• Journal of IKEEE
• /
• v.22 no.1
• /
• pp.189-192
• /
• 2018

This study focused on the development of simulation methodology and design optimization for the DBR(Distributed Bragg Reflectors) structures, which are commonly used in manufacturing optical films and the key components of LED chip and LCD inspection equipments. From the multi-layer simulation, the following results are obtained. First, the wavelength(nm) vs. reflectance(%) can be calculated in the DBR structures that $TiO_2$ and $SiO_2$ thin films are stacked alternately. As a results, it is suggested that highly efficient DBR structures can be designed and manufactured using simulation methodology.

• Design & Manufacturing
• /
• v.14 no.4
• /
• pp.58-64
• /
• 2020

Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.