• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.56-56
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• 1999

For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.133-133
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• 1998

In the thin film alloy formation of the transition metals ion-beam-mixing technique forms a metastable structure which cannot be found in the arc-melted metal alloys. Sppecifically it is well known that the studies about the electronic structure of ion-beam-mixed alloys pprovide the useful information in understanding the metastable structures in the metal alloy. We studied the electronic change in the ion-beam-mixed ppt-Ct alloys by XppS and XANES. These analysis tools pprovide us information about the charge transfer in the valence band of intermetallic bonding. The multi-layered films were depposited on the SiO2 substrate by the sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr. These compprise of 4 ppairs of ppt and Cu layers where thicknesses of each layer were varied in order to change the alloy compposition. Ion-beam-mixing pprocess was carried out with 80 keV Ae+ ions with a dose of $1.5\times$ 1016 Ar+/cm2 at room tempperature. The core and valence level energy shift in these system were investigated by x-ray pphotoelectron sppectroscoppy(XppS) pphotoelectrons were excited by monochromatized Al K ａ(1486.6 eV) The ppass energy of the hemisppherical analyzer was 23.5 eV. Core-level binding energies were calibrated with the Fermi level edge. ppt L3-edge and Cu K-edge XANES sppectra were measured with the flourescence mode detector at the 3C1 beam line of the ppLS (ppohang light source). By using the change of White line(WL) area of the each metal sites and the core level shift we can obtain the information about the electrons pparticippating in the intermetallic bonding of the ion-beam-mixed alloys.

• 자원환경지질
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• 제29권4호
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• pp.495-508
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• 1996

This study had three purposes: (1) to investigate dispersion and enrichment level of potentially toxic elements; (2) to identify uranium-bearing minerals in black shales; and (3) to assess the chemical speciation of heavy metals in soils and sediments. Rock, surface soil and stream sediment samples were collected in the Chungjoo area covered with black shales in Korea. These samples were analyzed for multi-elements using INAA and ICP-AES. The maximum abundance of U in black shales is 56 ppm and radioactivity counts up to 240CPM. Molybdenum, V, Ba, Cu, and Pb are enriched in black shales and most of soils show high concentrations of U, Mo, Ba, Cu, Pb and Zn. Concentrations of potentially toxic elements decrease in the order of mountain soil > farmland soil > paddy soil. Enrichment index of soils and sediments are calculated and higher than 1.0 in the black shale area with the highest value of 6.1. In order to identify U-bearing minerals, electron probe micro analysis was applied, and uraninite and brannerite in black shale were found. Uraninite grains are closely associated with monazite or pyrite with the size of $2{\mu}m$ to $10{\mu}m$ in diameter whereas brannerite occurs as $50{\mu}m$ euhedral grains. With the results of sequential extraction scheme, residual fractions of Cu, Pb and Zn in soils are mainly derived from weathering of black shale but Cu, Pb and Zn in sediments are present as non-residual fractions. Lead is predominantly present as oxidizable phase in soils whereas Zn is in exchageable/water-acid soluble phase in sediments.

• 천문학회보
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• 제36권2호
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• pp.66.2-66.2
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• 2011

The unexpected rising flux of early-type galaxies at decreasing ultraviolet (UV) wavelengths is a long-standing mystery. One important observational constraint is the correlation between UV-optical colours and Mg2 line strengths found by Burstein et al. (1988). The simplest interpretation of this phenomenon is that the UV strength is related to the Mg line-strength. Under this assumption, we expect galaxies with larger Mg gradients to have larger UV colour gradients. By combining UV imaging from GALEX, optical imaging from MDM and SAURON integral-field spectroscopy, we investigate the spatially-resolved relationships between UV colours and stellar population properties of 34 early-type galaxies from the SAURON survey sample. We find that galaxies with old stellar populations show tight correlations between the FUV colours (FUV-V and FUV-NUV) and the Mg b index, $H{\beta}$ index and metallicity [Z/H]. We have also derived logarithmic internal radial colour, measured line strength and derived stellar population gradients for each galaxy and again found a strong dependence of the FUV-V and FUV-NUV colour gradients on both the Mg b line-strength and the metallicity gradients. In particular, global gradients of Mg b and [Z/H] with respect to the UV colour across galaxies are consistent with their local gradients within galaxies, suggesting that the global correlations also hold locally. From a simple model based on multi-band colour fits of UV upturn and UV-weak galaxies, we have identified a plausible range of parameters that reproduces the observed radial colour profiles. In these models, the centers of elliptical galaxies, where the UV flux is strong, are enhanced in metals by roughly 60% compared to UV-weak regions.

• Journal of Microbiology and Biotechnology
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• 제22권6호
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• pp.742-753
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• 2012

Copper-containing compounds are introduced into the environment through agricultural chemicals, mining, and metal industries and cause severe detrimental effects on ecosystems. Certain microorganisms exposed to these stressors exhibit molecular mechanisms to maintain intracellular copper homeostasis and avoid toxicity. We have previously reported that the soil bacterial isolate Achromobacter sp. AO22 is multi-heavy metal tolerant and exhibits a mer operon associated with a Tn21 type transposon. The present study reports that AO22 also hosts a unique cop locus encoding copper homeostasis determinants. The putative cop genes were amplified from the strain AO22 using degenerate primers based on reported cop and pco sequences, and a constructed 10,552 base pair contig (GenBank Accession No. GU929214). BLAST analyses of the sequence revealed a unique cop locus of 10 complete open reading frames, designated copSRABGOFCDK, with unusual separation of copCD from copAB. The promoter areas exhibit two putative cop boxes, and copRS appear to be transcribed divergently from other genes. The putative protein CopA may be a copper oxidase involved in export to the periplasm, CopB is likely extracytoplasmic, CopC may be periplasmic, CopD is cytoplasmic/inner membrane, CopF is a P-type ATPase, and CopG, CopO, and CopK are likely copper chaperones. CopA, B, C, and D exhibit several potential copper ligands and CopS and CopR exhibit features of two-component regulatory systems. Sequences flanking indicate the AO22 cop locus may be present within a genomic island. Achromobacter sp. strain AO22 is thus an ideal candidate for understanding copper homeostasis mechanisms and exploiting them for copper biosensor or biosorption systems.

• ETRI Journal
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• 제21권1호
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• pp.1-27
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• 1999

We present a new description of envelope-function equation of the superlattice (SL). The SL wave function and corresponding effective-mass equation are formulated in terms of a linear combination of Bloch states of the constituent material with smaller band gap. In this envelope-function formalism, we review the fundamental concept on the motion of a wave packet in the SL structure subjected to steady and uniform electric fields F. The review confirms that the average of SL crystal momentums K = ($k_x,k_y,q$), where ($K_x,k_y$) are bulk inplane wave vectors and q SL wave vector, included in a wave packet satisfies the equation of motion = $_0+Ft/h$; and that the velocity and acceleration theorems provide the same type of group velocity and definition of the effective mass tensor, respectively, as in the Bulk. Finally, Schlosser and Marcus's method for the band theory of metals has been by Altarelli to include the interface-matching condition in the variational calculation for the SL structure in the multi-band envelope-function approximation. We re-examine this procedure more thoroughly and present variational equations in both general and reduced forms for SLs, which agrees in form with the proposed envelope-function formalism. As an illustration of the application of the present work and also for a brief investigation of effects of band-parameter difference on the subband energy structure, we calculate by the proposed variational method energies of non-strained $GaAs/Al_{0.32}Ga_{0.68}As$ and strained $In_{0.63}Ga_{0.37}As/In_{0.73}Ga_{0.27}As_{0.58}P_{0.42}SLs$ with well/barrier widths of $60{\AA}/500{\AA}$ and 30${\AA}/30{\AA}$, respectively.

• STI Policy Review
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• 제3권2호
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• pp.152-171
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• 2012

In April 2001, many Japanese national institutes were reorganized as Independent Administrative Institutions (IAI) based on the General Act for Independent Administrative Institutions and the act for each institution. Under the Ministry of Education, Culture, Sports, Science and Technology (MEXT), the National Institute for Materials Science (NIMS) was established by the merger of the National Research Institute for Metals (NRIM) and the National Institute for Research in Inorganic Materials (NIRIM). One of the biggest changes was the expansion of autonomous administration. The nanotechnology and material R&D field was prioritized in the 2nd (2001-2005) and the 3rd (2006-2010) Science and Technology Basic Plans; subsequently, NIMS was assigned to take the initiative in nanotechnology as well as materials science. NIMS has proactively expanded research fields through the introduction of researchers from polymers, electronics, and biotechnology as well as member institutes of the World Materials Research Institute Forum (WMRIF). Globalization has been promoted through programs that include the International Center for Young Scientists (ICYS) and the International Center for Materials Nanoarchitectonics (MANA). The 4th Science and Technology Basic Plan (2011-2015) emphasizes outcomes-recovery and rebirth from the disaster, green innovation, and life innovation. The Midterm Plan for NIMS also follows it. R&D collaboration by multi-partners (that include industry, university, and GRI) should be strategically promoted where GRI are especially required to play a hub function for innovative R&D and open innovation. NIMS highlights are Tsukuba Innovation Arena (TIA) and the Nanotechnology Platform Project. On January 20, 2012, a new organization was decided on by the Japanese Government where several IAI from different science and technology areas will be merged to realize more effective R&D as well as administrative cost reductions. NIMS is also supposed to be merged with 4 other R&D IAI under MEXT by the end of 2013.

• Elastomers and Composites
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• 제58권1호
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• pp.44-56
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• 2023

Additive manufacturing (AM) or three-dimensional (3D) printing of metals has been drawing significant attention due to its reliability, usefulness, and low cost with rapid prototyping. Among the various AM technologies, fused deposition modeling (FDM) or fused filament fabrication is receiving much interest because of its simple manufacturing processing, low material waste, and cost-effective equipment. FDM technology uses metal-filled polymer filaments for 3D printing, followed by debinding and sintering to fabricate complex metal parts. An efficient binder is essential for producing polymer filaments and the thermal post-processing of printed objects. This study involved an in-depth investigation of and a fabrication route for a novel multi-component binder system with steel alloy powder (45 vol.%) ranging from filament fabrication and 3D printing to debinding and sintering. The binder system consisted of polyvinyl pyrrolidone (PVP) as a binder and thermoplastic polyurethane (TPU) and polylactic acid (PLA) as a carrier. The PVP binder held the metal components tightly by maintaining their stoichiometry, and the TPU and PLA in the ratio of 9:1 provided flexibility, stiffness, and strength to the filament for 3D printing. The efficacy of the binder system was examined by fabricating 3D-printed cubic structures. The results revealed that the thermal debinding and sintering processes effectively removed the binder/carrier from the cubic structures, resulting in isotropic shrinkage of approximately 15.8% in all directions. The scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) patterns displayed the microstructure behavior, phase transition, and elemental composition of the 3D cubic structure.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• 대한환경공학회지
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• 제27권5호
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• pp.535-541
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• 2005

본 연구에서는 피트모스(Canadian Sphagnum peat moss)로부터 추출한 피트-휴민 (p-Humin)입자를 충전한 칼럼의 연속흐름 조건하에서의 중금속 이온(Cd, Cu, Pb)의 흡착 및 탈착효율을 조사하였다. p-Humin 충전 칼럼은 단일 성분 및 혼합 중금속 용액 모두에서 높은 중금속 제거효율을 보였으며, 실험 결과는 Thomas 모델식을 적용하여 p-Humin의 중금속 흡착특성에 대한 기초 자료를 산출하였다. 단일 성분 중금속 용액을 대상으로 한 실험 결과, p-Humin 단위 그램당 Cd, Cu 및 Pb의 최대 흡착량($q_0$)은 각각 138.8, 44.66 및 41.61 mg/g으로 나타났다. 혼합 중금속 용액을 대상으로 각 중금속 이온의 경쟁흡착 반응실험 결과, p-Humin에 대한 중금속 이온의 친화력 세기는 Pb $\gg$ Cu > Cd이었다. 흡착된 금속이온은 0.05 N $HNO_3$ 용액을 사용하여 쉽게 탈착시켜 회수할 수 있었으며, 회수율은 약 95% 이상을 나타냈다. 본 연구를 통해 p-Humin은 친환경적이고 경제적인 생흡착제로서 폐수 중 중금속 이온의 제거에 활용 가능함을 확인하였다.