• E2M - 전기 전자와 첨단 소재
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• 제9권6호
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• pp.600-604
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• 1996

High-T$_{c}$, superconducting wire is very important element for the application of electrical power systems. But it is very difficult to develope the long high T, wire with excellent properties. BiSrCaCuO multi-layer tapes are fabricated by a rolling method and pressing method sintered for several step at 840.deg. C. The critical current densities of 637 filament multi-layer tapes sintering 100 hours fabricated by the rolling method and pressing method are 1.3*10$^{4}$ A/cm$^{2}$ and 5.5*10$^{3}$ A/cm$^{2}$. The critical cur-rent densites of multi-layer tapes made by rolling method are found to be better than those fabricated by the powder-in-tube method and pressing process. As result, the rolling method is the best way to fabricated the multi-layer filament.t.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• 산업공학
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• 제11권1호
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• pp.191-197
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• 1998

This paper describes a machine vision algorithm for inspecting a crimpled terminal. The crimpled terminal is one of wire harness assemblies which transmit current or signals between a pair of electrical or electronic assemblies. The major defect considered is wire exposure on wire barrels. To detect the wire exposure, we develope a multi-layer perceptron in which three features extracted from the image of the crimpled terminal are used as input data. The three features are edginess, variance, and total number of valley points(TVP). The multi-layer neural network has been successfully tested on a number of real specimens collected from a wire-harness factory.

• 대한전자공학회논문지TC
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• 제41권12호
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• pp.131-137
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• 2004

본 논문에서는 등각사상 법을 이용해 유전체가 다층으로 코팅된 평행 2선식 전송선로의 특성임피던스 및 유효 유전상수 등을 계산하는 방법을 제안하였다. 먼저 두께 및 유전상수가 다른 유전체가 임의의 N 층으로 코팅되었을 때 평행 2선식 전송선로의 정전용량을 계산하였으며, 이를 이용해 임피던스 및 유효 유전상수 등을 계산하였다. Ansoft 사의 Maxwell 2D를 이용한 시뮬레이션 결과와 비교하였을 때, 계산 결과가 오차범위 4% 이내로 거의 일치함을 알 수 있었다.

• Current Photovoltaic Research
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• 제8권4호
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.295-301
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• 2002

In this paper, solenoid-type 3-D passives (inductors and transformers) have been designed, fabricated, and characterized by using electroplating techniques, wire bonding techniques, multi-layer thick photoresist, and low temperature processes which are compatible with semiconductor circuitry fabrication. Two different fabrication approaches are performed to develop the solenoid-type 3-D passives and relationship of performance characteristics and geometry is also deeply investigated such as windings, cross-sectional area of core, spacing between windings, and turn ratio. Fully integrated inductor has a quality factor of 31 at 6 GHz, an inductance of 2.7 nH, and a self resonant frequency of 15.8 GHz. Bonded wire inductor has a quality factor of 120, an inductance of 20 nH, and a self resonant frequency of 8 GHz. Integrated transformers with turn ratios of 1:1 and n:l have the minimum insertion loss of about 0.6 dB and the wide bandwidth of a few GHz.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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• pp.29-32
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• 2000

Superconducting transmission cable is one of interesting part in power application using high temperature super-conducting wire as transformance. One important parameter in HTS cable design is transport current distribution because it is related with current transmission capacity and loss. In this paper, we present the calculation theory of current distribution for multi-layer cable using the electric circuit model and in example, calculation results of current distribution and AC loss in each layer of 4-layer HTS transmission cable.

• KIEE International Transactions on Electrophysics and Applications
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• 제2C권6호
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• pp.309-313
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• 2002

In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

• 항공우주시스템공학회지
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• 제15권6호
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• pp.59-65
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• 2021

In this paper, the transmission characteristics of the multi-layered composite material with wire mesh and honeycomb core for aircraft applications have been analyzed with the proposed method. The proposed method converts the conductive wire mesh into effective layer, while for the dielectric honeycomb core, effective permittivity has been derived based on volume fraction with the proposed method. The proposed method has been verified through comparison with full-wave simulation and revealed excellent. In addition, the calculation time of the proposed method is a few order of magnitude faster in comparison with the full-wave simulation.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 B
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• pp.834-836
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• 2000

The round HTS wire is easier to handle than the rectangular HTS tape. This paper describes the coupling losses of the round HTS wires by finite element method. Effect of filament arrangement and filament size of the round HTS wire are considered. Three types of filaments arrangement, one and double layer radial filaments and Multi-filament, are considered. Calculation results show that coupling losses of the one layer filaments round HTS wire vary only a little with the direction of external magnetic field.