• Title/Summary/Keyword: Nano-CMOS

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Design Of Minimized Wiring XOR gate based QCA Half Adder (배선을 최소화한 XOR 게이트 기반의 QCA 반가산기 설계)

  • Nam, Ji-hyun;Jeon, Jun-Cheol
    • Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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    • v.7 no.10
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    • pp.895-903
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    • 2017
  • Quantum Cellular Automata(QCA) is one of the proposed techniques as an alternative solution to the fundamental limitations of CMOS. QCA has recently been extensively studied along with experimental results, and is attracting attention as a nano-scale size and low power consumption. Although the XOR gates proposed in the previous paper can be designed using the minimum area and the number of cells, there is a disadvantage that the number of added cells is increased due to the stability and the accuracy of the result. In this paper, we propose a gate that supplement for the drawbacks of existing XOR gates. The XOR gate of this paper reduces the number of cells by arranging AND gate and OR gate with square structure and propose a half-adder by adding two cells that serve as simple inverters using the proposed XOR gate. Also This paper use QCADesginer for input and result accuracy. Therefore, the proposed half-adder is composed of fewer cells and total area compared to the conventional half-adder, which is effective when used in a large circuit or when a half - adder is needed in a small area.

Influence on Short Channel Effects by Tunneling for Nano structure Double Gate MOSFET (나노구조 이중게이트 MOSFET에서 터널링이 단채널효과에 미치는 영향)

  • Jung, Hak-Kee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.3
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    • pp.479-485
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    • 2006
  • The double gate(DG) MOSFET is a promising candidate to further extend the CMOS scaling and provide better control of short channel effect(SCE). DGMOSFETs, having ultra thin undoped Si channel for SCEs control, ale being validated for sub-20nm scaling. A novel analytical transport model for the subthreshold mode of DGMOSFETs is proposed in this paper. The model enables analysis of short channel effect such as the subthreshold swing(SS), the threshold voltage roil-off$({\Delta}V_{th})$ and the drain induced barrier lowering(DIBL). The proposed model includes the effects of thermionic emission and quantum tunneling of carriers through the source-drain barrier. An approximative solution of the 2D Poisson equation is used for the distribution of electric potential, and Wentzel-Kramers-Brillouin approximation is used for the tunneling probability. The new model is used to investigate the subthreshold characteristics of a double gate MOSFET having the gate length in the nanometer range $(5-20{\sim}nm)$ with ultra thin gate oxide and channel thickness. The model is verified by comparing the subthreshold swing and the threshold voltage roll-off with 2D numerical simulations. The proposed model is used to design contours for gate length, channel thickness, and gate oxide thickness.

Thermal Stability Enhancement of Nickel Monosilicides by Addition of Pt and Ir (Pt와 Ir 첨가에 의한 니켈모노실리사이드의 고온 안정화)

  • Yoon, Ki-Jeong;Song, Oh-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.4
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    • pp.27-36
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    • 2006
  • We fabricated thermally evaporated 10 nm-Ni/(poly)Si, 10 nm-Ni/l nm-Ir/(poly)Si and 10 nm-Ni/l nm-Pt/(poly)Si films to investigate the thermal stability of nickel monosilicides at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides of 50 nm-thick were formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to examine sheet resistance. A scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An X-ray diffractometer and an Auger depth profiler were used for phase and composition analysis, respectively. Nickel silicides with platinum have no effect on widening the NiSi stabilization temperature region. Nickel silicides with iridium farmed on single crystal silicon showed a low resistance up to $1200^{\circ}C$ while the ones formed on polycrystalline silicon substrate showed low resistance up to $850^{\circ}C$. The grain boundary diffusion and agglomeration of silicides lowered the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

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