• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.2
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• pp.165-171
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• 2022

The SiO₂/TiO₂ multilayer thin films used for narrow band pass filter were fabricated using E-beam evaporation method. The narrow band pass filter was used to enhance the resolution of spectroscopy and sensor applications with near infrared (NIR) light source. The narrow band pass filter with multilayer thin films were designed with Essential Macleod program. The multilayers of SiO₂/TiO₂ with 32 layers were deposited on the silicon encapsulation of IR with peak wavelength (λ_p) of 660 nm and NIR LEDs with λ_p of 830 nm, 880 nm, and 955 nm. After NIR light passed through the narrow band pass filter, the full width of half maximum of 33.4~48.6 nm became narrow to 20~24 nm owing to the absorption of photons with short or long wavelength of designed band of 20 nm. The SiO₂/TiO₂ band pass filter fabricated in this study can be used for sensor, optoelectronics, and NIR spectroscopy applications.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.4 no.1
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• pp.31-36
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• 2005

In this paper, a planar type bandpass filter in multilayered PCB is presented. The multilayered PCB structure has some advantages on fabricating microwave devices such as the size reduction and ability of tight coupling by folding or embedding. The proposed BPF has two transmission zeros at the both sides of the center frequency by using independent electric and magnetic coupling structure. The designed BPF with four layer teflon PCBs of dielectric constant 2.94 has dimensions of 24x20x1.524 in mm, center frequency of 2.47GHz and bandwidth of about l00MHz. A good agrement is achieved between the measured result and the simulated one. The influences of air gaps between the layers are also analyzed and presented.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.5
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• pp.185-189
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• 2005

This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.740-743
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• 2003

A multi-layer ceramic (MLC) chip type band-pass filter (BPF) is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coulped stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The passband and attenuation pole depend on the coupling between resonators and coupling capacitance. The frequency characterics of the passband and attenuation pole are analyzed with the variation of the coupling between resonators and coupling capacitance. An equivanlent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the BPF is well acceptable for IMT-2000 application.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Proceedings of the Optical Society of Korea Conference
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• 1991.06a
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• pp.35-40
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• 1991

In this paper, a new adaptive learning algorithm, Training by Adaptive Gain (TAG) for optical implementation of large-sized neural networks has been developed and its electro-optical implementation for 2-dimensional input and output neurons has been demostrated. The 4-dimensional global fixed interconnections and 2-dimensional adaptive gain-controls are implemented by multi-facet computer generated holograms and LCTV spatial light modulators, respectively. When the input signals pass through optical system to the output classifying layer, the TAG adaptive learning algorithm is implemented by a personal computer. The system classifies three 5$\times$5 input patterns correctly.

• Journal of Welding and Joining
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• v.15 no.4
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• pp.70-77
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• 1997

Welding is one of the most important and popular joining techniques employed in structures. In spite of, weld designs depend on the rules and regulations. Moreover, the study to optimize a shape of welding joint not may be sufficient and systematic on the theoretical and experimental sides. Therefore, in this study, a computer program based on thermal elasto plastic theory is developed for optimizing(minimizing) shape of weld joints. By the results, study is made on the characteristics of the distributions of welding residual stresses and plastic strains, and their production mechanisms. Also, Various kinds of tests are carried out to find out mechanical characteristics due to shape of weld joints. As a result of this optimization(minimization) of weld joints, the productivity and the reliability will be improved.

• Journal of Welding and Joining
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• v.13 no.1
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• pp.138-144
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• 1995

Recently, as the industrial structure tends to become large, the thickness of structural plate becomes thicker. Therefore, the thicker the plate of welded structure is, the larger the shape of welded joint. The effect of large heat input makes large heat affected zone(HAZ). These bring to complict welding residual stress and to weaken material, which may cause extremely harm to the safety of structures. Nevertheless, welding is design is regulated by the KS, JIS or standard in the resister of shipping such as KR, ABS or LR. However, these rules are based on rather experimental than theoretical. In this study, the computer program of heat conduction, considering un-steady state and quasi-steady state, is developed for optimizing(minimizing) a shape of welded joint. The characteristics of heat on the welded joints with various shapes are clarified by the results of the analyses.

• Journal of Power System Engineering
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• v.18 no.4
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• pp.85-90
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• 2014

In this paper, the transient thermal and residual stress analysis of the welding of 9% Ni steel plates using the FEA software ABAQUS are presented. The 9% Ni steel plates are welded manually with welding consumables of 70% Ni based Inconel type super-alloys (YAWATA WELD B (M)), producing a multi-pass/multi-layer butt weld. For these materials, temperature dependant mechanical and thermal material properties are used in the analysis. The back gouging is considered in welding process simulation. The FE thermal results are validated by comparing the real fusion profile and heat affected zone (HAZ). In addition, the continuous indentation test was conducted to measure the strength of base metal, HAZ and weld metal.