• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.234-238
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• 2003

The LTCC bandpass filter using multilayer resonators is made of combline type and interdigital type parallel coupled-lines. The equivalent circuits of parallel coupled-lines are analysed. They are applied to make an equivalent circuit of LTCC bandpass filter using multilayer resonators. The 3-pole bandpass filter of the center frequency of 2.45GHz with 250Hz bandwidth is designed and fabricated. The simulated result of the bandpass filter are presented.

• 한국전자파학회논문지
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• 제16권1호
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• pp.78-83
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• 2005

본 논문에서는 적층 Inter-digital 공진기를 이용한 LTCC 대역통과 여파기의 등가회로를 제안하고, 2.4 GHz 대역의 여파기 설계에 적용하였다. 본 논문의 LTCC 적층 칩 대역통과 여파기는 평면상에서는 Comb-line 구조이고 단면상에서는 Inter-digital 구조로 구성된다. Comb-line 구조와 Inter-digital 구조의 평행 결합선로의 등가회로를 본 논문의 여파기에 적용하여 여파기 전체의 등가회로를 구성하였다. 이 등가회로는 공진기 사이의 결합 구조가 다중의 결합 구조를 갖는다. 이를 하나의 결합 구조로 통합하여 인버터를 이용한 대역통과 여파기의 설계방법을 적용하였다. 2.4 GHz 대역에서 3단의 대역통과 여파기를 설계, 제작하였다.

• 한국전자파학회지:전자파기술
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• 제12권3호
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• pp.12-24
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• 2001

최근에 이동통신 시스템의 다기능/고기능화에 따 라 여러 선진업체에서 RF부품의 모듈화 개발이 추 진되고 있으며, 이에 대응하여 LTCC를 이용한 MCM (Multi-Chip Module)적층기술의 개발이 확대되고 있 다. 이 기술은 세라믹기판 내부에 L, C, R등의 수 동소자를 3차원적으로 구성, 일체화할 수 있기 때문 에 이들 수동소자 뿐 아니라 세라믹 개별 부품으로 이용되고 있는 대역통과 여파기 및 바이어스라인, 임피던스 매칭 회로, 스트립라인등을 하나의 구조물 에 집적화 시킴으로써 제품의 소형화 및 대량생산 이 가능해진다. 본 논문에서는 LTCC를 활용한 고 집적 복합모듈 기술과 동향에 대한 개요 및 개발사례로서 적층 VCO 모듈의 제작에 대해 소개하기로 한다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.908-909
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• 2006

The HTCC based multilayer structure plasma head unit have some difficulties in fabrication due to complicated post-processes, such as heat treatment at reduced atmosphere, re-bonding of each layer, and silver metallization. On the other hand, LTCC based technology provides relatively simple process for multilayer plasma unit except weak mechanical properties. To overcome this problem a combined scheme using both LTCC and HTCC technology has been developed in our group, recently. In this work, we report the structural design, materials selection, joining of LTCC with HTCC substrate, and co-firing process for the fabrication of multilayered atmospheric plasma head unit.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 통신소사이어티 추계학술대회논문집
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• pp.313-316
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• 2003

The LTCC bandpass filter using multilayer resonators is made of combline type and interdigital type parallel coupled-lines. The equivalent circuits of parallel coupled-lines are analysed. They are applied to make an equivalent circuit of LTCC bandpass filter using multilayer resonators. The 3-pole bandpass filter of the center frequency of 2.45GHz with 200Hz bandwidth is designed and fabricated. The simulated result of the bandpass filter are presented.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.333-337
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• 2003

In this paper, 5.2 GHz WLAN BPF(Band Pass Filter) using LTCC(Low temperature co-firing ceramic) Multilayer technology was simulated and manufactured. A DGS(Defected Ground structure) resonator with spiral ground pattern is used to shorten resonator size and improve circuit Q factor. And the equivalent circuit of BPF was suggested. The measured result shows good agreement with simulated data. Experimental results show the center frequency of 5.25GHz, the insertion loss of 0.14dB, and the 3-dB bandwidth of 350MHz (6%). The center frequency of BPF is 5.25GHz which is available for wireless LAN.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.628-631
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• 2003

In this paper, 2.4 GHz WLAN BPF(Band Pass Filter) using LTCC(Low temperature cofiring ceramic) multilayer technology was simulated and manufactured. A modified ${\lambda}/4$ Hair-pin resonator with shunt-to ground loaded capacitor is used to shorten resonator length and improve circuit Q factor. Proposed BPF has a combline structure. Electro-magnetic Coupling between coupled strip-line resonators is controlled to provide attenuation poles at finite frequencies. The overall size of the filter is $3.2{\times}1.6{\times}1.3mm^3$. The measured result shows good agreement with simulated data.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.291-294
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• 2003

The circuit substrate was made from the Low Temperature Cofired Ceramics(LTCC) that a $\varepsilon_\gamma$ was 7.8. Accumulated Varactor and the low noise transistor which were a Surface Mount Device-type element on LTCC substrate. Let passive element composed R, L, C with strip-line of three dimension in the multilayer substrate circuit inside, and one structure accumulate band-pass filter, resonator, a bias line, a matching circuit, and made it. Used Screen-Print process, and made Strip-line resonator. A design produced and multilayer-type VCO(Voltage Controlled Oscillator), and recognized a characteristic with the Spectrum Analyzer which was measurement equipment. Measured multilayer structure VCO is oscillation frequency 1292[MHz], oscillation output -28.38[dBm], hamonics characteristic -45[dBc] in control voltage 1.5[V], A phase noise is -68.22[dBc/Hz] in 100 KHz offset frequency. The oscillation frequency variable characteristic showed 30[MHz/V] characteristic, and consumption electric current is approximately 10[mA].

• 한국전자파학회논문지
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• 제13권3호
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• pp.301-307
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• 2002

본 논문에서는 종래 세라믹 칩 안테나의 단점인 협대역 특성을 개선하기 위해 헬리컬 구조를 갖는 적층형 세라믹 칩 안테나의 인덕턴스가 대역폭 향상에 미치는 영향을 3D 구조 시뮬레이션 결과에 의해 고찰하였다. 적층형 세라믹 칩 안테나를 고주파 구조 시뮬레이터인 HFSS에 의해 설계하였고, LTCC-MLC 공정 기술을 이용하여 유전 특성이 $\varepsilon$$_{r}$=7.8, tan $\delta$=0.0043인 유전체로 구현하였다. 또한, IMT-2000용 단말기에 적용 가능성을 보기 우하여 그 운용 주파수 (1,920~2,170 GHz)대에 설계된 안테나 제작하여, 주파수 응답 특성 및 복사 특성을 측정하였다.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.294-298
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• 2003

In this paper, the modeling and design of high-Q multilayer passives have been investigated, and multilayer diplexer for GSM/DCS applications has been designed and fabricated using the passives. To minimize the system, the configuration of a multilayer inductor has involved a square spiral structure. Modeling of a multilayer inductor was performed by the subsystems of distributed components, and using the modeling the optimal structures of the high-Q multilayer inductor could be designed by analyzing parasitics and couplings which affect their frequency characteristics. Multilayer diplexer for GSM/DCS application has been designed and fabricated using LTCC technology. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB by locating attenuation pole at 1800 MHz. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB by locating attenuation pole at 930 MHz.