• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.3
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• pp.188-192
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• 2018

In this study, we fabricated an $NO_X$ gas sensor using a composite film of multi-walled carbon nanotubes (MWCNT)/zinc oxide (ZnO). Carbon nanotubes (CNTs) show good electronic conductivity and chemical-stability, and zinc oxide (ZnO) is a wide band gap semiconductor with a large exciton binding energy. Gas sensors require characteristics such as high speed, sensitivity, and selectivity. The fabricated gas sensor was used to detect $NO_X$ gas at different $NO_X$ concentrations. The sensitivity of the gas sensor increased with increasing gas concentrations. Additionally, while changing the temperature inside the chamber containing the MWCNT/ZnO gas sensor, we obtained the sensitivity and normalized responses for detecting $NO_X$ gas in comparison to ZnO and MWCNT film gas sensors. From the experimental results, we confirmed that the gas sensor sensing mechanism was enhanced in the composite-film gas-sensor and that the electronic interaction between MWCNT and ZnO contributed to the improved sensor performance.

• Transactions of Materials Processing
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• v.28 no.3
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• pp.135-144
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• 2019

Electromagnetic impulse welding (EMIW) is a type of solid state welding using the Lorentz force generated by interaction between the magnetic field of the coil and the current induced in the workpiece. Although many experimental studies have been investigated on the expansion and compression welding of tube using the EMIW process, studies on the EMIW process of lap joint between flat sheets are uncommon. Since the magnetic field enveloped inside the tube can be controlled with ease, the electromagnetic technique has been widely used for tube welding. Conversely, it is difficult to control the magnetic field in the flat sheet welding so as to obtain the required welding velocity. The current study analyzed the effects of coil shape on the impulse velocity for suitable flat one-turn coil for the EMIW of the flat sheets. The finite element (FE) multi-physics simulation involving magnetic and structural field of EMIW were conducted with the commercial software LS-DYNA to evaluate the several shape variables, viz., influence of various widths, thicknesses, gaps and standoff distances of the flat one-turn coil on the impulse velocity. To obtain maximum impulse velocity, the flat one-turn coil was designed based on the FE simulation results. The experiments were performed using an aluminum alloy 1050 sheets of 1.0mm thickness using the designed flat one-turn coil. Through the microscopic interfacial analysis of the welded specimens, the interfacial connectivity was observed to have no defects. In addition, the single lap joint tests were performed to evaluate the welding strength, and a fracture occurred in the base material. As a result, a flat one-turn coil was successfully designed to guarantee welding with bond strength equal to or greater than the base material strength.

• Journal of radiological science and technology
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• v.31 no.3
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• pp.287-292
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• 2008

Position information of radiation interactions in detection material is essential to reconstruct a radiation source image. With most position sensing techniques, the position information of a single interaction inside the detectors can be precisely obtained. Each interaction position of multi-scattering inside scintillators, however, can not be individually measured and only the average of the scattering positions can be obtained, which causes the uncertainty in the measured interaction position. In this paper, the position uncertainties due to the multi-scattering were calculated by Monte Carlo simulation. The simulation model was a 50 by 50 by 5 mm $LaCl_3$(Ce) scintillator(pixel size is 2 by 2 by 5mm) which was utilized for the dual collimation camera. The dual collimation camera uses the information from both photoelectric effect and Compton scattering, and therefore, position uncertainties for both partial and full energy deposition of radiation interactions are calculated. In the case of partial energy deposition(PED), the standard deviations of positions are less than $1{\sim}2mm$, which means the uncertainty caused by multi-scattering is not significant. Because the effect of the multi-scattering with PED is insignificant, the multi-scattering has little effect on the performance of Compton imaging of dual collimation camera. In the case of full energy deposition(FED), however, the standard deviation of the positions is about twice that of the pixel size of the 1stdetector, except for 122keV incident radiations. Therefore, the standard deviations caused by multi-scatterings should be considered in the design of the coded mask of the dual collimation camera to avoid artifact on the reconstructed image. The position uncertainties of the FEDs are much larger than those of the PEDs for all radiation energies and the ratio of PEDs to FEDs increases when the incident radiation energy increases. The position uncertainties of both PEDs and FEDs are dependent on the incident radiation energy.

• Investigative Magnetic Resonance Imaging
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• v.3 no.2
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• pp.179-187
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• 1999

Purpose : This paper introduces a computationally inexpensive context-dependent classification of multi-echo MRI with Bayes compound decision model. In order to produce accurate region segmentation especially in homogeneous area and along boundaries of the regions, we propose a classification method that uses contextual information of local enighborhood system in the image. Material and Methods : The performance of the context free classifier over a statistically heterogeneous image can be improved if the local stationary regions in the image are disassociated from each other through the mechanism of the interaction parameters defined at he local neighborhood level. In order to improve the classification accuracy, we use the contextual information which resolves ambiguities in the class assignment of a pattern based on the labels of the neighboring patterns in classifying the image. Since the data immediately surrounding a given pixel is intimately associated with this given pixel., then if the true nature of the surrounding pixel is known this can be used to extract the true nature of the given pixel. The proposed context-dependent compound decision model uses the compound Bayes decision rule with the contextual information. As for the contextual information in the model, the directional transition probabilities estimated from the local neighborhood system are used for the interaction parameters. Results : The context-dependent classification paradigm with compound Bayesian model for multi-echo MR images is developed. Compared to context free classification which does not consider contextual information, context-dependent classifier show improved classification results especially in homogeneous and along boundaries of regions since contextual information is used during the classification. Conclusion : We introduce a new paradigm to classify multi-echo MRI using clustering analysis and Bayesian compound decision model to improve the classification results.

• Analytical Science and Technology
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• v.30 no.1
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• pp.1-9
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• 2017

Starch is a mixture of amylose (AMY) and amylopectin (AMP) which are different in physical properties such as molar mass (M), rms radius ($R_g$) and hydrodynamic diameter ($d_H$). The rheological and functional properties of starch are influenced by various factors including the molecular size, molar mass distribution (MD) and the concentration ratio of AMY and AMP. It is also important to analyze proteinaceous material in starch as they affect the flavor and texture of food to which starch is added. In this study, asymmetrical flow field-flow fractionation (AF4) was employed for separation and quantitation of AMY and AMP in starches (Amaranth, potato, taros and quinoa). AF4 was coupled with a multi-angle light scattering (MALS) and a refractive index (RI) detector for determination of the absolute M, MD and molecular structure. It was found that AMP has the M and $R_g$ ranging $3.7{\times}10^7{\sim}6.5{\times}10^8g/mol$ and 84 ~ 250 nm, respectively. Also the existence of branch was confirmed in higher M. In addition, proteinaceous material in starch was analyzed by AF4 coupled with a fluorescence detector (FS) after fluorescence-labeling. AF4-FS with fluorescence-labelling showed a potential for investigation on existence of proteinaceous material and the interaction between proteinaceous material and polysaccharide in starch.

• Explosives and Blasting
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• v.37 no.3
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• pp.13-24
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• 2019

This paper was prepared to investigate the behavior of fragments in underwater torpedo explosion beneath a frigate or surface ship by using an explicit finite element analysis. In this study, a fluid-structure interaction (FSI) methodology, called the multi-material arbitrary Lagrangian-Eulerian (MM-ALE) approach in LS-DYNA, was employed to obtain the responses of the torpedo fragments and frigate hull to the explosion. The Euler models for the analysis were comprised of air, water, and explosive, while the Lagrange models consisted of the fragment and the hull. The focus of this modeling was to examine whether a worst-case fragment could penetrate the frigate hull located close (4.5 m) to the exploding torpedo. The simulation was performed in two separate steps. At first, with the assumption that the expanding skin of the torpedo had been torn apart by consuming 30% of the explosive energy, the initial velocity of the worst-case fragment was sought based on a well-known experimental result concerning the fragment velocity in underwater bomb explosion. Then, the terminal velocity of the worst-case fragment that is expected to occur before the fragment hit the frigate hull was sought in the second step. Under the given conditions, the possible initial velocities of the worst-case fragment were found to be very fast (400 and 1000 m/s). But, the velocity difference between the fragment and the hull was merely 4 m/s at the instant of collision. This result was likely to be due to both the tremendous drag force exerted by the water and the non-failure condition given to the frigate hull. Anyway, at least under the given conditions, it is thought that the worst-case fragment seldom penetrate the frigate hull because there is no significant velocity difference between them.

• Transactions on Electrical and Electronic Materials
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• v.12 no.2
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• pp.56-59
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• 2011

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.2
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• pp.223-229
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• 2024

Laser-induced plasmonic sintering of metal nanoparticles (NPs) holds significant promise as a technology for producing flexible conducting electrodes. This method offers immediate, straightforward, and scalable manufacturing approaches, eliminating the need for expensive facilities and intricate processes. Nevertheless, the metal NPs come at a high cost due to the intricate synthesis procedures required to ensure long-term reliability in terms of chemical stability and the prevention of NP aggregation. Herein, we induced the self-generation of metal nanoparticles from Ag organometallic ink, and fabricated highly conductive electrodes on flexible substrates through laser-assisted plasmonic annealing. To demonstrate the practicality of the fabricated flexible electrode, it was configured in a mesh pattern, realizing multi-touchable flexible touch screen panel.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.