성을 요구한다. 따라서 균일한 마이크로/나노 선폭의 가공을 위해서는 블레이드의 제작 단계에서 균일한 두께와 밀도를 유지하는 것이 중요하다. 기존의 실리콘웨이퍼 가공을 위해서는 금속의 블레이드가 사용되고 있지만 쿼츠 웨이퍼 가공을 위해서는 고분자 복합재가 사용된다. 이러한 복합재는 가공성, 전기전도성, 그리고 적절한 강도와 연성 및 마모저항성이 있어야 한다. 그러나 기존의 건식성형 공정으로는 균일성을 유지하기 위해 많은 공정과 비용이 소비되고 있다. 본 연구에서는 도전성 나노 세라믹스 분말, 연마재 세라믹스 분말에 열경화성 수지, 전도성 고분자를 혼합한 복합재 분말을 습식성형 공정에 의해 제조, 평가하는 연구를 수행하였다. 먼저 복합재 분말을 액상과 혼합하여 블레이드를 제작하였으며, 액상의 종류, 액상 건조공정의 영향을 고찰하였다. 평가는 마이크로미터 측정기와 현미경을 이용하여 두께를 측정하였다. 두께편차와 기공률, 밀도, 경도, 등의 특성을 비교, 평가하였다. 그 결과 습식성형에 의해 블레이드의 두께편차를 감소시킬 수 있었으며, 경도 등의 특성을 향상시킬 수 있었다.