• Title/Summary/Keyword: N deposition

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Characteristics of Atmosphere-rice Paddy Exchange of Gaseous and Particulate Reactive Nitrogen in Terms of Nitrogen Input to a Single-cropping Rice Paddy Area in Central Japan

  • Hayashi, Kentaro;Ono, Keisuke;Matsuda, Kazuhide;Tokida, Takeshi;Hasegawa, Toshihiro
    • Asian Journal of Atmospheric Environment
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    • v.11 no.3
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    • pp.202-216
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    • 2017
  • Nitrogen (N) is an essential macronutrient. Thus, evaluating its flows and stocks in rice paddy ecosystems provides important insights into the sustainability and environmental loads of rice production. Among the N sources of paddy fields, atmospheric deposition and irrigation inputs remain poorly understood. In particular, insufficient information is available for atmosphere-rice paddy exchange of gaseous and particulate reactive N (Nr, all N species other than molecular N) which represents the net input or output through dry deposition and emission. In this study, we assessed the N inputs via atmospheric deposition and irrigation to a Japanese rice paddy area by weekly monitoring for 2 years with special emphasis on gas and particle exchange. The rice paddy during the cropping season acted as a net emitter of ammonia ($NH_3$) to the atmosphere regardless of the N fertilizer applications, which reduced the effects of dry deposition to the N input. Dry N deposition was quantitatively similar to wet N deposition, when subtracting the rice paddy $NH_3$ emissions from N exchange. The annual N inputs to the rice paddy were 3.2 to $3.6\;kg\;N\;ha^{-1}\;yr^{-1}$ for exchange, 8.1 to $9.8\;kg\;N\;ha^{-1}\;yr^{-1}$ for wet deposition, and 11.1 to $14.5\;kg\;N\;ha^{-1}\;yr^{-1}$ for irrigation. The total N input, 22.8 to $27.5\;kg\;N\;ha^{-1}\;yr^{-1}$, corresponded to 38% to 55% of the N fertilizer application rate and 53% to 67% of the brown rice N uptake. Monitoring of atmospheric deposition and irrigation as N sources for rice paddies will therefore be necessary for adequate N management.

Comparison between Bi-superconducting Thin Films Fabricated by Co-Deposition and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.9
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    • pp.796-800
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    • 2000
  • Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO) thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

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Comparison between BSCCO Thin Films Fabricated by Co-Deposition and Layer-by-Layer Deposition

  • Lee, Hee-Kab;Park, Yong-Pil;Lee, Joon-Ung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.230-234
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    • 2000
  • Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-law growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

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XRD Patterns and Bismuth Sticking Coefficient in $Bi_2Sr_2Ca_nCu_{n+1}O_y(n\geq0)$ Thin Films Fabricated by Ion Beam Sputtering Method

  • Yang, Seung-Ho;Park, Yong-Pil
    • Journal of information and communication convergence engineering
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    • v.4 no.4
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    • pp.158-161
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    • 2006
  • [ $Bi_2Sr_2Ca_nCu_{n+1}O_y(n{\geq}0)$ ] thin film is fabricatedvia two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

Effects of Deposition Variables on Plasma-Assisted CVD of TiN Films (TiN박막의 증착특성에 미치는 플라즈마 화학증착변수들의 영향)

  • 이정래;김광호;신동원;박찬경
    • Journal of the Korean Ceramic Society
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    • v.31 no.10
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    • pp.1188-1196
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    • 1994
  • TiN films were deposited onto high speed steel(SKH9) and silicon wafer by plasma-assisted chemical vapor deposition(PACVD) using a TiCl4/N2/H2/Ar gas mixture. The effects of deposition temperature, R.F. power, and H2 concentration on the deposition of TiN were studied. The residual chlorine content and the microhardness of TiN films were also investigated. It was found that TiN films grew with a columnar structure of a strong (200) preferred orientation regardless of the substrate type and the deposition variables. The TiN films consisted of columnar-grains of about 50 to 100 nm in diameter. The columnar grains themselves contained much finer fibrous grains. As deposition temperature increased, the residual chlorine content decreased sharply. R. F. powder enhanced the deposition rate largely. Increasing of H2 concentration had little effect on the residual chlorine.

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Characteristics of Bi-superconducting Thin Films Prepared by Co- and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.10a
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    • pp.40-44
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    • 2000
  • $Bi_2Sr_2Ca_nCu_{n+1}O_y$($n{\geq}0$; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

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Studies on Film Growth and Mechanical Properties of TiN by Chemical Vapor Deposition (화학증착에 의한 TiN 박막의 제조 및 기계적 성질에 관한 연구)

  • 김시범;김광호;천성순
    • Journal of the Korean Ceramic Society
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    • v.26 no.1
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    • pp.21-30
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    • 1989
  • Titanium Nitride (TiN) was deposited onto the SKH9 tool steels by chemical vapor deposition (CVD) using a gaseous mixture of TiCl4, N2, and H2. The effects of the deposition temperature and input gas composition on the deposition rate, microstructure, preferred orientation, microhardness and wear resistance of TiN deposits were studied. The experimental results showed that the TiN deposition is thermally activated process with an apparent activation energy of about 27Kcal/mole in the temperature range between 1200$^{\circ}$K and 1400$^{\circ}$K. As H2/N2 gas input ratio increased, the deposition rate increased, showed maximum at H2/N2 gas input ratio of 1.5 and then decreased. Mechanical properties such as microhardness and wear resistance have close relation with the microstructure and preferred orientation of TiN deposits. It is suggested that the equiaxed structure with random orientation increases the microhardness and wear resistance of TiN deposits.

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Low Temperature Deposition of TiN on the Steel Substrate by Plasma-Assisted CVD (플라즈마 화학증착에 의한 강재위에 TiN의 저온증착)

  • 이정래;김광호;조성재
    • Journal of the Korean Ceramic Society
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    • v.30 no.2
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    • pp.148-156
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    • 1993
  • TiN films were deposited onto high speed steel (SKH9) by plasma assisted chemical vapor deposition (PACVD) using a TiCl4/N2/H2/Ar gas mixture at around 50$0^{\circ}C$. The effects of the deposition temperature, R.F. power and TiCl4 concentration on the deposition of TiN and the microhardness of TiN film were investigated. The crystallinity and the microhardness of TiN films were improved with increase of the deposition temperature. Optimum deposition temperature in this study was 50$0^{\circ}C$, because a softening or phase transformation of the substrate occurred over 50$0^{\circ}C$. A large increase of the film growth rate with a strong(200) preferred orientation was obtained by increasing R.F. power. Much chlorine content of about 10at.% was found in the deposited films and resulted in relatively low average microhardness of about 1, 500Kgf/$\textrm{mm}^2$ compared with the theoretical value(~2, 000Kgf/$\textrm{mm}^2$).

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Nitrogen Doping Characterization of ZnO Prepared by Atomic Layer Deposition (원자층 증착법으로 성장된 ZnO 박막의 질소 도핑에 대한 연구)

  • Kim, Doyoung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.10
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    • pp.642-647
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    • 2014
  • For feasible study of opto-electrical application regarding to oxide semiconductor, we implemented the N doped ZnO growth using a atomic layer deposition technique. The p-type ZnO deposition, necessary for ZnO-based optoelectronics, has considered to be very difficulty due to sufficiently deep acceptor location and self-compensating process on doping. Various sources of N such as $N_2$, $NH_3$, NO, and $NO_2$ and deposition techniques have been used to fabricate p-type ZnO. Hall measurement showed that p-type ZnO was prepared in condition with low deposition temperature and dopant concentration. From the evaluation of photoluminescence spectroscopy, we could observe defect formation formed by N dopant. In this paper, we exhibited the electrical and optical properties of N-doped ZnO thin films grown by atomic layer deposition with $NH_3OH$ doping source.

Effect of Deposition Parameters on TiN by Plasma Assisted Chemical Vapor Deposition(III) -Influence of r.f. power and electrode distance on the Tin deposition- (플라즈마 화학증착법에서 증착변수가 TiN 증착에 미치는 영향(III) -r.f. power 및 전극간 거리를 중심으로-)

  • Kim, C.H.;Shin, Y.S.;Kim, M.I.
    • Journal of the Korean Society for Heat Treatment
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    • v.3 no.1
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    • pp.1-7
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    • 1990
  • To investigate the influence of r.f. power and electrode distance on the TiN deposition, TiN films were deposited onto STC3, STD11 steel and Si-wafer from gas mixtures of $TiC_4/N_2/H_2$ using the radio frequency plasma assisted chemical vapor deposition. The crystallinity of TiN film could be improved by the increase of r.f. power and the decrease of electrode distance. The TiN coated layer contains chlorine, its content were decreased with increasing r.f. power as well as decreasing electrode distance. And the thickness of deposited TiN was largely affected by r.f. power and electrode distance. The hardness of deposited TiN reached a maximum value of about Hv 2,000.

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