• Journal of Semiconductor Engineering
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• v.1 no.1
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• pp.57-63
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• 2020

Complementary metal-oxide-semiconductor (CMOS) technology is now facing a power scaling limit to increase integration density. Since 1970s, multi-valued logic (MVL) has been considered as promising alternative to resolve power scaling challenge for increasing information density up to peta-scale level by reducing the system complexity. Over the past several decades, however, a power-scalable and mass-producible MVL technology has been absent so that MVL circuit and system implementation have been delayed. Recently, compact MVL device researches incorporating multiple-switching characteristics in a single device such as 2D heterojunction-based negative-differential resistance (NDR)/transconductance (NDT) devices and quantum-dot/superlattices-based constant intermediate current have been actively performed. Meanwhile, wafer-scale, energy-efficient and variation-tolerant ternary-CMOS (T-CMOS) technology has been demonstrated through commercial foundry. In this review paper, an overview for MVL development history including recent studies will be presented. Then, the status and its future research direction of MVL technology will be discussed focusing on the T-CMOS technology for peta-scale information processing in semiconductor chip.

• Journal of Aerospace System Engineering
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• v.11 no.6
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• pp.34-41
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• 2017

As an alternative of the existing honeycomb shock absorbing device, the new approach on shock absorbing design using the extrusion of hyper-viscoelastic material such as silicon rubber is studied in this paper. The strain energy and stress-strain characteristic of viscoelastic material at extrusion process through the metered orifice has a similarity with the honeycomb core for maximizing shock absorbing capability. And in order to evaluate the design feasibility of this device and to understand the shock absorbing mechanism of energy transformation, finite element analysis and quasi-static compression test of the multi-stage extrusion shock absorber are examined in this paper.

• Electrical & Electronic Materials
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• v.7 no.3
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• pp.231-235
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• 1994

The multi-dielectric layer $SiO_2$/$Si_3{N_4}$/$SiO_2$ (ONO) is used to improve charge retention and to scale down the memory device. The nitride layer of MNOS device is oxidize to form ONO system. During the oxidation of the nitride layer, the change of thickness of nitride layer and generation of interface state between nitride layer and top oxide layer occur. In this paper, effects of oxidation of the nitride layer is studied. The decreases of the nitride layer due to oxidation and trapping characteristics of interface state of multi layer dielectric film are investigated through the C-V measurement and F-N tunneling injection experiment using SONOS capacitor structure. Based on the experimental results, carrier trapping model for maximum flatband voltage shift of multi layer dielectric film is proposed and compared with experimental data. As a results of curve fitting, interface trap density between the top oxide and layer is determined as being $5{\times}10^11$~$2{\times}10^12$[$eV^1$$cm^2$].

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.6
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• pp.1025-1032
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• 2022

In this paper, the TDMA-based PoE wireless multi-IP camera transmission system using wireless communication technology is developed to reduce the burden of construction costs caused by the existing wired-based CCTV surveillance system and IP camera system. It intends to design and implement the long-distance wireless transmission technology of video. The transmission/reception prototype of the line IP transmission system and the wireless multi-IP camera transmission terminal and image acquisition device (SB-200) for the proposed related technology were described.

• Steel and Composite Structures
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• v.50 no.6
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• pp.721-734
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• 2024

In this research, the efficiency of a metallic energy dissipation device for seismic retrofit of an existing structure is evaluated by cyclic loading test. The proposed device, which is called multi-slit damper, is made of weak and strong slit dampers connected in series. Its energy dissipation mechanism consists of two stages: (i) yielding of the weak-slit damper under minor earthquakes; (ii) restraint of further deformations of the weak slit damper and activation of the strong slit damper under major earthquakes using a gap mechanism. A reinforced concrete (RC) frame with characteristics similar to soft-first-story structures is tested under cyclic loading before and after retrofit using the proposed device. The details of the experimental study are described and the test is simulated in an available commercial software to validate the analytical model of the damper. To further verify the applicability of the damper, it is applied to an analysis model of a 4-story structure with soft first story and its seismic performance is evaluated before and after retrofit. The experimental and analysis results show that the multi-slit damper is effective in controlling seismic response of structures.

• Industrial Engineering and Management Systems
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• v.12 no.4
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• pp.330-335
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• 2013

A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

• 한국HCI학회:학술대회논문집
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• 2009.02a
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• pp.646-649
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• 2009

최근 가정에서 사용되고 기기 중 원격제어기(Remote controller)로 제어가 가능한 기기가 늘어나고 있다. 이에 따라 여러 기기들이 있는 경우 사용자는 기기들을 동시 제어하려 할 때 제어하고자 하는 제어대상에 맞는 원격제어기를 찾기 위해 많은 시간을 소비하는 경우가 일반적이다. 이러한 불편함이 증가함에 따라 통합원격제어기(Universal remote controller)의 보급이 증가하고 있으나, 여전히 여러 기기를 동시제어하고자 할 경우 제어코드의 입력 등 복잡한 절차를 걸쳐 사용할 수 밖에 없으며, 이러한 점은 결국 통합원격제어기의 사용성을 현저히 약화시킨다. 본 고에서는 인간이 제어대상기기를 제어하고자 하는 의도를 원격제어기에 전달하는 여러 방법 중 인간이 물체를 인식하는 것과 동일한 메타포인 직관적인 '지시(Pointing)'법을 사용하여 실시간으로 다중기기를 통합 제어하는 방법, 즉 지시통합제어방법(Point and Control)에 대한 센서 및 하드웨어구조를 설명하고, 구동방식을 제안한다.

• Proceedings of the KIEE Conference
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• 2007.11c
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• pp.165-169
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• 2007

Organic EL has been expected to adopt to a new styles of technology that make flat display after Tang & Vanslyke made food electric luminescence device in late 1980s. Their studies based on multi layer structure that consists of emitting layer and carrier transporting layer using proper organic material. In this study we made multi layer device using $Eu(TTA)_3(phen)$ as a luminescence material by PVD and investigate luminous properties of each device. But oxidization of organic layer by ITO, energy walls in both pole interface, contaminations of ITO surface, importance of protecting membrane, diffusive dimming of light to cathode organic layer, these causes of degradations are common facts of a macromolecule and micromolecule. We think these degradation caused by the impact of heat and electro-chemical factor, bulk effect and interface phenomenon, and raise a question.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.972-975
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• 2002

Electroluminescence(EL) devices based on organic thin layers have attracted lot of interests because of their application as display. One of the problems is red material. It offered a short life and poor emission efficiency to boot. In this study, this problem can be solved by using a multi-layer device structure. Organic electroluminescent devices which are composed of organic thin multi-layer films are fabricated. The basic structure is ITO / Emitting layer / LiP / Al EL device in which Hole transport/Electron blocking PVK layer was blending. We demonstrate the enhancement of eletroluminescence (EL) from blends of poly(3-hexylthiophene) in poly(N-vinylcarvazole). The emitting layer is consisted of a host material(PVK) and a guest emitting material(P3HT). It was showed higher EL intensity and their electro-optical properties were investigated.

• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.84-86
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• 2018

Active hybrid solid state transformer(AHSST) is newly emerging as a device to maintan the power quality of power distribution. AHSST has a simple structure in which a power electronics device is connected in series to a conventional distribution transformer. The connected power electronics device maintains the constant voltage regardless of the primary grid voltage fluctuation through the secondary voltage control to improve the power quality. It also has a simple structure compare to conventional solid state transformer system and can achieve the same performance with fractionally-rated converter. This paper proposes an multi-level converter based on AHSST system that has a simpler control method and wider voltage control range than the conventional AHSST. The proposed system is verified by simulations.