• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.2
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• pp.165-171
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• 2004

In this paper, the modeling and design of high-Q multilayer passives have been investigated, and multilayer diplexer for GSM/DCS applications has been designed and fabricated using the passives. Modeling of a multilayer inductor was performed by the subsystems of distributed components, and using the modeling the optimal structures of the high-Q multilayer inductor could be designed by analyzing parasitics and couplings which affect their frequency characteristics. Multilayer diplexers for GSM/DCS applications have been designed and fabricated using LTCC technology. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.751-755
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• 2003

In this paper, We proposed compact multi-layer LTCC (Low Temperature Cofired Ceramic) bandpass filter for Bluetooth module. A ${\lambda}/4$ coupled stripline resonators are designed, which composed of coupled strip-line section and loading capacitance. This resonator with a loading capacitor has slow-wave characteristics. Due to the slow-wave effect of the proposed resonator, it is possible to design and fabricate a compact bandpass filter with a wide upper stop band. Attenuation poles in the lower stop band are achieved using controlling of electro-magnetic coupling between resonators. Using multi-layer LTCC technology, we designed and fabricated band pass filter with a finite attenuation pole and wide upper stopband. The overall size of the filter is $1.2{\times}2.0{\times}1.0mm^3$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.91-95
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• 2002

A very small size BPF is realized using LTCC Multilayer technology. A λ/4 resonator with shunt-to-ground loaded capacitor is used to shorten resonator length and achieve higher qualityfactor. Also this resonator enable BPF to improve out-of-band rejection. Coupling coefficients between coupled stripline resonators and external qualityfactor of a resonator are derived and apply to the filter design. The measured results show a good agreement with the simulation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.130-133
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• 2002

Solder leaching resistance of the metal electrode is an important factor with regard to adhesion properties of ceramic substrate. In the Low Temperature Co-fired Ceramics (LTCC), Ag-Pd or Ag-Pt pastes are used instead of pure Ag paste to prevent leaching. Solder leaching behavior of the Ag-Pd paste in relation to LTCC raw material powder size was investigated. First fabrication of LTCC green tape with different particle size was done. LTCC substrates with Ag-Pd electrode were prepared using conventional multilayer ceramic process. Dipping test was performed to test solder leaching behavior of the electrode. Ag-Pd electrode on LTCC substrate with smaller particle size achieved higher solder leaching resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.188-192
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• 2003

A multilayer two-stage LC bandpass filter using low-temperature cofired-ceramic (LTCC) is proposed in this paper. The proposed bandpass filter is composed of two ceramic substrates with different dielectric constant instead of single ceramic material from top to bottom layer. The bandpass filter size is $2.0 mm{\times}1.2 mm{\times}0.8 mm$. Positioning of attenuation polefrequency, importance parameter for a performance of filter, is discussed using even-odd mode analysis by tuned capacitance of coupling capacitor and those results is implemented to LTCC filter circuit. Measured filter performances show that the insertion losses are -4.5dB, -4.1dB at 2.45GHz, 2.75GHz and the return losses are -8.5dB, 8.7dB.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1112-1117
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• 2006

The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.