• 제목/요약/키워드: Multiple Package

검색결과 395건 처리시간 0.028초

분산 환경에서 멀티미디어 실시간 스트리밍을 위한 패키지 설계 (A Package Design for Multimedia Live Streaming in Distributed Environment)

  • 서봉근;김윤호
    • 한국멀티미디어학회논문지
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    • 제9권4호
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    • pp.490-504
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    • 2006
  • 분산 환경에서 멀티미디어 라이브 스트리밍을 지원하는 멀티미디어 서비스를 구현하기 위해서는 다양한 플랫폼에 분산되어 있는 객체들을 제어하고, 멀티캐스트를 지원하지 않는 네트워크 환경에서 다수의 수신자에게 멀티미디어를 전송하는 것이 필요하다. 본 논문에서는 분산 객체 기술인 RMI와 멀티미디어 전송/처리에 사용하는 JMF를 확장하여 분산 환경에서 1:N 의 멀티미디어 라이브 스트리밍을 지원하는 DLS (Distributed Live Streaming) 패키지를 제안한다. 효율적인 분산 처리를 위해 전송과 제어를 분리하여 설계한 자바 기반의 DLS 패키지는 1:N의 전송을 지원하고 플랫폼 독립적인 멀티미디어 서비스의 개발에 적용이 가능하다.

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해양기기 적용을 위한 해수이차전지 패키지 및 BMS 모듈 설계 (Design of Seawater Rechargeable Battery Package and BMS Module for Marine Equipment)

  • 김형준;이경창;손호준;박신준;박철수
    • 한국기계가공학회지
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    • 제21권3호
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    • pp.49-55
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    • 2022
  • The design of a battery package and a BMS module for applications using seawater rechargeable batteries, which are known as next-generation energy storage devices, is proposed herein. Seawater rechargeable batteries, which are currently in the initial stage of research, comprise primarily components such as anode and cathode materials. Their application is challenging owing to their low charge capacity and limited charge/discharge voltage and current. Therefore, we design a method for packaging multiple cells and a BMS module for the safe charging and discharging of seawater rechargeable batteries. In addition, a prototype seawater rechargeable battery package and BMS module are manufactured, and their performances are verified by evaluating the prevention of overcharge, overdischarge, overcurrent, and short circuit during charging and discharging.

원전건설 발주 및 계약체계에 대한 고찰 (A Study of the Construction Contracts and Delivery System for Nuclear Power Plant)

  • 서용덕;원서경
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2012년도 추계 학술논문 발표대회
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    • pp.233-235
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    • 2012
  • Continually having growed up overseas construction market for new Nuclear Power Plant(NPP), the exports of Korean Reactor emerges as the key task of National Nuclear Business. The objective of this study is to strengthen the competitiveness of Korean Reactor through the improvement of Construction Project Contract & Delivery System for NPP. This study suggests the method for increasing Korean Reactor's competitiveness of exports by analyzing the business environment of foreign market and comparing Contract & Delivery System between domestic and foreign.

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주택시장 안정화를 위한 부동산정책 방향 (Comprehensive Measures in Real Estate Policy for Housing Market Stabilization)

  • 이선
    • 기술사
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    • 제38권4호
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    • pp.7-9
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    • 2005
  • The recent speculation fever in Kangnam and its southern vicnity of Seoul resulted in surging apartment prices. The government is determined to employ more effective anti-speculation policy measures to control the property speculative demand. The Government plans to implement support measures to discourage people from owning multiple homes by reinforcing tax measures. To meet the increasing demand for more large-sized apartments in Seoul, the Government may allow to build more large sized units. By the end of August, 'a comprehensive package tool of real estate policy measures' ,as a real estate controlling guidelines, is scheduled to be presented by the Government. We hope that the package tool will stabilize housing market more effectively and enhance the national economy.

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Multilayer thin Film technology as an Enabling technology for System-in-Package (SIP) and "Above-IC" Processing

  • Beyne, Eric
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 International Symposium
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    • pp.93-100
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    • 2003
  • The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

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확률 분포 곡선을 이용한 다중 수위-유량 곡선 단순화 (Simplification of Multiple Stage-Discharge Curves by Using Probability Distribution Curve)

  • 김태진;김정호
    • 한국수자원학회:학술대회논문집
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    • 한국수자원학회 2018년도 학술발표회
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    • pp.284-284
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    • 2018
  • 대부분의 물분쟁의 경우 강 또는 호수를 공유하고 있는 국가 간에 발생하고 있으며 국내에도 제한된 물로 인하여 다양한 지역에서 물 분쟁이 발생하고 있다. 이렇듯 물 부족으로 인한 물분쟁 현상은 점차 심화되고 있으며 특히 강을 공유하고 있는 인접지역에서 발생할 가능성이 높아지고 있다. 본 연구에서 Water Rights Analysis Package (WRAP) 모델의 국내 적용을 위한 기초자료 구축단계로서 수위별로 되어 있는 수위-유량 관계 곡선식을 단순화하여 자연하천유량 산정을 위한 절차를 간편화하였다. 첫째, 확률 분포곡선을 이용한 수위 자료 구간별 구분; 둘째, 구분된 수위 자료에 대한 회귀 분석 실시; 셋째, 실측 유량 자료 및 모의 유량 자료를 이용한 신뢰도 산정 및 비교를 통한 본 연구결과에 대한 타당성 검토를 수행하였다.

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자동화제조시스템에서 다수목표를 위한 물류관리 (Logistics for multiple objectives in automated manufacturing system)

  • 최정상;장길상
    • 한국국방경영분석학회지
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    • 제27권2호
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    • pp.25-36
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    • 2001
  • In this paper a new heuristic algorithm has been developed and presented for logistics for multiple objectives in an automated manufacturing systems. We proposed Simallest Processing and Average setup time Ratio First(SPARF) algorithm for multiple criteria under sequence setup time. The heuristic algorithm is implemented on the various problem cases by number of jobs and machines. The proposed algorithm provided smaller than the previously documented heuristics. The results obtained show a superior solution by the new heuristic over previous heuristics on all problem sizes. we perform analyses of variance to fortify the above results of comparison with the previous algorithms to the four cases using Statistical Analysis System(SAS) package. The results show that the larger is the number of groups or cells, the bigger is the amount of improvement by the proposed algorithms. It suggests that the algorithms proposed is strongly influenced by the number of cells, groups and interaction of these factors.

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Automated Molding Design Methodology to Optimize Multiple defects in Injection Molded Parts

  • Park, Jong-Cheon;Kim, Byung H.
    • International Journal of Precision Engineering and Manufacturing
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    • 제1권1호
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    • pp.133-145
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    • 2000
  • Plastic molding designers are frequently faced with optimizing multiple defects in injection molded parts. these defects are usually in conflict with each other, and thus a tradeoff needs to be made reach a final compromised solution. In this study, an automated injection molding design methodology has been developed to optimize multiple defects of injection molded parts. Two features of the proposed methodology are as follows: one is to apply the utility theory to transform the original multiple objective optimization problem into single objective optimization problem with utility as objective function, the other is an implementation of a direct search-based injection molding optimization procedure with automated consideration of process variation. The modified complex method is used as a general optimization tool in this research. The developed methodology was applied to an actual molding design and the results showed that the methodology was useful through the CAE simulation using a commercial injection molding software package. Applied to production, this study will be of immense value to industry in reducing the product development time and enhancing the product quality.

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일반의약품 설명서의 이해도와 적정 사용가능성 평가 (Assessment of Readability and Appropriate Usability Based on the Product Labelling of Over-The-Counter Drugs in Korea)

  • 이인향;이형원;제남경;이숙향
    • 약학회지
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    • 제56권5호
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    • pp.333-345
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    • 2012
  • A product labelling is one of key tools in ensuring that a patient uses drugs safely and effectively in self-care without professional support. This study aimed to explore the readability and comprehensibility of the information contained on two package inserts of medicines. Two package inserts were tested with first year college students. Fifty-one potential consumers underlined words they could not understand and answered 10 scenario questions. Any differences among groups with different characteristics were statistically tested. Secondly, the readability of two package inserts was assessed with comparison to the level of the 6th grade Korean textbooks. As results, more than 80% of participants properly replied to straightforward questions concerning indication, dosage, duplication, use in pregnancy and contraindication, and 73% about formulation. Less than half answered correctly in multiple choice questions about pediatric use (41%) and side effects (35%). Little discrepancy was observed in the comprehensibility between participants' characteristics. Drug inserts contained about 20% more professional-level words than 6th grade textbooks. In conclusion, Korean consumers may face challenges to understand drug information due to professional terminology and outdated expressions in the current package inserts. To secure safe and effective use of over-the-counter agents, greater efforts should be made to develop more consumer friendly labels. In the other hand, educational supports are required to prepare consumers in a proper level of knowledge for the safe use of drugs.

FOWLP 구조의 영향 인자에 따른 휨 현상 해석 연구 (A Study of Warpage Analysis According to Influence Factors in FOWLP Structure)

  • 정청하;서원;김구성
    • 반도체디스플레이기술학회지
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    • 제17권4호
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    • pp.42-45
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    • 2018
  • As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.