• Transactions of Materials Processing
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• v.12 no.7
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• pp.640-646
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• 2003

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as potential application to fabricate the surface nanostructures because of its operational versatility and simplicity. The objective of the work is to suggest new mastless pattern fabrication technique using the combination of machining by nanoindenter and KOH wet etching. The scratch option of the nanoindenter is a very promising method for obtaining nanometer scale features on a large size specimen because it has a very wide working area and load range. Sample line patterns were machined on a silicon surface, which has a native oxide on it, by constant load scratch (CLS) of the Nanoindenter with a Berkovich diamond tip, and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structure was made because of masking effect of the affected layer generated by nano-scratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved patterns can be used as a mold that will be used for mass production processes such as nanoimprint or PDMS molding process. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.39-46
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• 2006

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin mask layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The mask layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.1 s.343
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• pp.7-12
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• 2006

In this study, we developed irreversible and stable micro-size ferromagnetic structures utilizing hydrogenation and electron-beam lithography processes. The compositionally modulated (CM) Fe-Zr thin films that had average compositions $Fe_XZr_{100-x}$ with $x=65-85\%$ modulation periods of similar to 1 nm, and total thicknesses of similar to 100 m were prepared. The magnetic properties of CM Fe-Zr thin films were measured using a SQUID magnetometer, VSM and B-H loop tracer. After hydrogenation, the CM films exhibited larger magnetic moment increases than similar homogeneous alloy films for all compositions and かey showed largest increase in $Fe_{80}Zr_{20}$ composition. After aging in air at $300^{\circ}K$ the hydrogenated $Fe_{80}Zr_{20}$ CM films showed much larger magnetic moment increases, indicating that they relax to a stable, irreversible, soft magnetic state. The selective hydrogenation through electron-beam lithographed windows were performed after the circle shaped windows were prepared on $Fe_{80}Zr_{20}$ CM films by electron beam lithography. The hydrogenation through electron-beam resist and W lithographic techniques give a $49\%$ magnetic moment increase. This method can be applied to nano scale structures.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.17-21
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• 2007

Dense and periodic arrays of holes and Si nano dots were fabricated on silicon substrate. The nanopatterned holes were approximately $15{\sim}40nm$ wide, 40 nm deep and $40{\sim}80\;nm$ apart. To obtain nano-size patterns, self?assembling diblock copolymer were used to produce layer of hexagonaly ordered parallel cylinders of polymethylmethacrylate (PMMA) in polystyrene(PS) matrix. The PMMA cylinders were degraded and removed with acetic acid rinse to produce a PS. $100\;{\AA}-thick$ Au thin film was deposited by using e-beam evaporator. PS template was removed by lift-off process. Arrays of Au nano dots were transferred by using Fluorine-based reactive ion etching(RE). Au nano dots were removed by sulfuric acid. Si nano dots size and height were $30{\sim}70\;nm$ and $10{\sim}20\;nm$ respectively.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.2
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• pp.142-148
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• 2012

This study presents the assessment results of adhesive properties on the interface between a silicon wafer and nano-scale polymer thin film pattern through UAFM images by using the contact resonance frequency of the cantilever. For the experiment, we varied surface treatment processes for the silicon wafer and fabricated a 300nm polymer thin film pattern through lithography. Images from the optical microscope were used to compare the produced test specimens for adhesive condition and the critical load value from the nano scratch test was used to verify the adhesive condition of the nano pattern. Each test specimen resulted in a $1{\mu}m{\times}1{\mu}m$ surface image and subsurface adhesive image. Adhesive condition was evaluated by image contrast differences on the interface according to the changing amplitudes and phases of contact resonance frequency.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5586-5590
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• 2015

In this paper, the directed alignment methode of the DNA molecule between the Au electrodes was suggested for the application of nano devices. To fabricate the nano device coated DNA, 2-Aminoethanthiol(AET) was coated on Au electrodes which was formed using photo-lithography process on $SiO_2/Si$ substrates. In general, the AET that was a positive charge with $NH^{3+}$ was strongly combined under the electrostatic interaction with DNA molecule which had to be a negative charge. The DNA molecules could be easily aligned between Au electrodes coated with AET. The structures of the DNA molecules were investigated using AFM(Atomic force microscope), they were changed from single types to bundle according to the AET concentrations.

• KSTLE International Journal
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• v.6 no.2
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• pp.33-38
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• 2005

Submicron-scale patterns made of polymethyl methacrylate (PMMA) were fabricated on silicon-wafer using a capillarity-directed soft lithographic technique. Polyurethane acrylate (PUA) stamps (Master molds) were used to fabricate the patterns. Patterns with three different aspect ratios were fabricated by varying the holding time. The patterns fabricated were the negative replica of the master mold. The patterns so obtained were investigated for their adhesion and friction properties at nano-scale using AFM. Friction tests were conducted in the range of 0-80 nN. Glass (Borosilicate) balls of diameter 1.25 mm mounted on cantilever (Contact Mode type NPS) were used as tips. Further, micro-friction tests were performed using a ball-on-flat type micro-tribe tester, under reciprocating motion, using a soda lime ball (1 mm diameter) under a normal load of 3,000 mN. All experiments were conducted at ambient temperature ($24{\pm}1^{\circ}C$) and relative humidity ($45{\pm}5\%$). Results showed that the patterned samples exhibited superior tribological properties when compared to the silicon wafer and non-patterned sample (PMMA thin film) both at the nano and micro-scales, owing to their increased hydrophobicity and reduced real area of contact. In the case of patterns it was observed that their morphology (shape factor and size factor) was decisive in defining the real area of contact.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.3 s.192
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• pp.134-139
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• 2007

We report the suspension of individual multi-walled carbon nanotubes (MWNTs) from the bottom substrate using deep trench electrodes that were fabricated using optical lithography. During drying of the solution in dielectrophoretic assembly, the capillary force pulls the MWNT toward the bottom substrate, and it then remains as a deformed structure adhering to the bottom substrate after the solution has dried out. Small-diameter MWNTs cannot be suspended using thin electrodes with large gaps, but large-diameter MWNTs can be suspended using thicker electrodes. We present the statistical experimental results for successful suspension, as well as the feasible conditions for a MWNT suspension based on a theoretical approach.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.831-836
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• 2013

This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

• Advances in nano research
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• v.1 no.2
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• pp.105-109
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• 2013

We report dry thermal development of negative resist polystyrene with low molecular weight. When developed on a hotplate at $350^{\circ}C$ for 30 min, polystyrene showed reasonable high contrast and resolution (30 nm half-pitch), but low sensitivity. Resist sensitivity was greatly improved at lower development temperatures, though at the cost of reduced contrast. In addition, we observed the thickness reduction due to thermal development was higher for larger remaining film thickness, implying the thermal development process is not just a surface process and the more volatile chains below the top surface may diffuse to the surface and get evaporated.