• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국의류학회지
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• 제39권2호
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• pp.247-256
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• 2015

This study prepared fabric-heating elements of carbon nanofiber composite to characterize morphologies and electrical properties. Carbon nanofiber composite was prepared with 15wt% PVDF-HFP/acetone solution, and 0, 1, 2, 4, 8, and 16wt% carbon nanofiber. Dispersion of solution was conducted with stirring for a week, sonification for 24 hours, and storage for a month, until coating. Carbon nanofiber composite coated fabrics were prepared by knife-edge coating on nylon fabrics with a thickness of 0.1mm. The morphologies of carbon nanofiber composite coated fabrics were measured by FE-SEM. Surface resistance was determined by KS K0555 and worksurface tester. A heating-pad clamping device connected to a variable AC/DC power supply was used for the electric heating characteristics of the samples and multi-layer fabrics. An infrared camera applied voltages to samples while maintaining a certain distance from fabric surfaces. The results of morphologies indicated that the CNF content increased specifically to the visibility and presence of carbon nanofiber. The surface resistance test results revealed that an increased CNF content improved the performance of coated fabrics. The results of electric heating properties, surface temperatures and current of 16wt% carbon nanofiber composite coated fabrics were $80^{\circ}C$ and 0.35A in the application of a 20V current. Carbon nanofiber composite coated fabrics have excellent electrical characteristics as fabric-heating elements.

• Journal of Information Technology Applications and Management
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• 제14권4호
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• pp.159-174
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• 2007

The purpose of this research is to investigate the relationships among the perceived satisfaction, the perceived the trust, the commitment, the key features for mobile phone, the brand image, the switching cost and the repurchasing intention. We also examine the differences between Korean and Indonesian markets concerning the relationships of these key successfactors. The structural model is tested with the data form each of the sub-samples (i. e. Korean and Indonesian users taken separately). Properties of the casual paths, including standardized path coefficients, the significance of difference, and variance explained for trust, satisfaction, commitment and repurchasing in the hypothesized model, are presented. This study indicated that hardware (sound quality, LCD display, design) user interface (GUI, Menu, Key pad) and extra functions (camera phone, wireless internet, MP3 player) are the three important factors effecting the trust and the satisfaction. The proposed model has been newly tested from the technological prospective in order to get the more practical result. Following the model test, we conduct a test of the differences in path coefficients between Korean and Indonesian users. MSEM show that, compared to Korean market, Indonesian had more emphasized on extra-function for the mobile phone as well as giving more influence to the satisfaction from the brand image. It means Korean market consider the extra-function as basic or no-premium points. And the satisfaction has been effected by switching-cost in Korea but the trust in Indonesia. Other interesting result from the structural weight invariance indicate that, compared to Korean market, the brand-image has effected the satisfaction in addition to placing more the trust on determining the commitment in Indonesia.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국가구학회지
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• 제20권5호
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• pp.467-479
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• 2009

The high-tech computer technology developments have greatly affected the area of design education. Starting from the mid 80s, innovations in visual presentation methods have heightened with 2D computer graphic programs, CAD & 3D modeling, and Rapid Prototype that allows dimensional generation. The specialty and quality in design studio education have advanced due to the development in presentation methods such as Power Point and Keynote. But there are many problems with the current method of presenting the visual outcome in a data format using beam projectors, which is a vertical presenting method compared to the old studio study method of conducting discussions and reviews based on the substantial outcome. The essence of studio study that allows for comparisons and analysis by horizontally opening up the various work outcomes is being offset. Also the requirement for manual idea sketching work that plays an important role in the initial design phase continuing to decrease due to the digital working process dependence and cumbersome procedures in the presentation. In order to resolve this problem, the CALM system (Class Applied LCD Modular System) has been developed that replaces the method of attaching the sketches or renderings on the wall with a digital multi-display system. In a nutshell, individuals will upload the outcomes online and display them on the CALM system studio that is composed of 32 LCD (Columns: 4 $\times$ Rows: 8) monitors that are 19 inches in size so that various personnel can openly study the design outcomes. Also the central 42 inch PDP monitor that offers touch pad capability allows each design outcome to be described and examined by expanding. The concept phase of this development process has elevated to the production of an operating prototype that is being reviewed of its practicality. It is considered that the development of this system will decrease the extreme tendency of depending on digital operation but achieve revitalization of a more realistic and opened studio study environment compared to the individual consulting method of the old study approach.

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2011년도 제45차 학술발표회
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• pp.32-32
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• 2011

Cold Pad batch(CPB)처리에 의한 직물 전처리 공정은 특히 저온처리방식이라 에너지 소모가 적으며, 발생되는 대기오염 및 용수사용량이 연속식 방법에 비해 약 30%이상 절감되는 경제적 친환경적인 기술로 특히 정련과 표백을 동시에 수행할 수 있다. CPB 전처리는 호발, 정련, 표백을 포함하는 공정으로 일욕으로 처리시 패딩, 수세, 와인딩 공정을 단축시키기 때문에 약품 소비량 감소와 에너지 사용 절감 효과가 있어 전 세계적으로 확산되고 있는 Green Technology이다. 본 연구에서는 CPB용 다기능성 일욕형 조제에 개발하기 위해 전처리시 정련, 표백성에 대한 연구를 진행하였다. 시료는 NP/C 교직물을 사용하였고, CPB 처리액은 원료 및 첨가용제를 여러 비율로 조합하여 조제를 formulation 하였다. 이를 사용하여 패딩, 배칭, 수세 및 건조하여 전처리를 하였다. 표백된 정도를 파악하기 위해 Macbeth Color Eye-3100을 사용하여 백도(whiteness(CIE))를 5회 평균값을 구하여 측정 하였다. 정련된 정도를 비교하기 위해 C.I.Reactive Red 238의 2g/l 용액을 사용하여 wicking test를 하였다. 1분간 흡수높이를 측정하여 정련성을 확인하였다. 각각의 첨가용제를 비교한 결과 isopropyl alcohol을 첨가 시 hexylene glycol, butyl diglycol를 첨가한 경우에 비해 높은 흡수높이를 나타내었다. isopropyl alcohol의 농도별 정련성을 알아보기 위해 0%, 5%, 10%의 농도로 처리하였다. 그 결과 isopropyl alcohol 첨가량이 많을수록 정련성이 증가하였다. 다기능성 일욕조제의 문제점인 알칼리 안정성 부족을 보완하기 위해 polyoxyethlylene tridecyl ether derivatieves(LAP300)의 인화물을 첨가하였다. LAP300의 첨가량이 증가할수록 정련성이 증가하는 경향을 나타내었다. 알칼리 안정성 및 타 성능(정련성, 백도, 킬레이트 성)을 종합적으로 평가하여 향후, CPB용 다기능성 일욕형 조제의 개발에 대한 연구를 진행할 계획이다.

• Tribology and Lubricants
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• 제35권1호
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• pp.77-86
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• 2019

The present study focuses on the effect of staggered integration factor (SIF) on Morton effect simulation results. The Morton effect is a synchronous rotordynamic instability problem caused by the temperature differential across the journal in fluid film bearings. Convection and conduction of heat in the thin film displaces the hot spot, which is the hottest circumferential position in the thin film, from -20 to 40 degrees ahead of the high spot, where the minimum film clearance is experienced. The temperature differential across the journal causes a bending moment and the corresponding thermal bow in the rotating frame acts like a distributed synchronous excitation in the fixed frame. This thermal bow may cause increased vibrations and continued growth of the synchronous orbit into a limit cycle. The SIF is developed assuming that the response of the rotor-lubricant-bearing dynamic system is much quicker than that of the bearing-journal thermal system, and it is defined as the ratio between the simulation time of the thermal system and the rotor-spinning period. The use of the SIF is unavoidable for efficient computing. The value of the SIF is chosen empirically by the software users as a value between 100 and 400. However, the effect of the SIF on Morton effect simulation results has not been investigated. This research produces simulation results with different values of SIF.

• 한국콘텐츠학회논문지
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• 제16권6호
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• pp.135-150
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• 2016

본 연구는 모바일 메신저 애플리케이션과 사용자 사이에 인지된 상호작용성이 어떻게 즐거운 감정과 지속적 사용의도를 유발시키는가를 검증하기 위하여 수행되었다. 본 연구는 메신저 애플리케이션에 대한 사용자의 인지된 상호작용성이 제어, 공유, 응답 요인에 의하여 형성된다고 보았다. 인지된 상호작용성, 즐거움, 사용의도 사이의 관계는 PAD 감정모형, 합리적 행동이론, 그리고 계획된 행동이론을 이용하여 연구가설로 설정되었다. 연구모형을 검증하기 위하여 한국과 중국에서 총 481개의 설문 데이터가 수집되었고, 구조방정식을 이용하여 가설을 검증하였다. 연구결과, 인지된 상호작용성인 공유와 응답 요인은 즐거움에 긍정적 영향을 미칠 뿐만 아니라, 사용의도에도 유의한 영향력을 가지는 것으로 도출되었다. 그러나 제어는 사용의도에는 긍정적 영향을 주지만, 즐거움에는 유의한 영향력을 가지지 않는 것으로 도출되었다. 그리고 즐거움과 사용의도 사이에는 긍정적 인과관계가 존재하였다. 본 연구는 부가적으로 한국과 중국 사용자들 사이의 차이점을 탐색하기 위하여 다중집단 차이분석을 실시하였다. 연구 결과를 바탕으로 모바일 메신저 서비스를 제공하는 기업들에게 인지된 상호작용성이 가지는 인과적 영향력과 한국과 중국 사이에 존재하는 경로계수 차이에 대한 시사점을 논의하였다.

• 정보처리학회논문지:컴퓨터 및 통신 시스템
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• 제13권1호
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• pp.21-30
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• 2024

최근 자율주행차 시장이 지속해 성장함에 따라 충전 인프라에 대한 필요성이 커지고 있다. 그러나 무선 충전 시스템의 경우 기존 유선 충전에 비해 대출력이 요구되어 안정성 문제가 제기되고 있다. 자율주행차 무선 충전 인프라를 구축하기 위한 표준으로는 SAE J2954가 존재하며 해당 표준에서는 차량과 전력 전송 시스템 간의 통신 방법에 대해 정의한다. SAE J2954에서는 자율주행차량의 무선 충전 통신 방법으로 Wi-Fi, Bluetooth 및 UWB와 같은 물리적 미디어를 사용해 차량과 충전 패드 간의 통신을 활성화할 것을 권장한다. 특히 UWB는 실내 환경에서 견고한 통신 능력을 보이고 간섭에 민감하지 않기 때문에 실내외 충전 환경에서 적합한 솔루션이다. 해당 표준에서는 무선전력전송 시스템을 구축하기 위한 프로세스로 충전 시작부터 충전 완료까지를 여러 단계로 구분하였다. 본 연구에서는 UWB 기술을 사용하여 무선전력전송 시스템의 한 가지 프로세스인 Fine alignment의 수단으로 사용한다. 실제 자율주행차 무선전력전송 시스템에 적용 가능성을 판단하기 위해 거리에 따라 실험을 수행하였으며 UWB로부터 거리 정보를 수집하였다. UWB로부터 얻어진 거리 데이터의 정확도를 향상시키기 위해 수집한 데이터를 세 단계의 전처리 과정을 거쳐 머신러닝과 딥러닝 기법을 적용한 Single Model과 Multi Model을 제안한다.