• 제목/요약/키워드: Nano Abrasive

검색결과 74건 처리시간 0.024초

Chemical mechanical planarization 슬러리에 사용되는 point-of-use 필터의 평가 방법 개발 (Development of point-of-use filter evaluation method using chemical mechanical planarization slurry)

  • 장선재;아툴 쿨르카르니;김형우;김태성
    • 한국입자에어로졸학회지
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    • 제12권4호
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    • pp.145-150
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    • 2016
  • During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

수열처리법을 이용한 $Al_2O_3/CeO_2$ composite 연마재 제조 및 연마 특성 (Preparation of $Al_2O_3/CeO_2$ Composite Abrasives by using Hydrothermal Treatment and its Polishing Properties)

  • 최성현;이승호;임형미;길재수;최귀돈
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.1278-1282
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    • 2004
  • 수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$$CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$$CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$$CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

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단결정 실리콘 웨이퍼의 내마모성 및 내식성 향상을 관한 연구 (Enhancement of Wear and Corrosion Resistances of Monocrystalline Silicon Wafer)

  • 우르마노프 바흐티요르;노준석;편영식;아마노프 아웨즈한
    • Tribology and Lubricants
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    • 제35권3호
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    • pp.176-182
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    • 2019
  • The primary objective of this study is to treat a monocrystalline silicon (Si) wafer having a thickness of $279{\mu}m$ by employing the ultrasonic nanocrystal surface modification (UNSM) technology for improving the efficiency and service life of nano-electromechanical systems (NEMSs) and micro-electromechanical systems (MEMSs) by enhancing of wear and corrosion resistances. The wear and corrosion resistances of the Si wafer were systematically investigated before and after UNSM treatment, wherein abrasive, oxidative and spalling wear mechanisms were applied to the as-received and subsequently UNSM-treated Si wafer. Compared to the asreceived state, the wear and corrosion resistances of the UNSM-treated Si wafer are found to be enhanced by about 23% and 14%, respectively. The enhancement in wear and corrosion resistances after UNSM treatment may be attributed to grain size refinement (confirmed by Raman spectroscopy) and modified surface integrity. Furthermore, it is observed that the Raman intensity reduced significantly after UNSM treatment, whereas neither the Raman shift nor new phases were found on the surface of the UNSM-treated Si wafer. In addition, the friction coefficient values of the as-received and UNSM-treated Si wafers are found to be about 0.54 and 0.39, respectively. Hence, UNSM technology can be effectively incorporated as an alternative mechanical surface treatment for NEMSs and MEMSs comprising Si wafers.

Surface gloss, gloss retention, and color stability of 2 nano-filled universal resin composites

  • Gustavo Fabian Molina;Ricardo Juan Cabral;Ignacio Mazzola;Michael Burrow
    • Restorative Dentistry and Endodontics
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    • 제47권4호
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    • pp.43.1-43.13
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    • 2022
  • Objectives: This study compared the surface gloss (SG), gloss retention (GR), and color stability (CS) of 2 universal resin composites after chemical (CA) and mechanical (MA) aging. Materials and Methods: Twenty disc-shaped samples of G-ænial A'Chord (GC-Europe) and Filtek Universal (3M-ESPE) were polished with sequential abrasive papers. For CA, specimens were stored in 1 mL of 75% ethanol for 15 days at 37℃, and readings (SG, GR, and CS) were obtained at baseline and 5, 10, and 15 days. For MA, specimens were subjected to 10,750 simulated brushing cycles. SG and CS were evaluated after every 3,583 cycles. SG was measured with a glossmeter (geometrical configuration: 60°), and values were expressed in gloss units. Color was measured with a spectrophotometer using the CIE-L*a*b* color system. The Student's t-test, 1-way analysis of variance, and Scheffé test were used for statistical analysis (α = 0.05). Results: G-ænial presented significantly higher SG values than Filtek (p = 0.02), with GR reductions of 5.2% (CA) and 5.3% (MA) for G-ænial and 7.6% (CA) and 7.2% (MA) for Filtek. The aging protocol had no statistically significant effect on SG or GR (p = 0.25) from baseline to the final readings. G-ænial-MA presented the lowest color difference (ΔE = 1.8), and G-ænial-CA and Filtek-CA had the largest changes (ΔE = 8.6 and ΔE = 11.8, respectively). Conclusion: G-ænial presented higher SG values and better CS. Both restorative materials demonstrated acceptable GR and CS. Aging protocols impacted these properties negatively.