• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.7-15
• /
• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of KIISE:Computing Practices and Letters
• /
• v.9 no.4
• /
• pp.393-409
• /
• 2003

In this paper, we present a multi-task debugging environment for Qplus-T embedded-system such as internet information appliances. We will propose the structure and functions of a remote multi-task debugging environment supporting environment effective ross-development. And, we are going enhance the communication architecture between the host and target system to provide more efficient cross-development environment. The remote development toolset called Q+Esto consists to several independent support tools: an interactive shell, a remote debugger, a resource monitor, a target manager and a debug agent. Excepting a debug agent, all these support tools reside on the host systems. Using the remote multi-task debugger on the host, the developer can spawn and debug tasks on the target run-time system. It can also be attached to already-running tasks spawned from the application or from interactive shell. Application code can be viewed as C/C++ source, or as assembly-level code. It incorporates a variety of display windows for source, registers, local/global variables, stack frame, memory, event traces and so on. The target manager implements common functions that are shared by Q+Esto tools, e.g., the host-target communication, object file loading, and management of target-resident host tool´s memory pool and target system´s symbol-table, and so on. These functions are called OPEn C APIs and they greatly improve the extensibility of the Q+Esto Toolset. The Q+Esto target manager is responsible for communicating between host and target system. Also, there exist a counterpart on the target system communicating with the host target manager, which is called debug agent. Debug agent is a daemon task on real-time operating systems in the target system. It gets debugging requests from the host tools including debugger via target manager, interprets the requests, executes them and sends the results to the host.

• Journal of the Korean Electrochemical Society
• /
• v.10 no.4
• /
• pp.283-287
• /
• 2007

KIER has been developing the anode-supported flat tubular solid oxide fuel cell unit bundle for the intermediate temperature($700{\sim}800^{\circ}C$) operation. Anode-supported flat tubular cells have Ni/YSZ cermet anode support, 8 moi.% $Y_2O_3$ stabilized $ZrO_2(YSZ)$ thin electrolyte, and cathode multi-layer composed of Sr-doped $LaSrMnO_3(LSM)$, LSM-YSZ composite, and $LaSrCoFeO_3(LSCF)$. The prepared anode-supported flat tubular cell was joined with ferritic stainless steel cap by induction brazing process. Current collection for the cathode was achieved by winding Ag wire and $La_{0.6}Sr_{0.4}CoO_3(LSCo)$ paste, while current collection for the anode was achieved by using Ni wire and felt. For making stack, the prepared anode-supported flat tubular cells with effective electrode area of $90\;cm^2$ connected in series with 12 unit bundles, in which unit bundle consists of two cells connected in parallel. The performance of unit bundle in 3% humidified $H_2$ and air at $800^{\circ}C$ shows maximum power density of $0.39\;W/cm^2$ (@ 0.7V). Through these experiments, we obtained basic technology of the anode-supported flat tubular cell and established the proprietary concept of the anode-supported flat tubular cell unit bundle.

• Journal of KIISE:Information Networking
• /
• v.28 no.3
• /
• pp.389-405
• /
• 2001

In these days, we have increasing demands on the real-time services, especially for the multimedia data transmission in both of wired and wireless environments and thus efficient and stable ways of transmitting realtime data are needs. Although RTP is widely used for internet-based realtime applications, it cannot avoid packet losses, due to the use of UDP stack and its underlying layers. In the case of mobile computing applications, the packet losses are more frequent and consecutive because of the limited bandwidth. In this paper, we first statistically analyze the characteristics of packet losses in the wired and wireless communications, based on Gilbert model, and a new packet recovery scheme for realtime data transmission is presented. To reflect the transmission characteristics of the present network environment, our scheme makes the sender to dynamically adjust the amount of redundant information, using the current packet loss characteristic parameters reported by the receiver. Additionally, we use relatively large and discontinuous offset values, which enables us to recover from both of the random and consecutive packet losses. Due to these characteristics, our scheme is suitable for the mobile computing environment where packet loss rates are relatively high and varies rapidly in a wide range. Since our scheme is based on the analytic model form statistics, it can also be used for other network environments. We have implemented the scheme with Mobile IP and RTP/RTCP protocols to experimentally verify its efficiency.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.4
• /
• pp.503-509
• /
• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.