• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.26 no.1
• /
• pp.13-17
• /
• 2013

In this paper, we designed a charge pump circuit using level shifter for LED driver IC. The designed circuit makes the 15 V output voltage from the 5 V input in condition of 50 kHz switching frequency. The prototype chip which include the proposed charge pump circuit and its several internal sub-blocks such as oscillator, level shifter was fabricated using a 0.35 um 20 V BCD process technology. The size of the fabricated prototype chip is 2,350 um ${\times}$ 2,350 um. We examined performances of the fabricated chip and compared its measured results with SPICE simulation data.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.17 no.2
• /
• pp.51-57
• /
• 2008

Recently, the manufacturer of microscopic structures along with the development of technology to produce electronics, communication and semiconductors allows various components to be smaller in size, with higher precision. Therefore, preoccupancy of micro/nano-level machining technology in order to product micro/nano-components and parts is key issue in the field of manufacturing. In this study, machinability of micro machining was studied through the machining of aluminum, brass and steel workpiece. Inspection of the cutting force variation patterns of large numbers of micro machining indicated that characteristics of the workpiece. Surface roughness prediction methods were developed by considering the variation of the static part of the feed direction cutting force. The accuracy of the proposed approaches were tested with experimental data and the agreement between the predictions and actual observations are addressed.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
• /
• 2018.05a
• /
• pp.153-153
• /
• 2018

In this paper, we have represented basic experiment results for the application of electric vehicle powerline communication using an induction type coupler. The coupler was fabricated using nano-crystalline alloy and it was applied to the charging system of electric vehicles to measure the communication performance. Experimental results showed a channel bandwidth over 48 Mbps.

• Proceedings of the KIEE Conference
• /
• 2006.07c
• /
• pp.1301-1302
• /
• 2006

In this paper, embedded spiral inductors are investigated into the PCB substrate for low cost RF SOP applications. The spiral inductors designed with geometrical variations were simulated, fabricated, measured, and characterized by using 3D EM simulator, 8 layered PCB standard process and HP 8510B network analyzer (or verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800MHz, maximum quality factor of 64.8 at 1.09GHz and self resonant frequency of 3.93GHz, respectively. As the measured inductances and quality factors are well matched with simulated ones. PCB embedded spiral inductors are promising for advanced electronic systems with various functionality, low cost, small size and volume.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1504-1505
• /
• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.262-263
• /
• 2007

In this paper, fully embedded and miniaturized diplexer has been designed, fabricated, and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23dB at 824-894MHz and -0.7 and -22dB at 1850-1990MHz, respectively. Its size is 3.9mm$\times$3.9mm$\times$ 0.77mm (height). The fabricated diplexer is the smallest one which is fully embedded into low cost organic package substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.551-552
• /
• 2006

This study was attended to demonstrate synthesis of silver nanoparticles stabilized with polymer and their applicability to printed electronics. Silver nanoparticles were synthesized by reduction of silver nitrate in aqueous solution in the presence of polyvinyl pyrrolidone (PVP) as a stabilizer. The ink used here is composed of 50 wt% Ag NP, 15 wt% humectant and then were printed on polyimide film. Particle deposit morphologies were controlled by varying the ink compositions. Printed silver patterns and dots were cured on a convection oven in air at $300^{\circ}C$ for 60 min. The printed patterns show good shape definition and the resistivity of the printed films is about $5{\mu}{\Omega}{\cdot}cm$.

• Proceedings of the KIPE Conference
• /
• 2016.11a
• /
• pp.17-18
• /
• 2016

본 논문에서는 DC droop control을 적용한 80kW급 SiC 양방향 컨버터를 제안한다. 시스템은 20kW 모듈 4개를 이용하는 모듈형 컨버터이며, 토폴로지는 넓은 입력전압 범위를 만족하기 위하여 Cascade 부스트-벅 컨버터 구조이다. 모듈 컨버터의 제어는 모듈 간 통신이 필요 없는 DC droop control에 부하분담과 전압 regulation 성능을 모두 향상시키기 위하여 Secondary control을 적용했다. 제안하는 시스템의 타당성을 검증하기 위하여 20kW급 시작품 2대 실험을 통해 병렬 운전을 검증하였으며, 14kW에서 최고 효율 98.9%를 달성하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.1-6
• /
• 2019

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

• Journal of Adhesion and Interface
• /
• v.24 no.1
• /
• pp.1-8
• /
• 2023

A conjugated polymer is the next-generation emerging semiconductor material that can be applied in various fields, from organic electronics to biomedical applications. However, its low solubility in an aqueous medium has made the use of toxic organic solvents inevitable, thereby leading to formulation of conjugated polymers in the form of waterborne nanoparticles. This review paper discusses two principles of nanoparticle formation and representative methods for synthesizing conjugated polymer nanoparticles.