• Title/Summary/Keyword: Multilayer LTCC

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Lamination of LTCC Sheet Using Binder Film (Binder Film을 이용한 LTCC Sheet 적층)

  • Shin, Hyo-Soon;Choi, Yong-Seok;Park, Eun-Tae
    • Journal of the Korean Ceramic Society
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    • v.43 no.4 s.287
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    • pp.253-258
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    • 2006
  • In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

Design of BPF with dissimilar LTCC materials (이종적층 LTCC 대역통과 여파기 설계)

  • 김광용;이상노;육종관;박한규;김준철;박종철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.143-146
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    • 2002
  • A multilayer two-stage bandpass filter using dissimilar low-temperature cofired-ceramic (LTCC) materials is proposed in this paper. The proposed bandpass filter is composed of ceramic substrates with different dielectric constant instead of single ceramic material from top to bottom layer. Inductive elements are designed in a low permittivity ceramic layer to reduce parasitic effects and loss, while capacitive elements are designed in a high pertimitivity ceramic layer for size reduction. The center frequency of the proposed filter is 1.842 GHz, and the performance of the filter is analyzed and compared with the conventional LTCC filter with single material in terms of integration density, size reduction, and performance improvement.

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Modeling of 3-D Embedded Inductors Fabricated in LTCC Process (저온 동시소성 공정으로 제작된 3차원 매립 인덕터 모델링)

  • 이서구;최종성;윤일구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.4
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    • pp.344-348
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    • 2002
  • As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

The Characteristics of Hetero Junction Using NiCuZn Ferrite and Dielectric for LTCC (LTCC를 위한 NiCuZn 페라이트계와 유전체의 이종접합의 특성)

  • Kim, Nam Hyun;Park, Hyun;Kim, Kyung Nam
    • Journal of the Korean institute of surface engineering
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    • v.45 no.5
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    • pp.188-192
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    • 2012
  • The hetero junction on dielectrics and ferrite for LTCC was prepared by using NiCuZn ferrite. The shrinkage behaviour of ferrite tapes in combination with a dielectric tape was investigated. The characteristics of NiCuZn ferrite were investigated using XRD (X-ray diffractometer), Dilatometer, FE-SEM (Field emission scanning electron microscope), EDS (Energy dispersive spectrometer). NiCuZn ferrite calcined at $700^{\circ}C$ had a good apparent density and initial permeability of magnetic properties. The shrinkage rate of the NCZF700 ferrite and dielectric material was similar. The multilayer revealed dense, uniform morphologies with excellent interface quality. Diffusion of hetero junction such as dielectric and ferrite was not occuring at $900^{\circ}C$.

Bonding Strength of Conductive Inner-Electrode Layers in Piezoelectric Multilayer Ceramics

  • Wang, Yiping;Yang, Ying;Zheng, Bingjin;Chen, Jing;Yao, Jinyi;Sheng, Yun
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.4
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    • pp.181-184
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    • 2017
  • Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

A 2012 Size Multilayer LTCC BPE for 2.4 GHz Band (2.4 GHz 대역 2012사이즈 적층 LTCC 대역통과 필터의 설계 및 제작)

  • 이영신;송희석;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.19-24
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    • 2003
  • A very small size 2.4 GHz ISM band BPF(Band Pass Filter) is realized using LTCC Multi-layer technology. Proposed design method enables to achieve BPF size $2.0\times1.2\times0.8mm^3$. A $lambda/4$ resonator with shunt-to-ground loaded capacitor is used to shorten resonator length, achieving higher quality factor. Also this resonator enables BPF to improve out-of-band rejection. Coupling coefficients between coupled strip-line resonators and external quality factor (Qe) of a resonator are derived and applied to the filter design. The measured results show good agreement with simulated data.

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Design of GSM BPF using Dissimilar LTCC Technology (이종적층 LTCC 기술을 이용한 GSM 대역 BPF 설계)

  • 고정호;이상노;육종관;박한규
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.9
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    • pp.931-935
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    • 2003
  • A multilayer two-stage LC bandpass filter using low-temperature cofired-ceramic(LTCC) is proposed in this paper. The proposed bandpass filter is composed of two ceramic substrates with different dielectric constant instead of single ceramic material from top to bottom layer. Inductive elements are designed in a low permitivity ceramic layer to reduce parasitic effects and loss, while capacitive elements are designed in a high permitivity ceramic layer for size reduction. The proposed filter has 950 MHz center &equency, 118 MHz tractional bandwidth, and 3.5 dB insertion loss. And, the total size of this filter is 2.5${\times}$2.5${\times}$l.4mm$^3$. The performance of filter is analyzed by changing coupling capacitance between each resonator.

Design of T/R Switch Using LTCC Technology

  • Sim, Sung-Hun;Kang, Chong-Yun;Park, Ji-Won;Yoon, Young-Joong;Kim, hyun-Jai;Park, Hyung-Wook;Yoon, Seok-Jin
    • Journal of the Korean Ceramic Society
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    • v.40 no.4
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    • pp.375-379
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    • 2003
  • In this paper, a novel design of multilayer ceramic-based Transmit/Receive (T/R) switch using Low Temperature Co-fired Ceramic (LTCC) technology have been presented. Compact T/R switch has been designed by transforming quarter-wave transmission line to its lumped equivalent circuit. Especially, high-Q three dimensional inductors with double strip have been proposed and incorporated. The proposed inductor has been modeled by multi-conductor coupled lines. A measured inductor quality factor (Q) of 80 and a Self-Resonance Frequency (SRF) of 6.6 GHz have been demonstrated. The inductor library has been incorporated into the design of WCDMA T/R switch.

Modeling of High-speed 3-Disional Embedded Inductors (고속 3차원 매립 인덕터에 대한 모델링)

  • 이서구;최종성;윤일구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.139-142
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    • 2001
  • As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

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Computer-Aided Design of Miniaturized Multilayer Band Pass Chip Filter (CAD에 의한 초소형 적층형 대역 통과 칩 필터 설계)

  • 강종윤;최지원;심성훈;박용욱;윤석진;김현재
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.1
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    • pp.56-60
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    • 2002
  • A low-temperature cofired-ceramic (LTCC) multi-layer ceramic (MLC) band-pass filter (BPF) is presented, which has the benefits of low cost and small size. The BPF is designed for an IMT-2000 handset. The computer-aided design technology is also presented. The BPF with an attenuation pole at below the passband has been discussed and realized. The equivalent circuit of the BPF was established by transmission lines and lumped capacitors. The frequency characteristics of the LTCC-MLC BPF is well acceptable for IMT-2000 application.