• Title/Summary/Keyword: Nano machining

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Nano-turning of single crystal silicon (단결정 실리콘의 초정밀가공)

  • 김건희;도철진;홍권희;유병주;원종호;박상진;안병민
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.939-942
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    • 2000
  • Single point diamond turning technique for optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material.

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Design of Micro-Machining System for Micro/Meso Mechanical Component (Micro/Meso부품 대응형 마이크로 기계가공시스템 기술 연구)

  • Park J.K.;Kyung J.H.;Ro S.K.;Kim B.S.;Park J.H.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.377-382
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    • 2005
  • This paper describes the design of micro machine tools system for mechanical machining of micro/meso scale mechanical parts. The micro machining systems such as $\mu-Late$, $\mu-milling/drilling$ machine and $\mu-grinding$ machine are the basic elements constructing $\mu-factory$ which gains more attention recently because of increasing needs of mico and nano-parts in various industrial and medical area. A miniaturized 3-axis milling machine with VCM stage and air spindle and palm-top size micro-late are designed, and air bearing stage and stepwise linear motion system with PZT are studied for motion system. The micro cutting characteristics are investigated experimentally, and reconfigurable machine structures are also considered.

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A Study on the Cutting Conditions in Machining for Nanometer Surface (나노미터 표면가공시 절삭조건에 관한 연구)

  • 문재일;김부태;김영일;허성중
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.9
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    • pp.152-157
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    • 1998
  • Since early 1960s, the high precision machining technology, so called ultra-precision technology or nano technology, has been developed in many Held based on single point diamond turning technology. The major application of this technology is the optical components with aspherical surfaces. Now a days, customer requires the smaller and lighter optical elements, such as camera video and etc., with higher performance for convenience. So, the manufacturer focuses on the ultra-precision technology. Thus, this technology becomes the major target to challenge the advanced barrier for the next machining technology.

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Machinining of Specular Hologram using End-mill Technology (엔드밀 가공을 이용한 스페큘러 홀로그램 제작)

  • Jeon, Eun-Chae;Cha, Jin-Ho;Lee, Je-Ryung;Choi, Hwan-Jin;Kim, Chang-Eui;Je, Tae-Jin;Kim, Hwi;Choi, Doo-Sun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.4
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    • pp.1-6
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    • 2014
  • The specular hologram is one type of hologram, and it consists of many arcs. They are very easy to fabricate and can even be machined by hand and a compass. In this study, we designed two squares having different depths and consisting of many arcs, after which we machined the arcs using end-mill technology. The width of the machined arcs showed high repeatability. Moving tracks were observed on the bottom surface, and top burrs were noted. In spite of them, the phenomenon of the specular hologram was observed when an observer and a light source stood on the same side. The two squares seemed to have different depths when they were observed from the left and right directions. In this study, it was verified that a specular hologram can be manufactured by end-mill technology.

Fabrication of Organic-Inorganic Nanocomposite Blade for Dicing Semiconductor Wafer (반도체 웨이퍼 다이싱용 나노 복합재료 블레이드의 제작)

  • Jang, Kyung-Soon;Kim, Tae-Woo;Min, Kyung-Yeol;Lee, Jeong-Ick;Lee, Kee-Sung
    • Composites Research
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    • v.20 no.5
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    • pp.49-55
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    • 2007
  • Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.