• Title/Summary/Keyword: Multiple Package

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A Package Design for Multimedia Live Streaming in Distributed Environment (분산 환경에서 멀티미디어 실시간 스트리밍을 위한 패키지 설계)

  • Seo Bong-Kun;Kim Yun-Ho
    • Journal of Korea Multimedia Society
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    • v.9 no.4
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    • pp.490-504
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    • 2006
  • It needs to control each objects on various platform and transmit multimedia data to multiple receivers which are for developing a multimedia service with multimedia live streaming in a distributed environment. In this paper, we present a DLS (Distributed Live Streaming) package which support l:N multimedia live streaming in a distributed environment. Also, it has extended RMI which is a distributed object technology and JMF using multimedia transmission/processing. A java-based DLS package has been designed to separate a transmission and a control for more efficient distributed processing. It is possible to apply in development of multimedia service supported 1:N transmission and runned independently to any platform.

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Design of Seawater Rechargeable Battery Package and BMS Module for Marine Equipment (해양기기 적용을 위한 해수이차전지 패키지 및 BMS 모듈 설계)

  • Kim, Hyeong-Jun;Lee, Kyung-Chang;Son, Ho-Jun;Park, Shin-Jun;Park, Cheol-Su
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.3
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    • pp.49-55
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    • 2022
  • The design of a battery package and a BMS module for applications using seawater rechargeable batteries, which are known as next-generation energy storage devices, is proposed herein. Seawater rechargeable batteries, which are currently in the initial stage of research, comprise primarily components such as anode and cathode materials. Their application is challenging owing to their low charge capacity and limited charge/discharge voltage and current. Therefore, we design a method for packaging multiple cells and a BMS module for the safe charging and discharging of seawater rechargeable batteries. In addition, a prototype seawater rechargeable battery package and BMS module are manufactured, and their performances are verified by evaluating the prevention of overcharge, overdischarge, overcurrent, and short circuit during charging and discharging.

A Study of the Construction Contracts and Delivery System for Nuclear Power Plant (원전건설 발주 및 계약체계에 대한 고찰)

  • Seo, Yong-Tok;Won, Seo-Kyung
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2012.11a
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    • pp.233-235
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    • 2012
  • Continually having growed up overseas construction market for new Nuclear Power Plant(NPP), the exports of Korean Reactor emerges as the key task of National Nuclear Business. The objective of this study is to strengthen the competitiveness of Korean Reactor through the improvement of Construction Project Contract & Delivery System for NPP. This study suggests the method for increasing Korean Reactor's competitiveness of exports by analyzing the business environment of foreign market and comparing Contract & Delivery System between domestic and foreign.

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Comprehensive Measures in Real Estate Policy for Housing Market Stabilization (주택시장 안정화를 위한 부동산정책 방향)

  • Lee sun
    • Journal of the Korean Professional Engineers Association
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    • v.38 no.4
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    • pp.7-9
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    • 2005
  • The recent speculation fever in Kangnam and its southern vicnity of Seoul resulted in surging apartment prices. The government is determined to employ more effective anti-speculation policy measures to control the property speculative demand. The Government plans to implement support measures to discourage people from owning multiple homes by reinforcing tax measures. To meet the increasing demand for more large-sized apartments in Seoul, the Government may allow to build more large sized units. By the end of August, 'a comprehensive package tool of real estate policy measures' ,as a real estate controlling guidelines, is scheduled to be presented by the Government. We hope that the package tool will stabilize housing market more effectively and enhance the national economy.

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Multilayer thin Film technology as an Enabling technology for System-in-Package (SIP) and "Above-IC" Processing

  • Beyne, Eric
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.93-100
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    • 2003
  • The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

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Simplification of Multiple Stage-Discharge Curves by Using Probability Distribution Curve (확률 분포 곡선을 이용한 다중 수위-유량 곡선 단순화)

  • Kim, Tae Jin;Kim, Jung Ho
    • Proceedings of the Korea Water Resources Association Conference
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    • 2018.05a
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    • pp.284-284
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    • 2018
  • 대부분의 물분쟁의 경우 강 또는 호수를 공유하고 있는 국가 간에 발생하고 있으며 국내에도 제한된 물로 인하여 다양한 지역에서 물 분쟁이 발생하고 있다. 이렇듯 물 부족으로 인한 물분쟁 현상은 점차 심화되고 있으며 특히 강을 공유하고 있는 인접지역에서 발생할 가능성이 높아지고 있다. 본 연구에서 Water Rights Analysis Package (WRAP) 모델의 국내 적용을 위한 기초자료 구축단계로서 수위별로 되어 있는 수위-유량 관계 곡선식을 단순화하여 자연하천유량 산정을 위한 절차를 간편화하였다. 첫째, 확률 분포곡선을 이용한 수위 자료 구간별 구분; 둘째, 구분된 수위 자료에 대한 회귀 분석 실시; 셋째, 실측 유량 자료 및 모의 유량 자료를 이용한 신뢰도 산정 및 비교를 통한 본 연구결과에 대한 타당성 검토를 수행하였다.

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Logistics for multiple objectives in automated manufacturing system (자동화제조시스템에서 다수목표를 위한 물류관리)

  • 최정상;장길상
    • Journal of the military operations research society of Korea
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    • v.27 no.2
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    • pp.25-36
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    • 2001
  • In this paper a new heuristic algorithm has been developed and presented for logistics for multiple objectives in an automated manufacturing systems. We proposed Simallest Processing and Average setup time Ratio First(SPARF) algorithm for multiple criteria under sequence setup time. The heuristic algorithm is implemented on the various problem cases by number of jobs and machines. The proposed algorithm provided smaller than the previously documented heuristics. The results obtained show a superior solution by the new heuristic over previous heuristics on all problem sizes. we perform analyses of variance to fortify the above results of comparison with the previous algorithms to the four cases using Statistical Analysis System(SAS) package. The results show that the larger is the number of groups or cells, the bigger is the amount of improvement by the proposed algorithms. It suggests that the algorithms proposed is strongly influenced by the number of cells, groups and interaction of these factors.

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Automated Molding Design Methodology to Optimize Multiple defects in Injection Molded Parts

  • Park, Jong-Cheon;Kim, Byung H.
    • International Journal of Precision Engineering and Manufacturing
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    • v.1 no.1
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    • pp.133-145
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    • 2000
  • Plastic molding designers are frequently faced with optimizing multiple defects in injection molded parts. these defects are usually in conflict with each other, and thus a tradeoff needs to be made reach a final compromised solution. In this study, an automated injection molding design methodology has been developed to optimize multiple defects of injection molded parts. Two features of the proposed methodology are as follows: one is to apply the utility theory to transform the original multiple objective optimization problem into single objective optimization problem with utility as objective function, the other is an implementation of a direct search-based injection molding optimization procedure with automated consideration of process variation. The modified complex method is used as a general optimization tool in this research. The developed methodology was applied to an actual molding design and the results showed that the methodology was useful through the CAE simulation using a commercial injection molding software package. Applied to production, this study will be of immense value to industry in reducing the product development time and enhancing the product quality.

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Assessment of Readability and Appropriate Usability Based on the Product Labelling of Over-The-Counter Drugs in Korea (일반의약품 설명서의 이해도와 적정 사용가능성 평가)

  • Lee, Iyn-Hyang;Lee, Hyung Won;Je, Nam Kyung;Lee, Sukhyang
    • YAKHAK HOEJI
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    • v.56 no.5
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    • pp.333-345
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    • 2012
  • A product labelling is one of key tools in ensuring that a patient uses drugs safely and effectively in self-care without professional support. This study aimed to explore the readability and comprehensibility of the information contained on two package inserts of medicines. Two package inserts were tested with first year college students. Fifty-one potential consumers underlined words they could not understand and answered 10 scenario questions. Any differences among groups with different characteristics were statistically tested. Secondly, the readability of two package inserts was assessed with comparison to the level of the 6th grade Korean textbooks. As results, more than 80% of participants properly replied to straightforward questions concerning indication, dosage, duplication, use in pregnancy and contraindication, and 73% about formulation. Less than half answered correctly in multiple choice questions about pediatric use (41%) and side effects (35%). Little discrepancy was observed in the comprehensibility between participants' characteristics. Drug inserts contained about 20% more professional-level words than 6th grade textbooks. In conclusion, Korean consumers may face challenges to understand drug information due to professional terminology and outdated expressions in the current package inserts. To secure safe and effective use of over-the-counter agents, greater efforts should be made to develop more consumer friendly labels. In the other hand, educational supports are required to prepare consumers in a proper level of knowledge for the safe use of drugs.

A Study of Warpage Analysis According to Influence Factors in FOWLP Structure (FOWLP 구조의 영향 인자에 따른 휨 현상 해석 연구)

  • Jung, Cheong-Ha;Seo, Won;Kim, Gu-Sung
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.4
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    • pp.42-45
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    • 2018
  • As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.