• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.681-682
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.23-29
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.69-70
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• 2010

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.8-13
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• 2015

In this study, we fabricated and characterized a nanostructured surface based on a plastic injection molding with a local mold heating (LMH) system. A metal mold core with a closed packed nano convex array (CVA) was achieved by integrated engineering procedures: (1) master template fabrication by anodic aluminum oxidation (AAO), (2) nickel electroforming (NE) process, and (3) post-processing by precision machining. The nickel mold core was utilized to replicate a surface with a closed packed nano concave-array (CCA) based on injection molding using cyclic olefin copolymer (COC) as a plastic material. In particular, an LMH system was introduced to enhance transcription quality of the nano structures by delaying solidification of molten polymer near the surface of the mold core.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.81-85
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• 2006

In this study, we have been examined nano Injection Molding process which can improve transcription of 100nm-level pattern. We changed the various parameter (temperature of injection mold, clamp force, temperature of nozzle) which can be influence for improving transcription. And we measured and analyzed shapes of 100nm-level pattern by Automic Force Microscope for proving transcription. We made the Blu-ray Disc sample for proving transcription. And we measured HF-Signal and jitter. As a result, when the temperature of mold is more than $120^{\circ}C$ and the clamp force is more than 10 ton, We reached over 95 percent of transcription compared with stamper pattern. And we reached in-spec. value for HF-Signal and Jitter. Then we reached over 95 percent of transcription compared with stamper pattern.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1532-1536
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• 2007

A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.302-305
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• 2007

In recent years, many researches on new storage media with high capacity and information are developing. For manufacture of optical storage with high capacity, the injection molding process is generally used. In order to increase the filling ratio of the injection molding structure, the injection molding process required for high injection pressure, packing pressure and temperature control of the mold. However, conventional injection molding process is difficult to increase the filling ratio using injection master with the range of several nanometers and high aspect ratio. In order to improve and increase filling ratio of nano-structure with high aspect ratio, the active temperature control of injection mold was used. Experimental conditions were used injection pressure, time and temperature. Consequently, by using the peltier device into injection mold, we carried out the efficient and active temperature control of mold at low cost.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.4
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• pp.21-27
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• 2014

The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.100-104
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• 2005

The injection molding is very effective process for various plastic products due to its high productivity. It is also good fur precise products like optical parts. Various thermoplastic materials are also available with this injection molding process. In recent, however, as the overall size of the product increases and micro or nano scale of patterns are applied to the products, we now have some problems such as low fidelity of the replication of the pattern, high molding pressure, or warpage from the in-mold stress. Injection/compression molding is studied to overcome those problems in molding large thin plate with micro pattern array on its surface. An injection compression mold is designed to 3 pieces mold for side gate. We install 4 pressure transducers and 9 thermocouples to measure the melt pressure and surface temperature in the cavity during the process. As a result, the maximum molding pressure for injection compression molding is reduced to 1/3 compared to injection molding and the uniformity of the pressure in the cavity is enhanced by about 15%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.491-492
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• 2011