• Restorative Dentistry and Endodontics
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• v.46 no.3
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• pp.32.1-32.10
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• 2021

Objectives: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses. Materials and Methods: The 84 specimens (Filtek Z350 XT) were prepared, stored in distilled water for a week and thermocycled (5,000 cycles, 5℃ to 55℃). They were roughened using 400-grit sandpapers and etched with phosphoric acid. Then, specimens were equally divided into 2 groups; Single Bond Universal (SU) and Prime&Bond Universal (PB). Each group was subdivided into 3 subgroups according to application methods (n = 14); UC: 1 coat + uncuring, 1C: 1 coat + curing, 3C: 3 coats + curing. After storage of the repaired composite for 24 hours, specimens were subjected to the SBS test and the data were statistically analyzed by 2-way analysis of variance and independent t-tests. Specimens were examined with a stereomicroscope to analyze fracture mode and a scanning electron microscope to observe the interface. Results: Adhesive material was a significant factor (p = 0.001). Bond strengths with SU were higher than PB. The highest strength was obtained from the 1C group with SU. Bonding in multiple layers increased adhesive thicknesses, but there was no significant difference in SBS values (p = 0.255). Failure mode was predominantly cohesive in old composites. Conclusions: The application of an adequate bonding system plays an important role in repairing composite resin. SU showed higher SBS than PB and the additional layers increased the adhesive thickness without affecting SBS.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.45-49
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• 2023

CORC, which is being studied as one of the conductors for large currents, is manufactured by symmetrically arranging several strands of high-temperature superconducting wires on a cylindrical former. It allows current to flow evenly between wires and has the advantage of being manufactured in a multi-layer structure to increase current capacity. In order to apply CORC to AC power devices, it is necessary to review the material of the former, which is the frame around which the superconducting wire is wound. In the case of metal formers, they are difficult to apply because eddy currents are generated in the former, and they do not have the flexibility to be manufactured into coils by winding them with CORC. In this paper, we compare and analyze the magnetization loss caused by an external alternating magnetic field of Litz wire, which is being considered as a former material for CORC, with the results from formers made of other materials. In addition, we experimentally examine the effect of reducing magnetization loss due to an external magnetic field in CORC using a split wire made by dividing a high-temperature superconducting wire into two using an etching method, and in CORC made with a non-split wire.

• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.87-96
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• 2002

Outgassing from such sources as paints, coatings, adhesives and other non-metallic surfaces can contaminate satellites, especially second surface mirror and optical lens, it cause satellite to fail in own missions. The vacuum bake-out test using high temperature(more than $85 ^{\circ}C$)and high vacuum(less than $5.0{\times}1-^{-3}$ Pa) certify that the components of satellite work properly and can survive and operate in space environment like high vacuum. In the bake-out chamber installed at SITC of KARI, Rotary vacuum pump and Booster pump produce low vacuum of 5.0 Pa, and then two cryopumps produce high vacuum of below $5.0{\times}10^{-3}$ Pa. Also 48 ceramic heaters were provided to simulate high temperature. During the vacuum bake-out test, we detected contaminants using RGA(Residual Gas Analyzer) and measure the outgassing rate of the contaminant using the TQCM(Thermoelectric Quartz Crystal Microbalance). Also, IR/UV Spectrometer and witness plate be used to certify that the components were suitable for the spacecraft. This paper includes the preparation and procedures of the bake-out test for SAR(Solar Array Regulator) and MLI(Multi Layer Insulator), which were the components of the spacecraft. Especially, we discussed the methods and results of the contamination measurement. In the bake-out for SAR, the contamination was measured continuously although it was on the decrease from TQCM results. And RCA established that it is a highly polymerized compound. In the MLI bake-out using RGA and witness plate, we didn't detect any contamination materials.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of Welding and Joining
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• v.28 no.5
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• pp.51-57
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• 2010

Brittle microstructure created in a heat affected zone (HAZ) during the welding of low alloy steel can be eliminated by post-weld heat treatment (PWHT). If the PWHT is not possible during a repair welding, the controlled bead depositions of multi-pass welding should be applied to obtain tempering effect on the HAZ without PWHT. In order to anticipate and control the tempering effect during the temper bead welding, the definition of temperature curve obtained from the analytical solution was suggested in this research. Because the analytical solution for heat flow is expressed as a mathematical equation of weld parameters, it may be effective in anticipating the effect of each weld parameter on the tempering in HAZ during the successive bead depositions. The reheating effect by the successive bead layer on the brittle coarse grained HAZ formed by earlier bead deposition was estimated by comparing the overlapped distance between the temperature curves in the HAZ. Three layered weld specimens of SA508 base metal with A52 filler were prepared by controlling heat input ratio between layers. The tempering effect anticipated by using the overlapped distance between the temperature curves was verified by measuring the micro-hardness distribution in the HAZ of prepared specimens. The temperature curve obtained from analytical solution was expected as a good tool to find optimal temper bead welding conditions.

• The Journal of the Korea Contents Association
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• v.10 no.1
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• pp.1-9
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• 2010

In this paper we present a shading technique for realistic rendering of the surfaces with irregular and complex textures using a single photograph. So far, most works have been using many photographs or special photographing equipment to render the surfaces with irregular and complex textures as well as dividing texture regions manually. We present an automatic selection method of the region segmentation techniques according to properties of materials. As our technique produces a reflectance model and the approximated Bidirectional Reflection Distribution Function(BRDF) parameters, it allows the recovery of the photometric properties of diffuse, specular, isotropic or anisotropic textured objects. Also it make it possible to present several synthetic images with novel lighting conditions and views.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.148-152
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• 2008

A new cost-effective atomic layer deposition (ALD) technique, known as Proximity-Scan ALD (PS-ALD) was developed and its benefits were demonstrated by depositing $Al_2O_3$ and $HfO_2$ thin films using TMA and TEMAHf, respectively, as precursors. The system is consisted of two separate injectors for precursors and reactants that are placed near a heated substrate at a proximity of less than 1 cm. The bell-shaped injector chamber separated but close to the substrate forms a local chamber, maintaining higher pressure compared to the rest of chamber. Therefore, a system configuration with a rotating substrate gives the typical sequential deposition process of ALD under a continuous source flow without the need for gas switching. As the pressure required for the deposition is achieved in a small local volume, the need for an expensive metal organic (MO) source is reduced by a factor of approximately 100 concerning the volume ratio of local to total chambers. Under an optimized deposition condition, the deposition rates of $Al_2O_3$ and $HfO_2$ were $1.3\;{\AA}/cycle$ and $0.75\;{\AA}/cycle$, respectively, with dielectric constants of 9.4 and 23. A relatively short cycle time ($5{\sim}10\;sec$) due to the lack of the time-consuming "purging and pumping" process and the capability of multi-wafer processing of the proposed technology offer a very high through-put in addition to a lower cost.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.5
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• pp.313-319
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• 2018

This study introduces a new investigation report on the microstructural and electrical property changes of $ZnO-Zn_2BiVO_6-Mn_3O_4$ (ZZMn), where 0.33 mol% of $Mn_3O_4$ and 0.5 mol% of $Zn_2BiVO_6$ were added to ZnO (99.17 mol%) as liquid phase sintering aids. $Zn_2BiVO_6$ contributes to the decrease of sintering temperatures by up to $800^{\circ}C$, and segregates its particles at the grain boundary, while $Mn_3O_4$ enhances ${\alpha}$, the nonlinear coefficient, of varistor properties up to ${\alpha}=62$. In comparison, when the sintering temperature is increased from $800^{\circ}C$ to $1,000^{\circ}C$, the resistivity of ZnO grains decreases from $0.34{\Omega}cm$ to $0.16{\Omega}cm$, and the varistor property degrades. Oxygen vacancy ($V_o^{\bullet}$) (P1, 0.33~0.36 eV) is formed as a dominant defect. Two different kinds of grain boundary activation energies of P2 (0.51~0.70 eV) and P3 (0.70~0.93 eV) are formed according to different sintering temperatures, which are tentatively attributed to be $ZnO/Zn_2BiVO_6$-rich interface and ZnO/ZnO interface, respectively. Accordingly, this study introduces a progressive method of manufacturing ZnO chip varistors by way of sintering ZZMn-based varistor under $900^{\circ}C$. However, to procure a higher reliability, an in-depth study on the multi-component varistors with double-layer grain boundaries should be executed.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.