• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.341-344
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• 2000

Several new via structures in printed circuit boards are proposed, fabricated and characterized in RF regime. The new structure with a larger inductance component in the bottom layer shows 3㏈ improvement over the conventional structure. The ADS simulation with model parameters extracted from 3D fie]d solver matches with the characterization of these vias

• 한국항공우주학회지
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• 제49권8호
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• pp.661-669
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• 2021

종래 우주용 전장품 개발과정에서는 발사진동환경에 대한 탑재 전자소자 솔더 접합부의 피로수명 보장을 위해 기판 상에 보강재를 적용하여 강성을 증가시킴으로써 기판의 동적거동을 최소화하였다. 그러나 종래의 설계는 전장품의 부피 및 무게의 증가를 야기하여 소형/경량화 설계에 한계를 갖는다. 선행 연구에서 제안된 점탄성 테이프 기반 고댐핑 적층형 전자기판은 굽힘변위 저감을 통한 소자의 피로수명 연장에 효과적임을 입증하였으나 고댐핑 부여를 위한 적층구조가 기판에 직접 장착되는 관계로 소자 실장 공간의 효율이 저하되는 한계를 지닌다. 본 연구에서는 전장품 소형/경량/고집적화 설계 구현을 위해 일반 금속 대비 높은 댐핑과 복원 특성을 갖는 초탄성 형상기억합금에 점탄성 테이프를 적용한 적층구조의 초탄성 형상기억합금 보강재 기반 고댐핑 전자기판을 제안하였다. 제안 기판의 기본특성 파악을 위해 정하중시험 및 자유진동시험을 수행하였으며, 랜덤진동시험을 통해 진동환경 하 고댐핑 특성 및 설계 유효성을 입증하였다.

• Journal of Electrical Engineering and Technology
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• 제7권4호
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• pp.582-588
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• 2012

In this paper, a highly miniaturized and performed UWB bandpass filter has been newly designed and implemented by embedding all the passive elements into a multi-layered PCB substrate with high dielectric $SrTiO_3$ composite film for 3.1 - 4.75 GHz compact UWB system applications. The high dielectric composite film was utilized to increase the capacitance densities and quality factors of capacitors embedded into the PCB. In order to reduce the size of the filter and avoid parasitic EM coupling between the embedded filter circuit elements, it was designed by using a $3^{rd}$ order Chebyshev circuit topology and a capacitive coupled transformation technology. Independent transmission zeros were also applied for improving the attenuation of the filter at the desired stopbands. The measured insertion and return losses in the passband were better than 1.68 and 12 dB, with a minimum value of 0.78 dB. The transmission zeros of the measured response were occurred at 2.2 and 5.15 GHz resulting in excellent suppressions of 31 and 20 dB at WLAN bands of 2.4 and 5.15 GHz, respectively. The size of the fabricated bandpass filter was $2.9{\times}2.8{\times}0.55(H)mm^3$.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.183-190
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• 2007

It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.321-325
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• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.597-598
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• 2006

This paper describes a development of a new $1.4{\times}1.1$ and $2.0{\times}1.4mm$ RF SAW filters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• 정보통신설비학회논문지
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• 제4권1호
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• pp.31-36
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• 2005

In this paper, a planar type bandpass filter in multilayered PCB is presented. The multilayered PCB structure has some advantages on fabricating microwave devices such as the size reduction and ability of tight coupling by folding or embedding. The proposed BPF has two transmission zeros at the both sides of the center frequency by using independent electric and magnetic coupling structure. The designed BPF with four layer teflon PCBs of dielectric constant 2.94 has dimensions of 24x20x1.524 in mm, center frequency of 2.47GHz and bandwidth of about l00MHz. A good agrement is achieved between the measured result and the simulated one. The influences of air gaps between the layers are also analyzed and presented.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2002년도 춘계학술대회논문집
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• 한국전자파학회논문지
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• 제24권4호
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• pp.357-365
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• 2013

기판 집적 도파관(Substrate Integrated Waveguide: SIW) 기술을 이용한 Ka 밴드의 35 GHz용 $4{\times}4$ 평면 배열 안테나를 제시한다. 전체 안테나 구조는 3층의 PCB(Printed Circuit Board) 적층 형태로 구성되며, top PCB에는 45도로 기울어진 직렬 방사 슬롯이 평면 배열로 방사부를 이룬다. 또한, 균일한 전력을 전달하고 안테나 전체 단면적을 최소화하기 위해 middle 및 bottom PCB에는 급전 SIW가 위치한다. 전체 안테나 개구면의 면적은 $750.76mm^2$이며, 유전율 2.2의 RT/Duroid 5880 기판을 적층하여 설계하였다. 각 방사부 및 급전부의 개별적인 전기적 특성은 full-wave 시뮬레이터인 CST MWS를 이용하여 확인하였다. 나아가 제안된 평면 배열 안테나는 대역폭 (490 MHz), 최대 이득(18.02 dBi), 부엽 레벨(-11.0 dB), 교차 편파 레벨(-20.16 dB)의 전기적 특성을 보인다.

• 한국항행학회논문지
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• 제14권1호
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• pp.11-19
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• 2010

본 논문에서는 밀리미터파대역에서 동작하는 H면 여파기 결합 안테나를 제안하였다. 여파기 결합 안테나는 여파기가 안테나에 삽입된 형태이며 안테나의 반사손실을 줄이고 지향성을 높이기 위하여 다층의 유전체 렌즈가 결합되었다. 도파관 형태의 여파기와 안테나는 가상의 도체벽을 형성하는 via의 배열을 PCB기판에 구현함으로서 크기의 감소를 꾀하였으며 안테나와 여파기를 일반적인 도파관에서 설계한 후 PCB 기판에 축소하여 구현한 후 결합을 시도하였다. 유전체 렌즈의 두께를 조절하기위해 단층 및 다층의 유전체 기판을 사용하였으며 그 결과로 41.5 GHz의 중심주파수에서 8, 13.5 dBi의 시뮬레이션 이득을 각각 얻을 수 있었다.